H05K7/20727

ADHESIVE LAYERED BACKFLOW PREVENTER
20220061189 · 2022-02-24 ·

An adhesive layered backflow preventer laminate, for use in impeding airflow from flowing in a backflow direction through the backflow preventer and a corresponding cooling fan, includes a thin front support layer adhered to a thin backflow flap layer, having a plurality of backflow flaps, which is adhered to a thin rear support layer. Each of the structural layers is adhered to the adjacent structural layer using a respective double-sided adhesive layer, by way of a manufacturing process that avoids the use of costly injection molded parts and machined plastic parts and metal components such as springs and hinges.

MOVABLE PCIE MODULE AND SERVER CHASSIS SYSTEM

Described herein is a server that includes a server chassis having a front window for providing access to an interior receptacle of the server chassis. A docking station is located in the interior receptacle. The server also includes a PCIe module coupled to the docking station by a coupling element. The PCIe module protrudes externally from the interior receptacle through the front window in the docked position. The PCIe module can be moved to a plurality of undocked positions while remaining coupled to the docking station.

SYSTEMS AND METHODS FOR FAN PERFORMANCE-BASED SCALING OF THERMAL CONTROL PARAMETERS
20170303438 · 2017-10-19 · ·

In accordance with embodiments of the present disclosure, a system may include a cooling subsystem for cooling components of an information handling system and a thermal manager communicatively coupled to the cooling subsystem. The thermal manager may be configured to receive information regarding a reference performance metric for the cooling subsystem, based on the reference performance metric, modify at least one thermal control parameter for thermally controlling the information handling system from a baseline setting associated with a hardware configuration of the information handling system, and thermally control the information handling system in accordance with the at least one thermal control parameter as modified.

Changing air flow direction
11672104 · 2023-06-06 · ·

Embodiments of the present disclosure include systems and methods for controlling the direction of cooling air flow across components of an electronic devices. In one or more embodiments, a device or information handling system includes an air flow generator that is able to generate air flow in different directions by activation of a button, a controller, or both. In one or more embodiments, a sensor measures air temperatures of air when the air flows in different directions, and an air flow direction is selected using the air temperature measurements.

Server capable of accessing and rotating storage devices accommodated therein

A server capable of rotating and accessing storage devices accommodated therein includes a server chassis, a motherboard, a power supply module, two racks, and a system cooling module. The server chassis includes two side plates and an accommodating space between the two side plates. The power supply module is disposed in the accommodating space and arranged corresponding to the motherboard. The racks are arranged parallel to each other and detachably connected to the server chassis. A pivot structure and a handle for operating the rack are disposed at the rack near the motherboard. The rack is rotatable with respect to the server chassis by means of the pivot structure. The system cooling module is disposed adjacent to the rack. At least one cord passage is provided between the system cooling module and each of the side plates.

Computer server heat regulation utilizing integrated precision air flow
09795063 · 2017-10-17 · ·

Disclosed is system, method, and rack stand portion for the advantageous cooling of computer equipment 305. The rack stand 200 includes a hollow body 210, 212 that may be formed of cartridges 2416. Gas from an airflow source 5204 is guided into the rack stand body and then into a sealed case of the computer equipment. Air flow is then guided out of the computer equipment for recirculation, exhaust, or other purpose.

Electronics cooling assembly with multi-position, airflow-blocking mechanism

Electronics cooling assemblies are provided which include an air-cooled heat sink, an auxiliary air-moving device, and an airflow-blocking mechanism. The heat sink couples to one or more heat-generating electronic components, and dissipates heat from the electronic component(s) to a cooling airflow passing across the heat sink. The auxiliary air-moving device provides, when active, an increased flow rate of the cooling airflow across the heat sink. The airflow-blocking mechanism toggles between a passive airflow position and an active airflow position. In the passive airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the heat sink without passing through the air-moving device, and in the active airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the auxiliary air-moving device.

Expansion card mounting assembly

An expansion card mounting assembly includes a mounting structure and a circuit board coupled to the mounting structure. Expansion cards are mounted on a top side and a bottom side of the circuit board and secured at opposite ends by a moveable plate of the expansion card mounting assembly. The mounting structure includes an opening along a length of the expansion cards that allows air to flow over the expansion cards in multiple directions including a vertical direction. The moveable plate and mounting structure are configured to allow a position of the moveable plate on the mounting structure to be adjusted to mount expansion cards having different lengths in the expansion card mounting assembly.

Server system

A server system comprises a base, a front panel (13) arranged on the base and defining a collecting space; two doors (16) arranged on opposite sides of the base, and being perpendicular to the front panel; two storage cases (171) arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two first corridors are each defined between one of the doors and one of the storage case facing the one door; two circuit boards (18) arranged between the two storage cases, wherein the two circuit boards comprise a plurality of slits, wherein a second corridor is defined between the two circuit boards; a storage cover (121) disposed above the base over the two first corridors, the second corridor, the two storage cases, and the two circuit boards.

NORMALLY OPEN ANTI-RECIRCULATION SYSTEM
20170295673 · 2017-10-12 ·

A frame having a perimeter defines a planar opening. A set of louvers may span from a first edge of the opening to a second edge of the opening. Each louver may be capable of rotating between a closed position and an open position. A set of physical obstructions may prevent the louvers from rotating beyond the open position. Each louver may be offset from the planar opening by a first acute angle when in a closed position, and by a second, larger, acute angle when in the open position. A flow of air in a first direction through the opening may rotate the set of louvers to the closed position. A flow air in the opposite direction through the opening may rotate the set of louvers to the open position such that the flow of air in the opposite direction moves freely through the opening.