An electronic apparatus includes a first circuit board, a second circuit board, one or more electronic components, an enclosure portion, and a second housing. The electronic components are mounted on at least one of opposing surfaces of the first circuit board and the second circuit board that oppose each other. The enclosure portion supports a surface of each of the first circuit board and the second circuit board to oppose each other with a predetermined gap therebetween. The enclosure portion encloses a gap space that includes the one or more electronic components within a space between the first circuit board and the second circuit board. The second housing accommodates the first circuit board, the second circuit board, and the enclosure portion. The enclosure portion contacts the housing.

This disclosure describes an electronic component comprising a package base and a metallic cap. The metallic cap separates the enclosure into at least a first compartment and a second compartment. An electronic chip is in the first compartment, and the metallic cap separates the enclosure into the first and second compartments with its shape which forms a separator which extends from the ceiling of the first compartment toward the mounting plane of the electronic chip.

Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate. An inductor may be positioned in the substrate. Electromagnetic interference (EMI) shield elements may be positioned within the substrate and surrounding the inductor. Other embodiments may be described or claimed.

An antenna device may include an antenna element, a planar grounding element, a first connecting element, and a second connecting element. The antenna element includes a radiator arm, a shorting arm, and a feeder arm, the shorting arm and the feeder arm being coplanar to and extending from a first edge of the radiator arm, the feeder arm extending parallel to the shorting arm. The first connecting element connects the shorting arm of the antenna element to the planar grounding element to position the antenna element and the planar grounding element in separate parallel planes. The second connecting element extends from and perpendicular to the feeder arm of the antenna element.

Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate. An inductor may be positioned in the substrate. Electromagnetic interference (EMI) shield elements may be positioned within the substrate and surrounding the inductor. Other embodiments may be described or claimed.

A frame includes a plurality of walls each having a first end and a second end facing away from each other along a first direction, and a plurality of spring fingers on the second end of one or more walls of the plurality of walls and extending along the first direction. First ends of the plurality of walls define an open bottom, and second ends of the plurality of walls define an open top.

A modular remote radio unit assembly that has a frame assembly, electrical components coupled to the frame assembly and configured to provide wireless data transfer, and a single power input for the electrical components. Wherein, when the power input is coupled to a power source, the electrical components are powered to provide wireless data transfer.

A charging apparatus (2) for a vehicle (1) has a power section (3) and a control signal interface (4) for connecting control signals (102) to the power section (3). A filter circuit (5), in particular an EMC filter circuit, is arranged between the power section (3) and the control signal interface (4). A vehicle (1) having such a charging apparatus (2) also is provided.

A power converter includes a tubular housing having an accommodation space, a first and a second openings. A power module is disposed in the accommodation space and includes a circuit board and a first fastening portion. A bottom cover is formed with a second fastening portion and first bumps, and the bottom cover is pre-positioned on the tubular housing through the second fastening portion engaged with the first fastening portion. A bottom cover is bonded to the first opening through melting the first bumps by ultrasonic welding. A power cable is inserted through the bottom cover and electrically connected to the circuit board. A power socket is coupled to the second opening.

An interface for mitigating electromagnetic interference (EMI) on a printed circuit board (PCB) is disclosed. The PCB can contain circuit components and includes one or more signal planes sandwiched between corresponding ground planes. The PCB has a first and second side and an interface region separating the first and second sides that includes a partition wall projecting outward from the interface region, configured for EMI shielding between the first side and second sides, one or more pairs of input and output pads straddling the interface region on respective first and second sides and configured to accommodate an EMI line filter, and a ground barrier within the printed circuit board under the interface region. A method of mitigating EMI using the interface is also disclosed.