A base station interface device including an interface board, which is located in a housing and determines an upper portion of a first surface as a first mounting location and an upper portion of a second surface opposite to the first surface as a second mounting location, including a relay connector wherein one end is exposed to the upper portion of the first surface and the other end is exposed to the upper portion of the second surface; a base station signal matching unit mounted on the first mounting location and including a first connector coupled to the one end of the relay connector; and a base station signal processing unit mounted on the second mounting location and including a second connector coupled to the other end of the relay connector.

An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

A system includes an enclosure having an air inlet end and an air outlet end, air movers positioned near the air outlet end, a first data connector positioned near the air outlet end between the air movers, a heat-generating electrical component positioned immediately between the data connector and the air inlet end, a first heat sink positioned immediately between at least one of the air movers and the air inlet end, and a first conductive pipe thermally coupled between the heat-generating electrical component and the first heat sink.

An electric cabinet with a heat dissipation system is provided. The electric cabinet includes an body and a plurality of electric boards amounted in rows and arranged vertically in the body. The heat dissipation system includes: an air inlet and an air outlet respectively located on a lower surface and a higher surface of the body; a fan having fan blades arranged horizontally amounted between two of the electric boards for guiding the air to flow from the air inlet to the air outlet; and a plurality of air-cooling devices, each is amounted on sides of the body and designated with cooling one of the electric boards, wherein at least one of the air-cooling devices is amounted to be higher than the horizontal blades of the fan.

Provided is an enclosure for encapsulating one or more printed circuit boards (PCBs) configured for having electronic devices mounted thereon. The enclosure includes a main chassis body including a bottom portion and an outer wall including connectable panels for encasing the main chassis body. The enclosure also includes a top portion configured for completing a seal between the main chassis body and the outer wall, wherein one of the PCBs forms one of the connectable panels.

A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

The invention relates to optimize the use of electronic cabinets in connector technology, using simplified internal connector technology and flexibility in adapting the external connector technology to the connectors of the cabling assemblies—electronic and/or optical connector technologies—and on the structurally. To this end, according to an embodiment, an overall box-shaped electronic cabinet (1) that is fitted with at least one detachable interconnection module (6a, 6b) is provided with a bottom wall (14) including a bottom card (4) connected to a set of electronic modules (5). The rear wall (14) is extended by edges (14a, 14b) provided with connectors (C1a, C1b) that are capable of being coupled to the connectors (C6a, C6b) that are arranged on a side surface (62a, 62b) of the detachable interconnection module (6a) (6b). Devices for closing and releasably locking the at least one detachable interconnection module (6a, 6b) are provided between a handle (8a, 8b) of an interconnection module (6; 6a, 6b) and the side wall (15, 16) of the cabinet (1).

A system for determining and displaying in a graphical user interface one or more of air temperature, pressure, or velocity in an information technology (IT) room including an IT equipment rack comprises a processor configured to receive an input comprising airflow resistance parameters through the rack, an IT equipment airflow parameter, a heat-dissipation parameter, an external pressure, and an external temperature, to run the input through a flow-network solver that solves for airflow velocities through at least one face of the rack and a rack air outflow temperature based on the input, provide an output including the airflow velocities and the rack air outflow temperature, and generate, based on the output, a display in a graphical user interface of the system illustrating one or more of air temperatures, air pressures, or airflow velocities within the IT room.

Disclosed are a method and an apparatus for controlling subrack fans. The method comprises: by installing multiple boards installed with high-power components in different areas of a subrack respectively, forming multiple heat dissipation air channels corresponding to the multiple boards respectively; installing a fan group comprising multiple heat dissipation fans on the subrack; dividing the fan group into multiple fan areas corresponding to the multiple heat dissipation air channels respectively, so that each fan area blows air to a corresponding board through a corresponding heat dissipation air channel; detecting temperature of each board and a rotating speed of a corresponding fan area in real time; adjusting the rotating speed of the fan area according to a detection result, so that the rotating speed of the fan area increases or decreases as the temperature of the corresponding board increases or decreases. Also disclosed is the apparatus for controlling subrack fans.

A module heatsink lifter for raising and lowering a heatsink enabling insertion and removal of a module includes a fixed base; a hinge connector of the fixed based coupled to the heatsink; and an actuator mechanism to raise and lower the heatsink through rotation about the hinge connector, wherein the actuator mechanism operates from a front faceplate based on push and pull movement to raise and lower the heatsink into a raised position and a lowered position. The heatsink includes a Thermal Interface Material (TIM) on a bottom portion which creates a thermal connection with the module when the heatsink is in the lowered position. The module can include a pluggable optical module.