Techniques for fan mechanisms with adjustable side vents are disclosed. In one embodiment, a fan housing has several side vents that can direct airflow to components around the fan housing. Vent covers can block the vents, directing the airflow to the primary vent and the heatsink for the processor and other components. When the speed of a fan in the fan housing is increased, the vent covers open, directing airflow to components around the fan housing. In another embodiment, several vent channels are defined in the vent housing. A motor connected to a vent barrier can move the vent barrier to block or unblock the vent channels, allowing for control of airflow. In another embodiment, a fan channel module with one or more vent channels can be attached to the fan housing, allowing for a flexible array of airflow patterns for the same fan housing.

A partition for separating computer components in an apparatus holding the computer components is provided. The partition includes a body with a first side and a second side; one or more top tabs projecting from both the first side and the second side of the body; one or more bottom tabs projecting from the first side of the body; and one or more bottom protrusions projecting from the second side of the body. The one or more top tabs are secured in a first manner, e.g., through rivets, to a first panel of the apparatus. The one or more bottom tabs are secured in the first manner to a second panel of the apparatus. The one or more bottom protrusions are secured in a second manner to the second panel of the apparatus, e.g., tucking a protrusion under the second panel. The features allow different-sized compartments for different storage form factors.

Described herein are cooling hardware and methods for cooling a heterogeneous computing architecture. In one embodiment, a system for cooling a heterogeneous computing architecture includes a base stiffener; a top stiffener including a mounting channel; a printed circuit board (PCB) including multiple electronics and chips, the PCB that is attached to the base stiffener; and a cooling device mounted on top of the top stiffener. One or more heat transfer plates (HTP) are inserted into the top stiffener via the mounting channel to transfer heat generated by the hardware modules to the cooling device, while resistance channels inside the top stiffener are designed for ensuring proper loading pressure on the entire assembly.

A cooling system for a plurality of heat-generating components in a chassis of an information handling system includes an array of fans, each fan operable to generate an airflow in a range of airflows, and a control system configured to monitor temperatures for the components and adjust a direction of one or more airflows based on the component temperatures. If a component temperature gets too high for a first fan associated with the component to cool the component, a portion of a second airflow generated by a second fan may be directed to provide additional airflow to the component such that the component is cooled without increasing the fan speed of the first fan. Adjacent fan speeds may also be adjusted to reduce losses due to differences between adjacent airflows.

Data exchange using fan unit signal lines is disclosed, including receiving a pulse width modulated (PWM) signal on a PWM signal line of a fan unit; detecting that a frequency of the PWM signal is outside a frequency range used to control a fan speed of a fan in the fan unit; selecting a data output based on the frequency of the PWM signal; and sending the data output on a tachometric signal line of the fan unit.

An information handling system, including a plurality of computing modules; a rack-mountable tray including: a plurality of bays, each bay including a cold fluid intake and a warm fluid return, wherein each computing module of the plurality of computing modules is engaged with the cold fluid intake and the warm fluid return of one or more of the bays of the plurality of bays; and a fluid circulation system positioned within the tray and coupled to the cold fluid intake and the warm fluid return of each of the bays, the fluid circulation system introducing, for each bay that a respective computing module is engaged with, fluid within the computing module via the cold fluid intake of each bay and returning warm fluid via the warm fluid return of each bay to transfer heat from the computing modules.

A fan carrier includes a fan mounting section, a connector mounting section, and a connecting section. The fan mounting section is placed in physical communication with a fan of an information handling system. The fan mounting section has both structural rigidity and vibration rigidity. The connector mounting section is placed in physical communication with a fan-side connector of the information handling system. The connector mounting section has structural rigidity to properly align the fan-side connector with a motherboard-side connector of the information handling system. The connecting section is in physical communication with and located in between the fan mounting section and the connector mounting section. The connecting section has structural rigidity and vibration flexibility, and the vibration flexibility reduces vibrations from the fan before the vibrations are transmitted to the fan-side connector.

A server includes a rack, a chassis, and a fan module. The chassis includes a supporting tray, a bracket, and a first electrical connector. The supporting tray is detachably disposed into the rack along an assembling direction substantially perpendicular to a normal direction thereof. The bracket is disposed at an end of the supporting tray. The first electrical connector is disposed on the bracket. The first electrical connector at least has one end movable or detachable with respect to the bracket along a direction substantially perpendicular to the assembling direction. The fan module is detachably disposed in the bracket along the assembling direction. The fan module includes a fan rack, a fan unit, and a second electrical connector. The fan unit is disposed in the fan rack. The second electrical connector is disposed on the fan rack. The second electrical connector is electrically connected to the first electrical connector.

A micro control unit (“MCU”) controls operation of a cooling fan in a compute device. The MCU is responsive to determining that a fan speed of the cooling fan is above a predetermined speed threshold to periodically determine power consumption of the cooling fan. In response to a periodic determination of power consumption exceeding a predetermined power consumption limit, the MCU reduces the fan speed of the cooling fan by a predetermined increment and continues periodically determine power consumption of the cooling fan. Upon determining that the power consumption does not exceed the predetermined power consumption limit, the MCU discontinues any prior reduction of the fan speed.

A server and a chassis of the server are disclosed. The server chassis includes a casing and a fan tray. The casing has a front side and an opposing rear side. The fan tray is disposed on the front or rear side of the casing in a flippable manner. This design allows the chassis to be applicable to different types of servers, resulting in reduced research, development and manufacturing cost of the server and chassis.