Patent classifications
H05K7/20427
High-efficiency heat-dissipating paint composition using a carbon material
Provided is a heat-dissipating paint composition using a carbon material, the heat-dissipating paint composition including a dispersion solution containing a surface treated carbon material, a heat resistance additive, and an adhesion improving emulsion, so that the heat-dissipating paint composition can have excellent heat dissipation performance and can be applied to various industrial field requiring temperature control.
Self-assembly coating material, heat sink and method of forming heat sink
A self-assembly coating material including carbon particles and polymer shells is provided. The polymer shells respectively cover and are bonded to the carbon particles, wherein each polymer shell has both a first functional group for adsorbing on a surface of a substrate and a second functional group for self cross-linking. The first functional groups include thiol groups. The second functional groups include epoxy groups or carboxylic groups. The self-assembly coating material can be applied to a metal substrate to form a heat dissipation layer.
Power semiconductor module and power module
An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided. An insulation layer 700 is provided between a power semiconductor module 302 and a heat dissipation portion 307B. The power semiconductor module 302 includes a resin sealer 348, which covers a circumferential side surface of a conductor plate 315, and a plurality of recesses 348D are provided in the resin sealer 348. The insulation layer 700 is formed of a spray coated film 710, an insulation film 720, and a resin layer 730, and the spray coated film 710 is formed on the surface of the resin sealer 348 including recesses 348D to form a seamless flat surface. The planar size of each of the recesses 348D is greater than the planar size of each flat portion 711, which forms the spray coated film 710.
COPPER-DIAMOND COMPOSITE, HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE
A copper-diamond composite according to the present invention includes diamond particles that are dispersed in a metal matrix containing copper, in which when a 50% area mean diameter of single-crystal particles of the copper in the metal matrix is represented by A.sub.50, A.sub.50 is 1 m or more and 10 m or less, the 50% area mean diameter being obtained by electron backscatter diffraction.
Structure with color-changing housing
An electrical device capable of emitting or absorbs energy relative a surrounding environment. The electrical device includes a housing, an interior volume defined in the housing, an energy sensor at least partially exposed to the surrounding environment, a first material having a first absorptivity, and a second material having a second absorptivity lower than the first absorptivity. The first material is nearer to the surrounding environment than the second material is at an energy sensor reading below a threshold energy range, and the first material is farther from the surrounding environment than the second material is at an energy sensor reading above the threshold energy range.
OPEN TOP CAGE RECEPTACLE ASSEMBLY
Apparatuses and associated methods of manufacturing are described that provide a cage receptacle assembly configured to receive a cable connector. The cage receptacle assembly includes a cage body defining a first end and a second end. The cage body includes a top cage member attached to a bottom cage member via two side portions, and the top cage member defines an opening. The cage receptacle assembly defines a heat dissipation unit disposed within the opening of the top cage member, allowing heat to be transferred from the cable connector to an external environment of the cage receptacle assembly.
Automation Assembly with a Housing
An automation assembly with a housing includes a printed-circuit board in parallel between the left side and a right side of the housing, and lower and uppers sides that are at least partly formed as ventilation grilles to provide convection cooling within the housing, wherein a housing wall of the left and right sides each have a screening layer (AS) that has a first material layer and a second material layer, the first material layer is formed as a barrier layer that reflects thermal radiation, the second material layer is formed as a permeable layer that absorbs thermal radiation and only partly reflects it, and where the screening layer is arranged in the housing walls such that the barrier layer is arranged in the direction of an outer side of the housing and the permeable layer is arranged in the direction of an inner side of the housing.
Thermal radiation heat dissipation device for electronic component and preparation method thereof
A thermal radiation heat dissipation device for an electronic component includes a heat dissipation substrate including a heat dissipation surface having a heat dissipation surface emissivity; and an emissivity modulation layer disposed on the heat dissipation surface including an emissivity modulation layer surface having an emissivity modulation layer surface emissivity. The emissivity modulation layer surface emissivity is greater the heat dissipation surface emissivity.
UNINTERRUPTIBLE COOLING SUPPLY
An uninterruptible cooling system includes a heat generating electronic component enshrouded by a first container, a heat exchanger enshrouded by a second container, and an Uninterruptible Cooling Supply (UCS). The uninterruptible cooling system further includes a heat exchange fluid and a fluid pump to circulate the heat exchange fluid through conduits fluidly connecting the first container, the second container, and the UCS. The UCS includes a radiator enshrouded by a casing and a heat transfer compound positioned in a space external to the radiator and internal to the casing. The heat transfer compound within the Uninterruptible Cooling Supply has a solid to liquid phase change threshold that is greater than the operating temperature of the heat exchange fluid downstream of the heat exchanger and less than the maximum temperature of the heat generating electronic component.
STRUCTURE WITH COLOR-CHANGING HOUSING
An electrical device capable of emitting or absorbs energy relative a surrounding environment. The electrical device includes a housing, an interior volume defined in the housing, an energy sensor at least partially exposed to the surrounding environment, a first material having a first absorptivity, and a second material having a second absorptivity lower than the first absorptivity. The first material is nearer to the surrounding environment than the second material is at an energy sensor reading below a threshold energy range, and the first material is farther from the surrounding environment than the second material is at an energy sensor reading above the threshold energy range.