The present invention includes a lateral support member for a server computer constructed to permit advantageous airflow. The present invention can be operated to shunt organized airflow into multiple computer cases and/or organized airflow from multiple computer cases to a dedicated heat reservoir.

Described herein is a hybrid cooling device and a cooling method that use a combination of phase change cooling and air cooling. The hybrid cooling device includes a closed loop two phase system, one or more fans, and an assembly clamp. The two phase system further includes a cold plate, an integrated channel, and a radiator, and a pressure sensor. The cold plate can include phase change fluid for extracting heat from electronics on a printed circuit board sandwiched between the cold plate and the assembly clamp. The one or more fans can be used to create airflows for cooling both the cold plate and the radiator. The pressure sensor can be used to control the operation of the hybrid cooling device, which can be deployed in different system environments and server configurations.

Embodiments disclose a server chassis of an electronic rack. The server chassis includes a tray to contain one or more information technology (IT) components. The server chassis is stackable in a stack on an electronic rack, and where each server chassis is divisible into a top section and the bottom section in one design. The bottom section of the server includes the tray. The top section of the server chassis includes: a secured panel, the secured panel being secured to the server chassis, one or more frames adjustably attached to the secured panel, and one or more cooling units attachable to the one or more frames. The one or more cooling units to interface with the one or more IT components to cool the one or more IT components, where the one or more frames are relocatable to a different position on the secured panel.

A system includes a network element having a housing that is configured for front-to-rear airflow; and a cooling apparatus located adjacent to the network element and having a housing that forms a cavity that is closed by the housing of the network element, wherein the cooling apparatus includes one or more fan units that are accessible via front access and wherein the one or more fan units are configured to draw the front-to-rear airflow from the network element into the cavity. This enables a front-to-back airflow design with rear fan access to be converted into a front-to-back airflow design with front fan access.

A method for converting a computing device from a first configuration to a second configuration is provided. A power supply unit of the computing device is moved from a first location at a second end of the computing device to a second location at a first end of the computing device. The power supply unit is rotated such that a power interface of the power supply unit is visible from the first end of the computing device. A set of fans of the computing device is rotated such that airflow direction of the set of fans matches an airflow direction of the power supply unit at the second location. Converting the computing device from the first configuration to the second configuration can allow communication ports to be accessed from a front end or from a rear end of the computing device.

A contra-rotating fan system includes a fan chassis. A first fan in the fan chassis includes blades that provide airflow in a first direction when the first fan rotates in a second direction, and provide airflow in a third direction opposite the first direction when the first fan rotates in a fourth direction opposite the second direction. A second fan adjacent the first fan in the fan chassis includes the same number of blades as the first fan. The first fan and the second fan rotate at the same time in opposite directions. The blades on the second fan provide airflow in the first direction when the first fan rotates in the second direction and the second fan rotates in the fourth direction, and provides airflow in the third direction when the first fan rotates in the fourth direction and the second fan rotates in the second direction.

Disclosed are a PCB heat dissipation assembly (100) and a server having same. The PCB heat dissipation assembly (100) includes: a PCB board (1), a plurality of chips (11) being arranged on the PCB board (1); at least one heat sink (2), the heat sink (2) being arranged on the plurality of chips (11), and the heat sink (2) including a heat dissipation air duct (21); and an air baffle (3), the air baffle (3) being arranged adjacent to the at least one heat sink (2), the air baffle (3) being located on one side of the at least one heat sink (2), and the air baffle (3) extending along the heat dissipation air duct (21).

A rack arrangement for a data center includes at least one row of racks including a plurality of computer racks and an air handler rack. Each computer rack includes a computer rack frame including a housing unit for housing computer equipment. The air handler rack includes an air handler rack frame, a heat exchanger and at least one fan. The at least one fan is configured for pulling air into the air handler rack via an air inlet side and discharging air via an air outlet side of the air handler rack, directing air through the heat exchanger. An air inlet side of any one of the computer racks and the air outlet side of the air handler rack are on a cold aisle side of the at least one row of racks. At least one selected rack is stacked atop the air handler rack.

A system for removing heat from a computing device includes a carrier and one or more heat removal elements. The carrier includes a carrier surface having a carrier surface pattern. The carrier surface pattern includes coupling portions. The coupling portions of the carrier surface pattern selectively couple, at different locations on the pattern, the heat removal elements to the carrier. The heat removal elements conduct heat from heat producing components of the computing device to the carrier. The carrier conducts heat away from the heat removal elements.

A server device having a server module and a cooling fan in a chassis includes: a single management unit configured to control the server module and the cooling fan; and a monitoring unit configured to monitor the running status of the management unit. The monitoring unit is configured to execute thermal control of the inside of the chassis on the basis of the result of monitoring of the management unit.