A cooling apparatus includes: an evaporator in which a coolant is housed and that evaporates the coolant; a condenser that condenses the coolant evaporated by the evaporator; a pathway section that includes a vapor path and a liquid path each placing the inside of the evaporator and the inside of the condenser in communication with each other, and that circulates the coolant between the evaporator and the condenser; a valve that is provided to at least one path out of the vapor path or the liquid path; and a pressure regulation section that increases an opening amount of the valve according to an increase in pressure inside the evaporator.

Systems, methods and computer-readable media for reducing upstream preheat for high-density hard disk drive storage. A system can include first and second rows of storage devices installed in a storage rack, the first and second rows having a first distance between consecutive storage devices. The second row can be located behind the first row and farther away from a source of an airflow than the first row. The system can monitor a temperature associated with the second row and when the temperature rises above a threshold, the system can remove a storage device from the first row. The system can then adjust placement within the first row such that the remaining devices have a second, larger distance between each other to increase airflow to storage devices in the second row and reduce system impedance.

A server can be used for a cold storage application. The server can comprise a nest for holding a high density of bare storage drives, wherein the nest comprises a plurality of drive cooling channels residing on the underside of the nest. The server can further comprise rear, front, and side air flow paths for natural convection cooling.

A method that includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.

A semiconductor component system includes a motherboard and a cooling system mounted to the motherboard. The cooling system includes sidewalls projecting from the motherboard. A sub-motherboard extends between the sidewalls and is spaced apart from the motherboard. The sidewalls and the sub-motherboard define a cooling channel over the motherboard. A connector is attached to the sub-motherboard and is configured to receive a semiconductor device daughterboard. The connector has contacts to electrically couple the semiconductor device daughterboard to the sub-motherboard.

The front of a rack-mounted 2 RU (Rack Unit) chassis includes bays that receive replaceable components, such as storage drives. Two rear slots of such chassis each receive hot-swappable 1 RU servers that couple to a midplane of the chassis. When a server is removed from its slot while the server in the other slot remains operational, the airflow output of the operational server escapes via the empty slot rather than cooling the components in the front-facing bays. Embodiments provide a single-blade air damper that blocks airflow via an empty chassis slot. The single-blade air damper is connected to spring assemblies on both chassis sidewalls. The spring assemblies are maintained in unstable states when servers are installed in both slots of the chassis. Upon a server being removed from a slot, the spring assemblies transition to stable states that position the single-blade air damper to block airflow via the empty slot.

Described herein are example riser modules for holding electrical components such as PCIe cards. The riser modules include a riser bracket and an opening to an interior space of the riser bracket. The riser modules also include an air duct movably coupled to the riser bracket. The air duct is movable between a plurality of positions relative to the riser bracket. The plurality of positions including at least an open position and a closed position.

data exchange using fan unit signal lines including receiving a pulse width modulated (PWM) signal on a PWM signal line of a fan unit; detecting that a frequency of the PWM signal is outside a frequency range used to control a fan speed of a fan in the fan unit; selecting a data output based on the frequency of the PWM signal; and sending the data output on a tachometric signal line of the fan unit.

A thermally maintainable built-in storage tray structure can include a case main frame body; a storage unit tray is positioned within the case main frame body, and wherein the storage united is configured to be positioned at a front end of a server together with a mainboard and a PCI_E and the storage unit tray is moveably connected to the case main frame body and is capable of be pulling out of the case main frame body; a middle flip rack provided at a middle part and a rear flip rack provided at a rear part of the storage unit tray, the middle flip rack and the rear flip rack are hinged to the storage unit tray.

An electronic device includes a housing, a plurality of fans aligned in a width direction of the housing, a partition board which is interposed between a plurality of fans adjoining each other in the width direction of the housing and extended in a downstream side of a flow direction of wind caused by a plurality of fans, an electronic part which is disposed to consecutively join the partition board in the downstream side of the flow direction of the wind, and a passage resistor which is disposed in a further downstream side of the flow direction of the wind from the electronic part.