A server system comprises a deck, a front panel arranged on the deck and defining a collecting space; two doors arranged on opposite sides of the deck, and being perpendicular to the front panel; two receiving frame structures arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two periphery corridors are each defined between one of the doors and one of the receiving frame structure facing the one door; two circuit boards arranged between the two receiving frame structures, wherein the two circuit boards comprise a plurality of slits, wherein a central corridor is defined between the two circuit boards; a storage cover disposed above the deck over the two periphery corridors, the central corridor, the two receiving frame structures, and the two circuit boards.

A riser of an information handling system having an adjustable baffle that blocks air flowing through the riser from by-passing components of an expansion card, such as a PCIe card, installed in the riser. The baffle directs the flowing air across components of the expansion card to lower the operating temperature of the expansion card by convection. In some embodiments, part of the baffle is coupled to an angled slot of the riser body and another part of the baffle is coupled to a card holder so that movement of the card holder automatically adjusts the position of the baffle to direct otherwise by-passing air toward the components of the installed expansion card.

A latch assembly and an electronic device using the same are provided. The electronic device includes a chassis, a fan module, and the latch assembly. The chassis has a chassis sidewall and a fixing bolt fixed on the chassis sidewall. The fan module is adapted to be accommodated in the chassis. The latch assembly is mounted on a module sidewall of the fan module. The latch assembly includes a latch is pivotally connected to the module sidewall, a moving member movably disposed on the module sidewall and connected to the latch, and a rotating hook pivoted on the module sidewall and connected to the moving member. The rotating hook and the latch are respectively connected to opposite sides of the moving member. When the fan module is placed in the chassis, the rotating hook of the latch assembly is adapted to be hooked to the fixing bolt of the chassis.

According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.

Technologies for allocating resources of managed nodes to workloads to balance multiple resource allocation objectives include an orchestrator server to receive resource allocation objective data indicative of multiple resource allocation objectives to be satisfied. The orchestrator server is additionally to determine an initial assignment of a set of workloads among the managed nodes and receive telemetry data from the managed nodes. The orchestrator server is further to determine, as a function of the telemetry data and the resource allocation objective data, an adjustment to the assignment of the workloads to increase an achievement of at least one of the resource allocation objectives without decreasing an achievement of another of the resource allocation objectives, and apply the adjustments to the assignments of the workloads among the managed nodes as the workloads are performed. Other embodiments are also described and claimed.

A heat dissipation device is provided and includes a frame body having an airflow channel therein; a first partition plate and a second partition plate for separating the airflow channel into a first channel, a second channel, a third channel and a fourth channel; a first flow guiding structure for isolating the fourth channel from the second channel; and a second flow guiding structure for isolating the first channel from the third channel. The first partition plate, the first flow guiding structure, the second flow guiding structure and the second partition plate collectively form a first flow channel communicating the first channel and the fourth channel and a second flow channel communicating the second channel and the third channel, where the first flow channel and the second flow channel are separate from one another.

A series fan frame body structure includes a first fan frame body, a second fan frame body and a serial connection frame body. The serial connection frame body has a first opening and a second opening. The first and second openings arranged in nonparallel to each other. The first and second fan frame bodies are respectively disposed at the first and second openings. The first and second fan frame bodies are inclined from each other. The first and second fan frame bodies are serially connected in a nonparallel form. Therefore, in the system, due to the resistance of the structure with such configuration, the audio frequency dipole structure is destructed so that the periodical noise and vibration characteristic are lowered.

An electronic device including a housing that accommodates a circuit board and a first electronic component connected to the circuit board, and that has an opening portion that opens upward; a cover that is provided on an upper portion of the housing, that at least partially covers the opening portion, and that has a second electronic component mounted thereon; a connecting wire that connects the second electronic component to the circuit board; and an opening/closing mechanism that can open and close the cover in a state in which the second electronic component and the circuit board are connected by the connecting wire.

A motherboard assembly comprises a motherboard, a first computing component attached to the motherboard, and a coolant container attached to the motherboard. An air-cooled heat sink is attached to the coolant container. The coolant container, the heat sink, and the motherboard form a hermetically sealed enclosure that encompasses the first computing component and that is configured to retain dielectric working fluid covering the first computing component. The heat sink is positioned to condense vapors formed from boiling of the dielectric working fluid and to cause condensed dielectric working fluid to return to a pool of the dielectric working fluid that comprises the first computing component. The motherboard assembly additionally comprises a second computing component attached to the motherboard and positioned outside of the hermetically sealed enclosure.

A hardware-based fan controller for controlling fan modules in a computer system having multiple computer nodes is disclosed. Each of the computer nodes has a service processor. The fan controller includes a slave module that receives fan speed commands from each of the service processors. A fan speed generator is coupled to the slave module and a subset of the fan modules. The fan speed generator receives fan speed commands from the slave module and fan speed outputs from the subset of fan modules. The fan speed generator is configured to output a speed command to each of the fan modules in the subset.