The present invention is a modular, energy efficient structure for housing racks of computers specifically designed for mining Bitcoin assets. The fundamental principal towards an optimized mining facility design is to decrease electricity consumption as well as effective construction budget management, ensuring only appropriate business expenditures. The side benefits including improved stability of the facility computer network and electricity supply. The design concept is carried out through a cool/hot air segregation process, which results in controllable internal facilities temperatures, dust filtration and energy savings.

A thermal management system for a electronics cabinets having an electronics heat source therein. The thermal management system includes a first passive thermal device having an evaporator portion and a condenser portion. The thermal management system can also include a heat sink in contact with air inside the cabinet and in thermal contact with the evaporator portion of the first passive thermal device, wherein the heat sink is contained within the sealed cabinet. The condenser portion of the first passive thermal device can be in contact with a liquid to liquid heat exchanger.

A chassis includes a compute device and a liquid cooling enablement module. The compute device includes a processor, a cold plate, and first cold and hot liquid lines. The first cold liquid line directs cool liquid from a first cold liquid interconnect of the compute device to the cold plate. The first hot liquid line directs heated liquid from the cold plate to a first hot liquid interconnect of the compute device. The liquid cooling enablement module is a modular self-contained component, and includes a second cold liquid interconnect, and a second hot liquid interconnect. The second cold liquid interconnect directs the liquid from the liquid cooling enablement module to the first cold liquid line via the first cold liquid interconnect. The second hot liquid interconnect directs the liquid from the first hot liquid line to the liquid cooling enablement module via the first hot liquid interconnect.

A cabinet liquid cooling system is configured to dissipate heat of a cabinet. A flow allocation unit is installed on a single side of the cabinet, is located in space between a side wall of the cabinet and a mounting bar of the cabinet, and is provided with a liquid inlet and a liquid outlet. A liquid cooling system (LCS) control unit is installed at the bottom of the cabinet and cyclically supplies liquid to the flow allocation unit using the liquid inlet and the liquid outlet. A liquid supply branch includes a liquid delivery pipe and a liquid return pipe. A node pipe includes a liquid inlet pipe and a liquid outlet pipe. Both the liquid inlet pipe and the liquid outlet pipe are connected to the corresponding liquid delivery pipe and liquid return pipe using the quick male connector and the quick female connector.

An electronic assembly may include a chassis having electronic module mounting positions and respective electronic modules received in each electronic module mounting position. A respective retainer may be coupled between the chassis and each electronic module. Each retainer may include a retainer body coupled to the chassis, and a liquid coupling body carried by the retainer body and movable between retracted and extended positions permitting insertion and removal of the electronic module. The liquid coupling body may have a retainer liquid outlet and a retainer liquid inlet configured to engage a module liquid inlet and module liquid outlet, respectively, when moved from the retracted position to the extended position.

A chassis includes a compute device and a liquid cooling enablement module. The compute device includes a processor, a cold plate, and first cold and hot liquid lines. The first cold liquid line directs cool liquid from a first cold liquid interconnect of the compute device to the cold plate. The first hot liquid line directs heated liquid from the cold plate to a first hot liquid interconnect of the compute device. The liquid cooling enablement module is a modular self-contained component, and includes a second cold liquid interconnect, and a second hot liquid interconnect. The second cold liquid interconnect directs the liquid from the liquid cooling enablement module to the first cold liquid line via the first cold liquid interconnect. The second hot liquid interconnect directs the liquid from the first hot liquid line to the liquid cooling enablement module via the first hot liquid interconnect.

A cryptocurrency mining system and a cryptocurrency mining method are provided. The system includes a plurality of mining modules. Each mining module includes: a plurality of AntBoxes, each AntBox being a computational unit that houses a plurality of miners for cryptocurrency farming; a transformer configured to convert an input voltage to a working voltage to supply electric power to the plurality of AntBoxes; and a switchgear and a plurality of panelboards configured to connect the AntBoxes with the transformer. The plurality of mining modules has substantially same structure arrangement. The structure arrangement includes: configurations of the AntBoxes, the transformer, the switchgear, and the panelboards, and relative locations among the AntBoxes, the transformer, the switchgear, and the panelboards.

A cooling control apparatus for an electronic apparatus in which a plurality of electronic units to be cooled are housed, the cooling control apparatus includes a pump controller that controls a pump based on a detection value of a parameter indicating a flow rate of liquid refrigerant in one passage, among a plurality of passages, in a state in which the refrigerant for cooling the plurality of electronic units are discharged from the pump and is supplied to the plurality of passages via a supply manifold.

A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.

A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.