The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.

A method for changing an airflow direction of an air mover of an information handling system may include mechanically translating the air mover in a linear direction from a closed position relative to a chassis configured to enclose components of the information handling system in which the air mover is enclosed by the chassis to an open position in which the air mover is drawn from the chassis, via a pair of rails mechanically coupled between the air mover and the chassis. The method may also include mechanically rotating the air mover 180 degrees relative to the pair of rails about an axis generally perpendicular to the linear direction, via a base mechanically interfaced between the air mover and the pair of rails. The method may further include mechanically translating the air mover from the open position to the closed position via the rails.

An information handling system may include a chassis having a first region and a second region, wherein the first region includes a memory module, and wherein the second region includes a processing unit; at least one air mover configured to provide airflow; and an airflow shroud including an airflow baffle. When the airflow shroud is installed in the information handling system in a first orientation, the airflow baffle may be configured to block at least a portion of the airflow from flowing through the first region. When the airflow shroud is installed in the information handling system in a second orientation, the airflow baffle may be configured to block at least a portion of the airflow from flowing through the second region.

An information handling resource blank configured to populate a slot of an information handling system in lieu of an information handling resource may include a form factor having at least some features in common with that of the information handling resource and one or more false fans mechanically coupled to the form factor. Each of the one or more false fans may be configured to have a first airflow impedance when airflow through such false fan is below a threshold airflow and have a second airflow impedance when airflow through such false fan is above the threshold airflow.

A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.

A processing unit. The processing unit includes a printed circuit board (PCB) including a lidless integrated circuit, a heatsink, and a damper system. The heatsink is coupled to the PCB and in thermal communication with the lidless integrated circuit via a thermal interface material. The damper system is compressed between the PCB and the heatsink and surrounding the lidless integrated circuit to absorb a portion of kinetic energy imparted to the lidless integrated circuit by an impact to the processing unit.

Devices, systems, and methods for managing server chassis are disclosed. The server chassis may be managed thermally by controlling a flow of gas through an opening in the server chassis. The server chassis may be managed for security by controlling physical access to various portions of the server chassis, and, for example, to a portion of the server chassis proximate to an opening in the server chassis through which gas flows for thermal management purposes. The server chassis may also be managed electromagnetically by controlling a flow of electromagnetic radiation into and out of the server chassis and, for example, through an opening in the server chassis through which gas flows for thermal management purposes. The server chassis may also be managed structurally by physically reinforcing various portions of the server chassis.

An information handling system may include a chassis configured to house components of the information handling system and an air mover assembly comprising an enclosure, an air mover within the enclosure configured to drive airflow to cool one or more components of the information handling system, and a sensor within a path of the airflow and configured to detect a presence of matter harmful to one or more components of the information handling system.

Examples of the disclosure relate to a cooling system for cooling one or more electronic components. The cooling system comprises at least one two-phase cooling system configured to cool one or more electronic components that are thermally coupled to the at least one two-phase cooling system and at least one air-cooling system configured to cool one or more electronic components. The at least one air-cooling system comprises at least one heat exchanger within the at least one air-cooling system wherein the at least one heat exchanger is coupled to a two-phase cooling system or a liquid phase cooling system. The at least one air-cooling system also comprises recirculation means configured to re-circulate air through the at least one air-cooling system to the one or more electronic components.

A fan cage is at least adapted to a first fan and a second fan smaller than the first fan. The fan cage includes a cage body and an adjustment member. The cage body defines a first accommodation portion in a size fitting the first fan. The adjustment member is movably disposed on the cage body and switchable between a laid down status and an upright status within the first accommodation portion. When the adjustment member is in the upright status, the adjustment member is upright in the first accommodation portion so that the adjustment member and the cage body together define part of the first accommodation portion as a second accommodation portion in a size fitting the second fan.