Technologies are described for shielding electronic components. In one embodiment, a conductive gasket includes a gasket body. A conductive shield has a plurality of projections extending therefrom sufficient to deform the gasket body to couple the conductive shield and the conductive gasket together. The projections can be pointed teeth designed for penetrating the conductive gasket so as to electrically and mechanically couple the conductive shield to the conductive gasket. The conductive gasket can be stacked onto the conductive shield to form a sidewall, which can be mounted on a PCB. A conductive cover can then be placed on the conductive gasket to create a cavity in which electronic components can be positioned.

Various embodiments of the present disclosure relate to a package structure capable of allowing a shield used for noise attenuation to be used for other purposes, in an electronic device in which components are arranged at high density, and an operation method for preventing/reducing noise radiation or detecting in advance defects in a manufacturing process using the same. For this, an electronic device may include: a printed circuit board (PCB), and a package disposed on the printed circuit board. The package may include: a ground pad and at least one shield pad connected to the printed circuit board, a laminated structure comprising a plurality of laminated ground layers electrically connected to the ground pad by at least one via hole, at least one electronic component disposed on an uppermost surface of the plurality of laminated ground layers, a shield covering the at least one electronic component, wherein the at least one component is not exposed to the outside, and at least one switch device comprising a switch including a first terminal electrically connected to the shield through a first conductor wiring, a second terminal electrically connected to one of the plurality of ground layers through a second conductor wiring, and a third terminal electrically connected to the shield pad through a third conductor wiring and disposed on the uppermost surface and configured to selectively connect the first terminal to the second terminal or the third terminal wherein the shield is connected to one of the one ground layer or the shield pad.

An electronic apparatus and heat dissipation and EMI shielding structure thereof are provided. The electronic apparatus includes a substrate, at least one chip disposed on the substrate, and the heat dissipation and EMI shielding structure. The heat dissipation and EMI shielding structure covers the chip and includes a shielding frame and a heat dissipation element. The shielding frame has an opening to expose the chip, and the heat dissipation element is disposed on the shielding frame and covers the opening. The conjunction of the shielding frame and the heat dissipation element can protect the chip from being interfered with electromagnetic waves, and the heat generated by the chip can be dissipated by the heat dissipation element.

Example embodiments relate to a shield for an electronic device. The shield may be shaped to enclose the electronic device. The shield may include a number of traces. Each trace may include an electrically conductive inner portion and an electrically non-conductive outer portion.

An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.

It is to provide to a module and a method of manufacturing the module in which parasitic capacitance generated between two shield films is reduced without hindering reduction in height of a module. The module includes, a substrate, a component mounted on an upper surface that is one main surface of the substrate, a first shield film provided on an upper surface of the component, sealing resin provided on an upper surface of the substrate so as to seal the component, a second shield film provided on an upper surface or an upper side of the sealing resin, and a low dielectric member arranged between the first shield film and the second shield film and having a dielectric constant lower than a dielectric constant of the sealing resin.

According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

A substrate has an upper main surface and a lower main surface arranged in an up-down direction. A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The sealing resin layer is provided on the upper main surface of the substrate, covers the metal member, the first electronic component, and the second electronic component, and has an upper surface. The shield is provided on the upper surface of the sealing resin layer so as to be connected to the upper end of the plate-shaped portion. The plate-shaped portion is inclined with respect to the up-down direction such that an upper end of the plate-shaped portion is located in front of a lower end of the plate-shaped portion.

A metal member includes a plate-shaped portion extending upward from an upper main surface of a substrate, and has a front main surface and a back main surface arranged in the front-back direction when viewed in the up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more upper notches extending downward from the upper side. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side.

The invention is directed to a novel solution to providing heat management and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. The heat management features include phase changing materials that allow the processing components to be kept at a isothermal state through changes in phase, thereby prolonging the duration of time in which the processing components can operate at high performance levels without the need to throttle the performance.