A method for assembling a modular cooling system includes attaching a support manifold to a first rail of an equipment rack, the support manifold defining a coolant supply channel and a coolant return channel; and mounting a first cold plate to the support manifold including engaging a manifold supply connector with a plate supply connector in fluid communication, the manifold supply connector being connected in fluid communication with the coolant supply channel of the support manifold, the plate supply connector being connected in fluid communication with a cooling system disposed within the first cold plate.

An apparatus and method relating to a cooling adapter having a housing with at least one mounting aperture and including at least one cooling manifold comprising an inlet plenum having at least one inlet for entry of a cooling fluid, an outlet plenum having at least one outlet for exhausting the cooling fluid, and a plurality of channels disposed between the inlet channel and the outlet channel for allowing the cooling fluid to move therebetween.

A heat exchanger is described herein. Specifically, the heat exchanger contains plates configured to pass a heat transfer fluid therethrough. The plates are interconnected via features that are integrated into the plates. The heat exchanger also contains frames that are connected to the plates and configured to guide electrical components along an insertion axis such that heat generating surfaces of the electrical components are in contact with the plates on insertion. The heat exchanger is thereby configured to allow for reliable heat dissipation for a plurality of electrical components within a small space while allowing the electrical components to be easily installed and serviced.

Housing structure for PCI Express expansion electronic boards able to mechanically stabilize said PCI Express expansion electronic boards so as to guarantee the correct functioning, performance and integrity of the electric interconnection between them and the basic electronic board to which they are connected if there are mechanical stresses such as knocks or vibrations, in order to be able to use PCI Express expansion electronic boards in the automotive field, or in scenarios characterized by perturbations of the important mechanical type. The present invention also concerns an assembly method of the housing structure.

In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller.

A serving rack cooling device. The device includes a rack; an enclosure provided inside the rack; a module provided inside the enclosure; a main pipe provided in the rack; a branching tube connected to the main pipe; a cooling unit that cools a heat-generating component mounted on the module; a first connection tube that connects the branching tube with the cooling unit; and a plurality of module connection portions that are provided inside the enclosure and to which the module is connected. The enclosure can slide in a state in which the module is connected to the module connection portion, and the cooling unit and the branching tube are connected by the first connection tube.

An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.

According to one embodiment, a hybrid cooling system includes a cold plate that is arranged to mount on an IT component that is mounted on a piece of IT equipment, the cold plate is arranged to receive coolant via a supply line and to return warmed coolant via a return line, the warmed coolant is produced by the cold plate when the cold plate is in contact with the IT component and heat generated by the IT component is transferred into the coolant by the cold plate; a TEC element that is arranged to couple to the IT component; and a heat sink that includes a base that is arranged to couple to the TEC element and one or more fins, the TEC element is configured to transfer at least a portion of the heat generated by the IT component into the one or more fins of the heat sink.

A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

The system and method for cooling a card cage using a compact combination vacuum/dip brazed card cage with integral liquid cooling passages, wherein all surfaces of the card cage are used for cooling. The card cage cooling 3U circuit cards internally and non-standard boards mounted externally by heat sinking the non-standard boards to the external walls. Finned, internal liquid cooling passages being orificed to maintain a total pressure drop from a single system inlet to a single system outlet of no more than 5 psi.