An information handling system includes a chassis having multiples sleds and an embedded controller. The embedded controller retrieves relative impedances for all of the sleds, and calculates a maximum available airflow for the first sled based the relative impedances of all other sleds. A baseboard management controller (BMC) of a first sled requests a boot operation for the first sled. The BMC collects configuration information for the first sled, and determines an airflow impedance of the first sled based on the configuration information. The BMC provides the airflow impedance and a power allocation request to the embedded controller. The BMC compares the maximum available airflow to a minimum airflow requirement for the first sled. If the maximum available airflow is less than the minimum airflow requirement, the BMC implements power limits for processors in the first sled to prevent overheating of components within the first sled.

An information handling system includes a chassis having a cold aisle edge and a hot aisle edge, one or more devices inserted within the cold aisle edge, a power supply unit, and a baseboard management controller (BMC). The BMC determines whether a power supply cooling fan of the power supply unit installed within the information handling system has a fixed airflow direction or changeable airflow direction. In response to the power supply cooling fan having a fixed airflow direction, the BMC determines a configuration of the information handling system. The BMC determines a power supply cooling fan orientation of a power supply cooling fan within the power supply unit, and whether the power supply cooling fan orientation corresponds to the configuration of the information handling system. If not, the BMC provides an alert message to an individual associated with the information handling system.

An information processing apparatus comprises a first heat generation circuit, a second heat generation circuit, a blocking assembly, and a processor. The blocking assembly performs a first operation of blocking air flowing from the first heat generation circuit toward the second heat generation circuit or a second operation of passing the air, and the processor is configure to instruct the blocking assembly to perform the first operation in a case where a temperature of the air is higher than a predetermined value, and instruct the blocking assembly to perform the second operation in a case where the temperature of the air is lower than the predetermined value.

A fixing assembly and an electronic device including same are disclosed. The fixing assembly includes a supporting member, a locking member, and a latching member. The supporting member includes a first supporting portion and a second supporting portion connected with each other, and the second supporting portion defines a sliding slot. The locking member includes a locking portion and a connecting portion connected with each other, the connecting portion includes a protrusion and a latching hole. The protrusion is slidably arranged in the sliding slot. When the protrusion slides along the sliding slot, the locking member slides and then rotates relative to the supporting member. The latching member is arranged on the second supporting portion and is adapted to be inserted into the latching hole. When the latching member is inserted into the latching hole, the fan is sandwiched and held between the first supporting portion and the locking portion.

Methods, systems, apparatus, and articles of manufacture to crimp a tube are disclosed. An example crimp disclosed herein includes a first crimp section extending between a first end of the crimp and a point along the crimp between the first end and a second end, a first inner diameter of the first crimp section constant between the first end and the point, and a second crimp section adjacent the first crimp section, the second crimp section extending between the point and the second end, a second inner diameter of the second crimp section to increase from the point to the second end.

An enclosure for receiving a plurality of storage components is provided. The enclosure includes a deck, a top cover, a front panel, a stress distributing member, and a pair of component housings. The front panel is disposed between the deck and the top cover disposed over the deck. The stress distributing member traverses an entire width of the deck and is fastened to the deck and the top cover. A front section is defined between the front panel and the stress distributing member. The component housings are arranged in the front section. Each of the component housings has a front end facing outward the enclosure and a back end facing inward the enclosure. Each of the component housings is configured to receive at least a set of one or more of the storage components, and ends of the stress distributing member extend beyond the front ends of the component housings.

A chassis includes a chassis body and a support, and the chassis body has a channel that passes through a first end and a second end that are of the chassis body. The support is slidably disposed in the channel. The support is provided with a first accommodation compartment, a fan compartment, and a second accommodation compartment that are successively disposed along a direction from a first end of the channel to a second end of the channel. The first accommodation compartment is capable of sliding out of the chassis body from the first end, and the second accommodation compartment is capable of sliding out of the chassis body from the second end. The fan compartment is configured to accommodate a heat dissipation fan.

A chassis includes a chassis body and an installation frame, and the chassis body has a channel that passes through a first end and a second end that are of the chassis body. The installation frame is slidably disposed in the channel of the chassis body. The installation frame has a first part facing the first end of the chassis body and a second part facing the second end of the chassis body; and the first part is capable of sliding out from the first end of the chassis body, and the second part is capable of sliding out from the second end of the chassis body.

The present invention includes a lateral support member for a server computer constructed to permit advantageous airflow. The present invention can be operated to shunt organized airflow into multiple computer cases and/or organized airflow from multiple computer cases to a dedicated heat reservoir.

A component carrier includes a baseboard, two sidewalls, and an ejector. The two sidewalls extend from opposite sides of the baseboard. The ejector includes a side plate, a handle, and a tab. The side plate is positioned in proximity to a first sidewall of the two sidewalls of the component carrier. The handle extends from a first end of the side plate in a first direction that is generally perpendicular to the side plate. The tab is positioned in proximity to the baseboard, and extends from a second opposing end of the side plate in a second direction that is generally perpendicular to the side plate and opposite to the first direction, the tab coupled to a first connector extending from the baseboard. The baseboard includes a first opening such that a portion of the tab of the ejector is configured to directly contact the electronic component therethrough.