A portable data center includes a cooling system comprising a cooling circuit, one or more air plenums, and one or more air moving devices. The cooling circuit circulates a heat transfer fluid through a portion of the cooling circuit that passes through the one or more air plenums. The heat transfer fluid that passes through the one or more air plenums cools air flowing through the one or more air plenums via the one or more air moving devices. The cooling circuit also circulates the heat transfer through a separate portion of the portable data center where heat is rejected from the heat transfer fluid into the separate portion of the portable data center. In some embodiments, the air plenums and at least a portion of the cooling circuit are mounted in a sub-floor space between a platform within the portable data center and an outer structure of the portable data center.

A chassis in accordance with one example includes a plurality of slots to receive a plurality of top-loading computing cartridges from a top of the chassis. The chassis also includes a supply inlet on a first side of the chassis to direct cooling fluid from the first side to a second side of the chassis, and a return outlet on the second side of the chassis to expel the cooling fluid from the chassis. The plurality of computing cartridges are immersed in the cooling fluid.

A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.

A geothermal system is disclosed for cooling a plurality of computer processing devices which includes a first heat exchanger in thermal communication with a plurality of computer processing devices, wherein the first heat exchanger includes a heat absorbing fluid structured to receive heat from the plurality of computer processing devices. The geothermal system further includes a chiller in selective flow communication with the first heat exchanger, wherein the chiller is structured to selectively receive at least a portion of the heat absorbing fluid. The geothermal system further includes a geothermal field structured to exchange heat in the heat absorbing fluid with a geological heat sink.

Waterborne data center facility systems and methods comprising a purpose-built marine vessel, a pre-fabricated data center facility structure, a plurality of computer systems, a plurality of energy-efficient water-based heat exchange systems, a plurality of energy efficient closed loop cooling systems, a plurality of data center modules and a plurality of electrical power generators. Described systems and methods may be employed to quickly deploy an energy-efficient waterborne data center facility. Described waterborne data center facility is transportable and may be moved to areas where data center facility and data center type services are needed. Water-based heat exchange and closed-loop cooling system enable energy-efficient cooling to data center facility and the plurality of computing systems therein. Power generators may be used to provide power to data center facility. Waterborne data center facility may prove helpful in areas following natural disasters or for military purposes where data center services are needed but not readily available.

Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.

A movable media air handling unit includes cooling media panels that may be moved into or out of an airflow based on whether or not additional cooling is required from the movable cooling media panels. Moving the cooing media panels out of the air flow reduces flow restrictions/pressure drop through the movable media air handling unit. In some embodiments, various types of movable cooling media panels may be used, such as liquid coolant coil panels, gaseous coolant coil panels, evaporative cooling panels, or other types of panels.

A network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis. A coolant is delivered to a first group of the plurality of modules with a first flow control valve in a first cooling loop and the coolant is delivered to a second group of the plurality of modules with a second flow control valve in a second cooling loop. The network communication device further includes a plurality of sensors for monitoring a temperature in the first cooling loop and the second cooling loop and a control system for controlling delivery of the coolant to the first group and the second group, where the control system controls transmitting a signal to one of the first flow control valve and the second flow control valve to modify a flow of the coolant.

Techniques for cooling a data center include circulating an airflow, to a warm air plenum of a first module, from rows of racks that support a heat-generating electronic devices; warming the airflow circulated through the racks; circulating the warmed airflow through a warm air inlet of the warm air plenum that is adjacent an open side of the racks and to a warmed air outlet adjacent a data center volume above the racks; circulating the airflow, with a fan positioned in a second module positioned in the data center volume above the racks, through at least one cooling module to cool the warmed airflow, and into a human-occupiable workspace of the data center adjacent the racks; and diverting the warmed airflow with an airflow partition mounted in the data center volume above the racks and adjusted to interrupt the warmed airflow between the warmed air plenum and the human-occupiable workspace.

A data center cooling system is operated in a first mode, has an indoor portion wherein heat is absorbed from components in the data center by a heat transfer fluid, and has an outdoor heat exchanger portion and a geothermal heat exchanger portion. The first mode includes ambient air cooling of the heat transfer fluid in the outdoor heat exchanger portion and/or geothermal cooling of the heat transfer fluid in the geothermal heat exchanger portion. Based on an appropriate metric, a determination is made that a switch should be made from the first mode to a second, different, mode; and, responsive thereto, the data center cooling system is switched to the second mode. The second mode includes at least another of ambient air cooling of the heat transfer fluid in the outdoor heat exchanger portion and geothermal cooling of the heat transfer fluid in the geothermal heat exchanger portion.