Heat-rejecting media configured to thermally couple to a heat-generating component of an information handling resource may include a source, a sink, and a thermally-conductive strip coupled between the source and the sink. The source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component. The sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource

A quick release mechanism includes a fixed component, a first assembly, and a second assembly. The fixed component has a guiding portion and a first positioner. The first assembly includes an engagement component and a return component. The engagement component is pivotably disposed on the fixed component and includes a first protrusion part, a first press part, and a second positioner. The return component keeps the engagement component in an engaged position. The second assembly is removably inserted into the guiding portion. The second assembly includes a second protrusion part and a contact part. The engagement component is movable away from the engaged position by abutting of the second protrusion part on the first protrusion part or by abutting of the contact part on the first press part during insertion of the second assembly into the guiding portion.

A rack-mountable computer system directs separate portions of a cooling airflow from an inlet air plenum in the computer system interior through separate air passages to remove heat from separate portions of a set of heat-producing components. The air passages can preclude a portion of cooling airflow removing heat from a component from being preheated by another component. Plenums and air passages can be established through the arrangement of components in the interior. Components can be arranged in progressive offsets throughout the depth of the interior to vary plenum flow area throughout the depth, which can progressively impede and redirect airflow through the inlet plenum into the air passages. Arrangements can include an angled row, a staggered configuration, etc. The computer system can include a chassis which can translate, while maintaining operation of hot-pluggable electronic components coupled throughout the depth, to enable swapping of hot-pluggable electronic components throughout the interior.

A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.

A cooling system and a cooling device are provided. The cooling device includes a container, a heat dissipation module, and a cooling module. The cooling module includes a cover plate and a heat dissipation fin assembly. The cover plate covers an opening of the container. The cover plate includes a cooling channel. The cooling channel is arranged in the cover plate and includes an inlet and an outlet. The inlet and the outlet are respectively located at two sides of the cover plate. One side of the heat dissipation fin assembly is in contact with a surface of the cover plate, and an other side of the heat dissipation fin assembly is located in the container. Through the above structure, a usage amount of heat transfer fluid injected into the container of the cooling device is lower than that of a conventional immersion cooling device.

A smart cooling fan system is disclosed, and comprises a first temperature sensor, a second temperature sensor, a first cooling fan connected to a main processor of an electronic device, a second cooling fan disposed in a housing case of the electronic device, and a microcontroller. The microcontroller is configured to, based on immediate fan rotation speed, find out a first volumetric flow rate and a second volumetric flow rate by looking up a CFM-RPM lookup table (LUT), a first PWM LUT and a second PWM LUT, the microcontroller controls the first cooling fan to produce a first airflow having the first volumetric flow rate, and also controls the second cooling fan to produce a second airflow having the second volumetric flow rate. As a result, the operating temperature of the main processor and an ambient temperature of the housing case are therefore immediately reduced.

A cartridge module alignment and mounting system, apparatus and method for mounting of a plurality of removable modules where the modules can be densely packed within the apparatus and where physical alignment of the module is maintained during insertion and removal so that the modules are easily connected or disconnected to a printed circuit board. The system includes an alignment pin affixable to the printed circuit board, and a carrier attachable to an electronic device such as a data storage device. The carrier can include a pin bore configured to receive a portion of the alignment pin thereby removably connecting and aligning the electronic device to the printed circuit board so that a space is defined between adjacent electronic devices. The space allows airflow or fluid flow to pass therebetween increasing heat dissipation of the electronic devices and the printed circuit board.

A server information handling system is secured by a bezel that couples to an access location, such as an air vent at a front or rear face of a housing. The bezel includes a security structure having a lock and configured to couple directly at the front face or with a bezel extension at the rear face so that the server information handling system can use the same bezel with both a front face or rear face rack mount. The bezel has a lock integrated with the security structure, an air filter that fits over the security structure to filter air flowing into the housing, and a filter brace that captures the air filter by coupling to the security structure over the air filter. The filter brace attaches and detaches at the security structure when the security structure locks a server information handling system housing so that the air filter can be changed while the housing remains secure.

A server information handling system is secured by a bezel that couples to an access location, such as an air vent at a front or rear face of a housing. The bezel includes a security structure having a lock and configured to couple directly at the front face or with a bezel extension at the rear face so that the server information handling system can use the same bezel with both a front face or rear face rack mount. The bezel has a lock integrated with the security structure, an air filter that fits over the security structure to filter air flowing into the housing, and a filter brace that captures the air filter by coupling to the security structure over the air filter. The filter brace attaches and detaches at the security structure when the security structure locks a server information handling system housing so that the air filter can be changed while the housing remains secure.

Disclosed is a server rack system within an enclosed building and a process for directing air through a server facility. Air is channeled within a server rack assembly and then through a closed loop back again into the server rack assembly. Impediments may control the degree of airflow availability.