A wireless LAN module as a composite module according to the present invention includes a first substrate 26 and a second substrate 28 that is so disposed as opposed to the other principal surface 48b of the first substrate 26. An external connector 66 for the connection with an electronic apparatus is mounted on one principal surface 48a of the first substrate 26. An electronic component device 76a is mounted on one principal surface of the second substrate 28 in a region opposing the external connector 66 sandwiching the first substrate 26 therebetween. A heat dissipation member 78 is disposed on a surface which is an opposite side to the mounting-surface of the electronic component device 76a.

A heat dissipation device, which is used in a wireless transmission system including an operating unit and a transmission unit, includes a case unit and a heat dissipation unit. The case unit includes a first case and a second case that cooperatively define a space therebetween for receiving the wireless transmission system. The first case is formed with multiple heat dissipation holes spatially communicating the space with the environment. The heat dissipation unit includes a first dissipation member made of metal and, a second heat dissipation member made of a non-metal material, and a third heat dissipation member connected to the first heat dissipation member and being exposed to the environment.

Systems and methods for cooling an Integrated Circuit (IC) are provided. In one embodiment, the system includes a vessel for holding a coolant in a liquid phase, where the IC is at least in part thermally coupled to the coolant to transfer heat generated by the IC to the coolant. The system also includes a controller for periodically increasing a heat flux supplied by the IC to the coolant followed by a reduction of the heat flux supplied by the IC to the coolant. Methods for controlling the operational parameters of the IC to periodically increasing and then decreasing the heat flux supplied by the IC to the coolant are also provided. A sensor may be used to sense a state of phase change of the coolant and which generates a signal that the controller uses to adjust the heat flux supplied by the IC.

A display device includes a display panel to display an image; a heat radiating member at a side portion of the display panel and including a first adhesive layer, a second adhesive layer, and a heat radiating layer between the first adhesive layer and the second adhesive layer; and a heat generating member overlapping the display panel and the heat radiating member when viewed in a plan view, and the heat radiating member includes a first area overlapping the heat generating member and a second area adjacent to the first area when viewed in a plan view, the first adhesive layer and the second adhesive layer are connected to each other through a plurality of through holes defined through the heat radiating layer, and the plurality of through holes includes a through hole in the second area.

A printed circuit board assembly (PCBA) may include a printed circuit board (PCB), a socket mechanically and electrically coupled to the PCB, and an integrated circuit package electrically coupled to the socket. The PCBA also may include a thermal cover comprising a thermally conductive material and a thermal strap thermally coupled to the thermal cover. The thermal cover may be thermally coupled to the integrated circuit package and mechanically urge the integrated circuit package in contact with the socket, and the thermal strap may include a thermally conductive material.

An electronic device for motor vehicles comprises a heat-conducting housing containing a printed circuit board and an element producing heat mounted on the printed circuit board. The housing comprises a housing base on which the printed circuit board is mounted and comprises a cover opposite to the housing base. A first heat-dissipating metal structure is mounted on the element producing heat, and a second heat-dissipating metal structure, formed as part of the cover of the housing and protruding into the housing, is coupled with the first heat-dissipating metal structure, in such a manner as to facilitate the dissipation of the thermal energy from the element producing heat towards the outside of the housing.

Disclosed herein is an enclosure including a housing for dissipating heat from first and second heat generating components located on first and second circuit boards, respectively. In the enclosure, a first heat sink plate and a second heat sink plate are spring biased apart from one another. A maximum spring biasing distance between the first heat sink plate and the second heat sink plate is greater than a distance between the interior side of the front wall and the interior side of the back wall of the housing.

A computer aquarium mounting structure includes an aquarium with water, wherein, a through hole is provided on the side wall of the aquarium, a motor case is installed on the outer wall of the aquarium, a computer motherboard is provided inside the motor case, a radiator is provided inside the aquarium, and the radiator is sealingly provided at the through hole, a CPU and/or a graphics card installed on the computer motherboard contact with the outside of the radiator. The disclosure can combine the aquarium with the computer organically, which can not only cool the computer through the aquarium, but also create a real sense of the desktop natural landscape. Moreover, it doesn't take up more space on the desktop, and doesn't make any noise because a fan will not be needed.

A shell structure includes a shell and a shielding cover. The shell has an accommodating space, the accommodating space has an inner wall, and the inner wall has a first buckling portion. The shielding cover is arranged in the accommodating space, the shielding cover has an outer wall, the outer wall corresponds to the inner wall, and the outer wall has a second buckling portion corresponding to the first buckling portion. The first buckling portion and the second buckling portion are buckled with each other to limit relative degrees of freedom of the shell and the shielding cover.

[Problem] To suppress the number of man-hours required to handle design changes accompanying a change in heat generation in an internal unit stored inside an electric device.

[Solution] The present invention includes: at least one internal unit, which is a heat generating body and has a prescribed cross-sectional external shape; at least one heat conduction unit, which is a good conductor of heat and has a prescribed cross-sectional external shape; and a device housing in which two or more of the internal unit and the heat conduction unit can be stored in a state of being adjacent to each other with the prescribed cross-sectional external shapes thereof overlapping each other, the device housing thermally connecting to the stored internal unit or the stored heat conduction unit.