A current sensor is provided on a bus bar via which a reactor is connected to a power module. The reactor is separated from the current sensor by a partition made of metal having a magnetic shielding effect. An output terminal of the reactor is provided on either one of a surface of the reactor on a first side and a surface of the reactor on a second side, the first side being farther from a mounting surface of a power converter across a plane passing through the center of the reactor, the second side being closer to the mounting surface from the plane.

A reference potential pattern in a printed board of a power conversion device is connected to a housing, an electromagnetic shield region surrounded by a shield wall of the housing and the reference potential pattern is formed, a power conversion circuit is provided outside the electromagnetic shield region, a conductive path connected to the control circuit and the power conversion circuit is wired into the electromagnetic shield region via a first connection hole of the printed board from the outside of the electromagnetic shield region.

A vertically oriented, electrically conductive enclosure includes at least three shield members. A first member has a first floor and a first sidewall that extends away from the first floor around a periphery of the first shield floor. A second member is electrically coupled to the first member and has a second floor and a second sidewall. A first portion of the second sidewall extends away from the second floor in a first direction. A second portion of the second sidewall extends away from the second floor in a second direction opposite to the first direction and engages the first sidewall. A third member is electrically coupled to the second member and has a shield cover and a third sidewall. The third sidewall extends away from the shield cover about a periphery of the shield cover and engages the first portion of the second sidewall.

A vehicle-mounted power supply apparatus and a vehicle having same. The vehicle-mounted power supply apparatus (100) includes: a housing (110), a magnetic device (120), and a shielding component (130). A mounting position (111) is arranged in the housing (110). The magnetic device (120) is an integrated part and is arranged at the mounting position (111), The shielding component (130) is arranged in the housing 110), and the shielding component (130) surrounds a periphery of the mounting position (111).

A semiconductor package may include a substrate, an application-specific integrated circuit (ASIC) provided on a first portion of a surface of the substrate, a memory device provided on a second portion of the surface of the substrate, and a stiffener plate provided on a third portion of the surface of the substrate. The stiffener plate may be spaced from and may surround the ASIC and the memory device. The semiconductor package may include an electromagnetic interference (EMI) absorber provided on a fourth portion of the surface of the substrate. The EMI absorber may be provided between the stiffener plate and the ASIC and the memory device. The EMI absorber may surround the ASIC and the memory device and may block EMI radiation generated by the ASCI and the memory device.

A frame includes a plurality of walls each having a first end and a second end facing away from each other along a first direction, and a plurality of spring fingers on the second end of one or more walls of the plurality of walls and extending along the first direction. First ends of the plurality of walls define an open bottom, and second ends of the plurality of walls define an open top.

The present invention relates to an electronic device including a display module and an electronics module arranged in a common housing, wherein the common housing is completed by a front cover, wherein the display module is arranged directly adjacent to the front cover, wherein the electronics module includes a printed circuit board having multiple layers and a plurality of electronic components attached to the printed circuit board, wherein the electronics module is arranged adjacent to the display module and wherein the printed circuit board includes a first layer and a second layer delimiting the printed circuit board on opposing sides, wherein the first layer is an electromagnetic interference shielding layer and the first layer is arranged facing the display module.

An electronic device is disclosed. The electronic device includes a shield that provides thermal and electromagnetic interference (“EMI”) shielding benefits. The shield is secured with fan assemblies by airtight seals to prevent air leakage and promote a pressured volume when the fan assemblies are running. Further, the shield can direct airflow from the fan assemblies to one or more thermally conductive components, where the airflow can convectively cool the thermally conductive components and exit the electronic device. The shield is made from a metal, and when the shield covers a circuit board, the shield protects an EMI barrier for integrated circuits located on the circuit board. Moreover, the shield can provide a single-piece, monolithic body that provides advantages over multiple shields, such as eliminating gaps in the shield for air leakage and EMI intrusion, increasing air circulation efficiency, and decreasing costs.

To provide an electronic control device capable of suppressing leakage of radio-frequency radiation noise, radiated from a noise source, to the outside. The electronic control device includes a radio-frequency circuit 104 at least a part of which is driven at a radio frequency, a printed circuit board 101 on which a low-frequency circuit 103 that is driven at a low frequency is mounted, a housing 100 made of metal that includes therein the printed circuit board 101 together with the radio-frequency circuit 104 and the low-frequency circuit 103, a plurality of radio-frequency connectors 106a to 106f for transmitting and receiving signals related to the radio-frequency circuit 104 mounted on the printed circuit board 101 to and from the outside of the housing, a low-frequency connector 105 for transmitting and receiving signals related to the low-frequency circuit 103 mounted on the printed circuit board 101 to and from the outside of the housing, and a partition wall 203 for suppressing propagation of radiation noise, radiated by driving the radio-frequency circuit 104, to the low-frequency connector 105.

According to various aspects, exemplary embodiments are disclosed of board level shields. In an exemplary embodiment, a board level shield (BLS) includes a fence and a lid. The fence is solderable to a printed circuit board (PCB). When the lid is engaged to the fence that has been soldered to the PCB, the BLS provides substantial electromagnetic interference (EMI) shielding protection to the components covered by the BLS. The lid may be constructed of a frame and a cover. The cover may be a film or foil. The lid may attach to the fence via a one way directional latching mechanism, which may be enhanced by the use of one or more interior downward tabs on the lid that meet one or more inward protrusions from the fence to create pressure on the lid and fence.