Embodiments of the invention provide a high density liquid cooling system including a rack, primary loop piping including a primary inlet, a primary outlet, a primary loop filter, and a primary bypass valve, and secondary loop piping including a secondary inlet, a secondary outlet, a first pump, a first filter downstream of the first pump, and a secondary bypass valve. The system includes a heat exchanger having a first side and a second side. When the primary bypass valve is open, at least a portion of the fluid in the primary loop piping flows through the primary inlet and the primary outlet without traversing the heat exchanger, and when the secondary bypass valve is open, at least a portion of the fluid in the secondary loop piping flows through the secondary inlet and the secondary outlet without traversing the heat exchanger.

A system for controlling the cooling of an electronic module is disclosed, the system including an electronic module extending in a first and a second direction, a cooling pipe structure and a leakage device. The cooling pipe structure is arranged to transfer a flow of cooling medium, so to cool the electronic module, wherein the cooling pipe structure further includes a muzzle extending outwardly from a circumferential portion of said cooling pipe structure and a coupling portion being mated with an open end of the muzzle wherein said leakage device includes a leak collecting means circumferentially enclosing a mating interface of the muzzle and the coupling portion, so to collect any leakage from the cooling pipe structure.

Embodiments of the invention provide a high density liquid cooling system and various monitoring and control methods. Some methods include calculating a heat transfer efficiency of a heat exchanger based on a temperature difference and calculating a total heat rejection value based on the heat transfer efficiency. Some methods include increasing a secondary flow rate in a secondary coolant loop as a maximum allowable pressure is approached to extend an operating time period and avoid thermal shut down of the high density liquid cooling system.

Methods, systems, and devices for managing a data processing system that provides computer implemented services are disclosed. To provide the computer implemented services, a system may include a chassis adapted to house hardware components of the data processing system. To dissipate heat generated by the hardware components, the system may further include a quick connection adapted to place the chassis in fluid communication with a manifold through which cooling fluid flows, and a disconnection mechanism adapted to disconnect the quick connection while the chassis is positioned at a first location in a rack, the quick connection being inaccessible while the chassis is at the first location.

Aspects of this disclosure relate to a computing cabinet for a computing system and to computing systems with one or more computing cabinets. The computing cabinet can include a power plane for power conversion, a compute plane, and a host plane. Computing cabinets disclosed herein can be modular and scalable. The computing cabinet can be configured such that components thereof can be hot swapped.