A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

An immersion cooling system includes an immersion tank and one or more information technology (IT) equipment, the IT equipment is configured to provide IT services and is at least partially submerged within a first phase change liquid within the immersion tank, where, when the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the first phase change liquid thereby causing at least some of the first phase change liquid to turn into vapor phase. The cooling system includes a condenser unit having a second phase change liquid circulating at the condenser unit. The condenser unit includes a vacuum port, a sealing valve at the vacuum port. The cooling system includes a heat exchange core, coupling within the immersion tank connecting with the condenser unit to carry heat from the first phase change liquid to the second phase change liquid.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate includes an evaporator to remove heat from at least one computing device using a two-phase fluid and using a buffer to perform flow stabilization represented by different volumes or different flow rates of a two-phase fluid that is enabled to flow between an evaporator and a condensing or compressor unit located external to a cold plate.

The disclosure relates to an immersion cooling system including a tank, an access opening, a first dielectric liquid, a working object and a condensing unit. The tank has a space and a cover. The cover is detachably disposed on the tank to close or open the space selectively. The access opening is in communication with the space of the tank. The first dielectric liquid is accommodated within the space to form a liquid surface. The liquid surface and the access opening are disposed adjacent to each other. The working object is immersed in the first dielectric liquid. The condensing unit is arranged in the space above the liquid surface. When a cooling operation is performed, the access opening is closed, the first dielectric liquid is kept in the space, and the heat generated from the working object is dissipated through the first dielectric liquid and the condensing unit.

An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed on the chassis. The heat dissipation assembly includes evaporator and condenser. The evaporator is in thermal contact with the heat source. The condenser is disposed on the chassis and comprises first thermally conductive plate, second thermally conductive plate and third thermally conductive plate that are stacked on one another. A condensation space is formed between the first thermally conductive plate and the second thermally conductive plate. A first liquid-cooling space is formed between the second thermally conductive plate and the third thermally conductive plate. The condensation space is in fluid communication with the evaporator. The first liquid-cooling space is not in fluid communication with the condensation space and is configured to be in fluid communication with the external heat dissipation device.

A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.

A rack system which includes a rack frame and at least one reservoir for housing at least one rack-mounted immersion case is disclosed. The rack frame is configured to slidably accommodate racking and de-racking operations of the at least one rack-mounted immersion case. The at least one collapsible reservoir, which is configured to store a fluid therein, is fluidly connected to the at least one rack-mounted immersion case, has a first portion fixedly connected to the at least one rack-mounted immersion case, and a second portion fixedly connected to the rack frame. The at least one collapsible reservoir is configured to respectively collapse and expand along a racked space and a de-racked space, the racked and de-racked spaces being defined between a backplane of the at least one rack-mounted immersion case and a backplane of the rack frame, the de-racked space being larger than the racked space.

The invention provides a two-phase flow active and passive multi-level data center cabinet cooling device and method, wherein the system includes a cabinet cooling device, a condensate system, a waste heat recovery device, a liquid reservoir, a liquid pump, a gas chamber, a fluid working medium, and a corresponding pipeline. The system constitute a closed loop, the loop is filled with nitrogen to maintain a low pressure state, and the pipeline fluid is driven by the liquid pump to flow; the gas chamber maintains a relatively stable air pressure in the two-phase flow loop; the liquid reservoir is connected with the gas chamber, providing an enough gas space to make a phase change occur more easily; the cabinet cooling device can be switched between an active mode and a passive mode to minimize PUE under good heat dissipation capability.

A two-phase immersion cooling device includes a tank, heating elements, a first condenser, and a lid. An accommodating cavity of the tank bottom accommodates a coolant. The heating elements are disposed in the accommodating cavity and immersed in the coolant. The first condenser is received in the accommodating cavity, located above the coolant and the heating elements, and disposed along sidewalls of the tank. At least one movable second condenser is fixed on the lid or a rear door and disposed in a cavity surrounded by the first condenser. The two-phase immersion cooling device increases the capacity of condensation heat transfer, and the condensation rate and the evaporation rate of the coolant in the tank are balanced, a pressure difference between an inside and an outside of the tank is reduced, a loss of coolant vapor is decreased, and a volume of the two-phase immersion cooling device is reduced.

A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.