A receiving device includes a shield case which is in a hollow box shape that is open on one side. The shield case reduces external interfering signals which interfere with an input signal of a broadcast wave. A printed wiring board includes a conductive portion that is electrically connected with an electronic component. A soldered portion is formed along a protrusion-free linearly extending side of an opening edge of the shield case. The soldered portion electrically connects with solder the shield case and the conductive portion.

A housing has electrically conductive top and bottom parts which together form an accommodation chamber. A circuit board is arranged in the accommodation chamber. A bottom side of the circuit board is connected electrically to the top side via conductive bores. The circuit board has circuit components and electromechanical plug components for connecting to components outside the housing. A first electrically conductive separating wall electrically connects the housing top part to the top side of the circuit board. A second electrically conductive separating wall electrically connects the housing bottom part to the bottom side of the circuit board. The first and second separating walls subdivide the accommodation chamber into first and second accommodation-chamber sections that are disposed on opposite sides of the first and second separating walls. The circuit components are accommodated only in the first accommodation-chamber section and the plug components are accommodated only in the second accommodation-chamber section.

A radar apparatus includes a board, a high-frequency integrated circuit mounted to the board, a metallic housing arranged to face the high-frequency integrated circuit, and a radio-absorbing and heat-dissipating unit. The radio-absorbing and heat-dissipating unit includes a radio-absorbing and heat-dissipative gel. The radio-absorbing and heat-dissipating unit is configured to cover at least part of the high-frequency integrated circuit and to be in contact with the metallic case.

A semiconductor device includes a first case, a second case coupled to the first case to form an inner space, a memory module disposed within the inner space, and including a module substrate and a plurality of electronic components mounted on the module substrate, and a heat dissipation chamber assembly provided in at least a portion of the first case, and including a heat diffusion chamber in thermal contact with at least one of the electronic components and a sidewall structure extending vertically toward the module substrate to surround the electronic component in thermal contact with the heat diffusion chamber.

A shield can for an electronic eyewear device is described that reduces RF signals emanating from the electronic eyewear device. The shield can is attached to a ground plate of the electronic eyewear device using leaf springs on a side of the shield can. The leaf springs do not add to the stack-up thickness of the shield can assembly and provide a balanced force against the ground plate. The shield can is attached to a printed circuit board and encompasses radio frequency (RF) electronic components to prevent RF signals emanating from the RF electronic components. The leaf springs have a pair of fingers providing the balanced mechanical point force. A conductive pressure sensitive adhesive is also provided to secure a top surface of the shield can to the ground plate along with a thermal paste.

A method for providing wireless telecommunications. The method includes providing a modular remote radio unit (RRU) capable of wirelessly transmitting data, placing the modular RRU on a boom truck with a boom arm, transporting the remote radio unit to a deployment location, setting the modular RRU on a structure at the deployment location by lifting the modular RRU off the boom truck with the boom arm, electrically coupling a power input of the modular RRU to a power source to power the modular RRU, and transmitting and receiving wireless data with the modular RRU unit after the power input is coupled to the power source.

Electromagnetic shields for sub-modules of electronic modules are disclosed. Electronic modules may include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged to conformally cover the sub-modules as well as portions of the substrate that are uncovered by the sub-modules. Electromagnetic shields are disclosed that are configured to extend between sub-modules to form one or more divider walls. The one or more divider walls may be configured to extend below mounting surfaces of electronic components in the sub-modules to provide improved reduction of electromagnetic interference (EMI) or crosstalk between various sub-modules. Electromagnetic shields are also disclosed that form perimeter sidewalls that extend below mounting surfaces of electronic components of sub-modules to provide improved reduction of EMI from other modules or other external sources.

An inverter system for a drive train of a motor vehicle is disposed in a multi-part housing. The inverter system includes a control board which can be connected via control cable connections to control lines, DC link capacitors, power semiconductors, control units, and current transformers. The housing is formed with an electronics level, a power level and a connection level. The interior of the housing has a plurality of zones in which different conditions prevail with regard to temperature and/or EMC shielding.

A control module for a vehicle with at least one electric motor and a transmission is provided. The control module has a housing for receiving transmission control electronics and converter electronics for controlling an electric motor. The control module also has a heat sink. The housing includes a housing upper part and a housing lower part. The heat sink is arranged between the housing upper part and the housing lower part such that the heat sink forms a part of the housing. The transmission control electronics are surrounded by a plastic sheathing. The transmission control electronics and the plastic sheathing form the housing upper part. The converter electronics are thermally conductively connected to the heat sink, and the housing upper part is thermally conductively connected to the heat sink in such a way that a heat transfer occurs from the transmission control electronics to the edge of the heat sink.

Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate. An inductor may be positioned in the substrate. Electromagnetic interference (EMI) shield elements may be positioned within the substrate and surrounding the inductor. Other embodiments may be described or claimed.