In one embodiment, an electronic cooling device includes an inlet port to receive cooling liquid from an external cooling liquid source. The cooling device further includes a base cooling unit having a first liquid distribution channel therein. The base cooling unit includes a cooling plate that forms a lower surface to be positioned on a top surface of one or more electronic devices to extract heat from the devices through the cooling plate using at least a portion of the cooling liquid from the external cooling liquid source. The cooling device further includes an upper cooling unit having a second liquid distribution channel to extract heat from air contacting the upper cooling unit using at least a portion of the cooling liquid received from the external cooling liquid source. The cooling device further includes an outlet port to return the cooling liquid to the external cooling liquid source. Internal fluid channel structural design can be used and customized for different applications and use cases.

The present invention aims at improving a cooling efficiency and a maintenance workability related to heat generating components in a storage subsystem. Therefore, the present invention provides multiple cooling fans configured to cool multiple components for operating the storage subsystem, a first wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a first component, a second wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a second component having a smaller heating value than the first heat generating component and having a low temperature, and a chassis configured to store the multiple components, the cooling fans and the first and second wind direction panels, wherein the second wind direction panel is configured to be integrated with a side wall of the chassis and detachable from the chassis.

A rack server housing including a housing bottom with opposite side panels and first through third cover elements. The first and second cover element each have one similar fastening recess and are fixed to the side panels. The two fastening recesses are arranged point-symmetrically to one another. The third cover element is insertable into the first and second cover elements in such a way that in a first state in each case one engagement element of the cover element is arranged in a respective fastening recess and the third cover element can be slid from the first state to a second state both along a first direction and a second direction opposite said first direction, so that the third cover element takes at least a form-fit connection to the first and the second cover element via the engagement elements.

A server device having a plurality of server modules and a plurality of cooling fans in a chassis includes: a management unit configured to control the server modules; and a temperature measurement part configured to perform measurement of temperatures of the server modules. The management unit is configured to decide a server module to run on a basis of a result of the measurement by the temperature measurement part.

An air mover assembly may include an air mover comprising a body and a cable extending from the body and one or more air mover holders mechanically coupled to the body. The one or more air mover holders may comprise a plurality of cable maintenance features and a keying feature. The plurality of cable maintenance features may include a first cable maintenance feature configured to maintain the cable in a first configuration of the air mover in a first airflow direction and a second cable maintenance feature configured to maintain the cable in a second configuration of the air mover in a second airflow direction. The keying feature may be configured to mechanically interface with an interfering feature of a chassis when an attempt is made to improperly insert the air mover into the chassis in accordance with a proper airflow direction configuration of the chassis, in order to prevent improper insertion of the air mover into the chassis in accordance with the proper airflow direction configuration of the chassis.

A server includes a case and function modules. The case includes a frame, a first upright partition and a second upright partition. The frame has an internal space and an opening. The opening corresponds to the internal space. The first upright partition and the second upright partition jointly define a first accommodating portion, a second accommodating portion and a third accommodating portion in the internal space. Each of the function modules is a first function module, a second function module or a third function module. A width of the first function module is half of the width of the second accommodating portion. The width of the first function module, a width of the second function module and a width of the third function module have a ratio of 1:2:4.

Embodiments may be generally direct to apparatuses, systems, method, and techniques to determine a configuration for a plurality of connectors, the configuration to associate a first interconnect protocol with a first subset of the plurality of connectors and a second interconnect protocol with a second subset of the plurality of connectors, the first interconnect protocol and the second interconnect protocol are different interconnect protocols and each comprising one of a serial link protocol, a coherent link protocol, and an accelerator link protocol, cause processing of data for communication via the first subset of the plurality of connectors in accordance with the first interconnect protocol, and cause processing of data for communication via the second subset of the plurality of connector in accordance with the second interconnect protocol.

A disclosed unit device: two first circuit boards provided apart from each other in a horizontal direction; heat generating components respectively provided on the two first circuit boards; two second circuit boards provided between the two first circuit boards, arranged to stand at a distance from each other, and each having an opening; and a fan provided between the two second circuit boards and configured to cool the heat generating components on the two first circuit boards by drawing air through the opening of one of the second circuit boards and by expelling the air through the opening of the other second circuit board.

Example implementations relate to virtualizing fan speed. For example, a system for virtualizing fan speed may include a server enclosure manager connected to a controller area network (CAN) bus, the server enclosure manager to regulate a speed of a fan in a server blade enclosure; and a CAN bus microcontroller connected to the CAN bus. The CAN bus microcontroller may receive a direct current (DC) voltage from an analog low-pass filter, determine a fan speed of the fan corresponding to the received DC voltage, and report the determined fan speed to the enclosure manager.

A component-level cooling system for cooling components in a chassis includes a fan in a housing positioned on a circuit board. The housing has a fan inlet on a side, a first fan outlet on one end and a second fan outlet on a second end opposite the first end. The first fan outlet may direct a first airflow in a first direction to a vent on a first panel of the chassis. The second fan outlet may direct a second airflow in a second direction opposite the first direction. A duct comprises a duct inlet for receiving the second airflow, an elbow for redirecting the second airflow in a third direction to avoid the second airflow from colliding with a main airflow to reduce acoustic noise, and a duct outlet located to avoid heated air exiting the duct from re-entering the fan inlet.