An electronic apparatus uses the cooling effect of a vapor chamber and includes: a chassis; a motherboard which is provided in the chassis and has a CPU mounted on a front surface thereof; a vapor chamber having a working fluid sealed in a hermetically sealed space formed between two metal plates; a stud fixed to the upper surface of the vapor chamber; and a screw fixing the stud and the motherboard. The CPU is thermally connected to the upper surface of the vapor chamber. The motherboard has a mounting hole formed therein, and the screw is screwed to the stud through the mounting hole from the rear surface of the motherboard. The CPU is rectangular, and four studs and four screws are provided at positions in the vicinity of the four corners of the CPU.

A nucleate boiling apparatus is disclosed that includes a base configured to fit onto a heat-producing object to provide immersion cooling to the object in a liquid-cooled computing environment. The apparatus further includes first and second pluralities of pipes extending from opposite sides of the base. Each of the first and second pluralities of pipes including a respective transition region and a respective flat region. The first and second pluralities of pipes in the transition regions extend away and up from the base, and the first and second pluralities of pipes in the flat regions extend away from the base in a fanned-out arrangement. The flat region of the second plurality of pipes is at a greater distance from the base than the flat region of the first plurality of pipes.

A heat dissipation system and an electronic device. The heat dissipation system configured to circulate working fluid and to cool heat source. Heat dissipation system includes casing, first tube, second tube, condenser and flow rate controller. Partition is fixed in the base and is located in the accommodation space to divide the accommodation space into a first and a second accommodation space. The first accommodation space is located above the second accommodation space along a gravitational direction. The inlet is in fluid communication with the first accommodation space. The outlet is in fluid communication with the second accommodation space. The partition includes a plurality of drip holes. The first and the second accommodation spaces are in fluid communication with each other via the drip holes. The working fluid is configured to drip onto the heat source via the plurality of drip holes.

A cooling plate for cooling high power density electronics has an internal cavity and an opening for fluid exchange with the cavity. A mounting structure is positioned within the opening. A coaxial port is attached to the mounting structure, the coaxial port having a center conduit and a ring conduit surrounding the central conduit such that rotational axis of the center conduit coincides with rotational axis of the ring conduit. A single coaxial port can serve to deliver cooling liquid to the cooling plate and return warmed fluid from the cooling plate. The coaxial port center conduit connected with a fluid distribution panel. Fluid distribution is regulated by the panel before it exits the port through the ring conduit.

Described herein are cooling hardware and methods for cooling a heterogeneous computing architecture. In one embodiment, a system for cooling a heterogeneous computing architecture includes a base stiffener; a top stiffener including a mounting channel; a printed circuit board (PCB) including multiple electronics and chips, the PCB that is attached to the base stiffener; and a cooling device mounted on top of the top stiffener. One or more heat transfer plates (HTP) are inserted into the top stiffener via the mounting channel to transfer heat generated by the hardware modules to the cooling device, while resistance channels inside the top stiffener are designed for ensuring proper loading pressure on the entire assembly.

The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate is coupled to a condenser section of a heat pipe and to a primary computing device, with the heat pipe coupled to an auxiliary computing device at an evaporator section of the heat pipe, so that the cold plate draws heat from the primary computing device and from the heat pipe.

A condensing unit includes a vapor container housing condensing coils, the vapor container being pressurized to increase a rate of condensation of two phase coolant in vapor phase. The condensing unit includes a vapor inlet for vapor to enter the vapor container. The condensing unit includes a liquid container underneath the vapor container and attachable to the vapor container to receive two phase liquid coolant from the vapor container. The condensing unit includes a liquid level sensor within the liquid container to measure a liquid level. The condensing unit includes a pressure sensor at the vapor container to measure a pressure within the vapor container, where the pressure sensor is used to regulate a pressure in the condensing unit within a predetermined range thereby maintaining a steady rate of condensation by the condensing coils and an outflow rate of two phase liquid coolant from the liquid container.

A coolant management unit includes a server supply manifold, a server return manifold, a power distribution, and a controller. A server supply manifold is to receive cooling fluid from a cooling fluid source. The server supply manifold is to distribute the cooling fluid to server blades. The server return manifold is to receive vapor from the one or more server blades. The cooling fluid is two-phase cooling fluid to extract heat from one or more servers and to evaporate into the vapor into the server return manifold, and the vapor is transmitted to an external condenser via the rack return manifold to be condensed back to a liquid form. A power distribution bus is configured to distribute power to the one or more servers. A controller is configured to control a fluid pump coupled to the server supply manifold based on one or more signals received from different sensors.

According to one embodiment, an immersion cooling system may include a container to receive one or more server blades, each having electronics, at least partially submerged within a two-phase coolant contained within the container. The immersion cooling system may also include a cover panel to cover the phase change area. This area may include a liquid region defined to contain the two-phase coolant therein, and a vapor region defined between the cover panel and a surface of the two-phase coolant. The cover panel includes a plurality of slots, covered with rotatable panels. At least one of the slots is configured to allow a server blade to be inserted into the liquid region and at least partially submerged into the two-phase coolant. The slots may be configured to allow a condensing unit to be inserted into the vapor region.