H05K7/20818

REFRIGERANT SUPPLY DEVICE, COOLING DEVICE, AND COOLING SYSTEM
20170311489 · 2017-10-26 · ·

[Problem]

A refrigerant supply device with a small lateral width and a capacity to supply refrigerant evenly among heat receivers disposed in multiple tiers needs to be provided.

[Solution]

A refrigerant supply device for distributing, by force of gravity, liquid phase refrigerant to heat receivers disposed in a plurality of tiers includes: a first conduit for supplying the refrigerant to the heat receivers; a second conduit provided in parallel with the first conduit; a first aperture provided in the first conduit for supplying the refrigerant to one of the heat receivers; a first blocking means provided below the first aperture for blocking the first conduit; a first communication opening provided above the first aperture and communicating the first conduit and the second conduit; a second communication opening provided below the first blocking means and communicating the first conduit and the second conduit; and a second blocking means provided below the second communication opening for blocking the second conduit.

COOLING SYSTEM AND ELECTRONIC DEVICE
20170311481 · 2017-10-26 · ·

The purpose of the present invention is to more efficiently cool exhaust heat, of an apparatus or the like that emits heat, by preventing a situation where a gas-phase medium is cooled and turns into a liquid-phase medium and thereby transfer of the gas-phase medium is hindered. For this purpose, a cooling system includes a heat receiving means for receiving a gas heated by heat emitted by an electronic apparatus and changing a liquid-phase heat medium into a gas-phase heat medium. a heat radiation means for cooling the gas-phase heat medium so as to be changed into the liquid-phase heat medium. a first transfer means for transferring the gas-phase heat medium from the heat receiving means to the heat radiation means. and a second transfer means for transferring the liquid-phase heat medium from the heat radiation means to the heat receiving means. wherein at least part of the first transfer means is heated by the heat emitted by the electronic apparatus.

SYSTEMS AND METHODS OF REAL TIME OPTIMUM AIRFLOW BALANCING ON RACK LEVEL AIRFLOW CONSTRAINT

A central information management console provides for real time management of airflow across an information handling system or across multiple information handling systems within one or multiple racks within an environment by estimating and prioritizing the volumetric airflow needs of each information handling system within the environment. Each information handling system or group of information handling systems may be given a priority setting based on one or more criteria and volumetric airflow may be provided based on the priority setting and a selected balancing option. Metrics and sensor readings are received by the central information management console in real time or at intervals to use in determining the amount of volumetric airflow to provide to each information handling system so as to balance volumetric airflow for efficient operation of the environment and to maintain volumetric airflow so as not to exceed a volumetric airflow limit.

Disaggregated Computer Systems

The discussion relates to disaggregated computing. One example can monitor multiple two-phase liquid immersion tanks. Individual two-phase liquid immersion tanks can contain multiple components of a single type of component type. The example can receive requests for virtual machines and allocate sets of components from individual two-phase liquid immersion tanks to work together to support the virtual machines requests.

SYSTEM FOR COOLING SERVER BOARDS IN A DATA CENTER
20220039296 · 2022-02-03 ·

A cooling system, for cooling a plurality of server boards, includes at least one main two-phase fluid circuit, with a descending pipe, an ascending pipe, a loop bottom connector and an upper portion thermally coupled with at least one heat rendering exchanger. The cooling system also includes at least one evaporator coupled to a hot source to be cooled down in the server boards, a plurality of local circuits respectively serving one of the server boards and operating in bypass with respect to the main circuit. Each local circuit includes, on the one hand, a first branch, forming a feed-in on the descending pipe and, on the other hand, a second branch forming a fluid return in the ascending pipe of the main circuit, as well as an auxiliary circuit internal to the server board connected to one or several evaporator(s).

FLUID COLLECTING APPARATUS, COOLING SYSTEM AND METHOD OF OPERATING THE SAME
20220312641 · 2022-09-29 ·

A fluid collecting apparatus includes a housing, a gripping member, an inlet, and an outlet. The housing includes a chamber. The gripping member is movable within the chamber, extendable toward or retractable away from a tank, and is configured to hold a computing device. The inlet is communicable with the chamber and configured to deliver a gas into the chamber. The outlet is communicable with the chamber and configured to discharge the gas out of the chamber. A method of operating a cooling system includes receiving the tank, a coolant held by the tank, and a computing device immersed in the coolant, disposing the fluid collecting apparatus over the tank, moving the computing device into the chamber by the gripping member; supplying a gas from the inlet to be blown against the computing device; and discharging the gas and a vaporized coolant out of the chamber through the outlet.

Cooling apparatus and cooling system for electronic-device exhaustion
09727101 · 2017-08-08 · ·

The cooling apparatus (10) for electronic-device exhaustion includes an evaporator unit (201), a fluid piping (306) and a vapor piping (305). A plurality of evaporator units (201) is disposed in a rack (100) in the height direction, and have a dimension in height of any of 2U, 3U, and 4U with 1U being 44.45 mm. The evaporator unit causes a coolant fluid thereinside to vaporize and produce a coolant vapor by heat of the exhaust air from an electronic device loaded in the rack (100), and cools the exhaust air. The fluid piping (306) is a supply route of the coolant fluid to the evaporator units (201), the vapor piping (305) is a discharging route of the coolant vapor from the evaporator units (201), and both are commonly connected to the plurality of evaporator units (201).

ADVANCED FLUID CONNECTION DESIGN FOR MULTIPLE PHASE SYSTEM
20220272874 · 2022-08-25 ·

A cooling arrangement for an electronic rack of a data center having a rack manifold with liquid supply line to receive first cooling liquid from a cooling liquid source and liquid return line to return first warmer liquid back to the cooling liquid source. A plurality of server chassis are arranged in a stack, each server chassis including one or more fluid cooling devices associated with one or more information technology (IT) components. A plurality of connector modules are attached to the servers, each providing fluid connections between the fluid cooling devices and the cooling liquid source on the racks; wherein each of the connector module comprises a frame having mounts configured for attaching the frame onto the server a plurality of channels formed in the frame to accept the fluid connectors; and, a plurality of fluid connectors slidably mounted in the channels.

Rackmount Cooling System
20170280593 · 2017-09-28 ·

A cooling system for electronic equipment including an evaporator, a rack to which the electronic equipment can be mounted above the evaporator, and a condenser spaced apart from the evaporator. Air warmed by the electronic equipment is directed to the evaporator, cooled at the evaporator, and directed back to the electronic equipment to cool the electronic equipment.

System for cooling hard disk drives using vapor momentum driven by boiling of dielectric liquid

A system for cooling hard disk drives (HDDs) includes: an enclosure having (i) a lower volume within which a cooling liquid is heated to a boiling point to cause some of the cooling liquid to evaporate, creating a plume of rising vapor and (ii) an upper volume having (a) a HDD cooling area with HDD(s) placed in the direct path of the rising vapor, which cools the HDD(s) during functional operation of the HDD(s) and (b) a condenser located above the HDD cooling area and which cools a substantial portion of the rising vapor that impacts the condenser within the upper volume such that the rising vapor condenses back into liquid phase on contact with the condenser; and a heat source that dissipates heat into the lower volume of the enclosure, sufficient to heat the cooling liquid to the boiling point temperature.