A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.

This air control device for mounter is to solve a problem of realizing an air control device for a mounter capable of providing a secured holding state by a nozzle without damaging a part by adjusting, during vacuum suction, an amount of air to be drawn suitably for the part and the nozzle. This air control device for mounter is configured such that a nozzle n detachably attached to a head module HM of a mounter is connected to a negative pressure region, and a part is suctioned at a distal end of the nozzle n. The head module HM is mounted with a variable throttle mechanism 4, and by using the variable throttle mechanism 4, an amount of air to be drawn into the negative pressure region from the nozzle is adjustable.

Component mounting machine includes head, a device for moving head, transfer unit, and a mounting controller. Circular plate is an example of a container in which paste is placed. The bottom face of circular plate and the upper surface of the side wall have a predetermined height relationship. Height sensor is disposed on the lower face of head. Height sensor measures the height of the upper surface of the side wall of circular plate, which is a measurement point. The mounting controller recognizes the height of the bottom face of circular plate or the height of the surface of coating film disposed on circular plate from the height of the top surface of the side wall of circular plate measured by height sensor.

In a component adsorption nozzle, the nozzle can be attached to both of the in-line shaft and the rotary shaft by utilizing the outside (outer wall) of the nozzle body for attaching to the in-line shaft and utilizing the inside (inner wall) of the nozzle body for attaching to the rotary shaft. Therefore, for a user who owns each of the in-line type and rotary type component mounters, it is not necessary to prepare a nozzle dedicated to each type component mounter and it is possible to reduce the burden required for preparing the nozzle.

A production management device, which manages a production schedule of a component mounting line, executes a remote operation mode for remotely operating a component mounter to perform a test operation according to an input operation of an operator, in addition to an automatic production mode in which an automated replacement operation of an automated replacement robot is managed according to the production schedule to produce a component mounting board. The production management device determines, when in the remote operation mode, whether a feeder configured to supply components necessary for the test operation is set in the component mounter, and when the feeder that supplies the necessary components is not set in the component mounter, moves the automated replacement robot to the component mounter and sets the feeder configured to supply the necessary components in the component mounter to cause the component mounter to perform the test operation.

A chip removing device and a chip removing method are provided. The chip removing device includes: a carrier substrate, a laser generation module, and a blowing module. The carrier substrate carries at least one substrate, and a plurality of chips disposed on the substrate. The laser generation module corresponds to the carrier substrate and is used to apply a laser beam to the chip to reduce the bonding force between the chip and the substrate. The blowing module is disposed above the carrier substrate and close to the substrate for applying a gas to the chip to blow the chip away from the substrate.

A pick arm for a pick and place apparatus for electronic devices has a main body having a proximal end whereat the pick arm is mountable onto a pick arm support, and a distal end at which a collet is mounted for holding an electronic device. A first rigid body is located adjacent to the proximal end of the pick arm and a second rigid body is located adjacent to the distal end of the pick arm. The first and second flexures connect the first rigid body to the second rigid body. Moreover, the first flexure is spaced from the second flexure, and the first and second flexures have opposing faces that are arranged substantially parallel to each other. An actuator is operative to apply a biasing force onto the second rigid body so as to bend the first and second flexures relative to the first rigid body for biasing the collet of the pick arm to move.

In the measurement device, electrical characteristics of a component can be measured adequately even if the component size is small. In the measurement device, at least a part of the component holding section is an antistatic section made of an antistatic material. Since the surface resistance of the antistatic section is large, it is possible to measure the electrical characteristics of a component in a state where the component is held by the antistatic section. Therefore, even if the size of the component is small, scattering of the component is prevented and the electrical characteristics can be adequately measured.

A malfunction determining device includes a head including a pickup member for picking up a component, a moving device configured to move the head, an inspection section, a determining section, and a notification section. The inspection section executes multiple inspections including a first inspection for performing a mounting operation under control of the head and the moving device to inspect whether the mounting operation is good or bad, and a second inspection for performing a calibration measurement of the head to inspect whether the calibration measurement is good or bad. The determining section determines presence or absence of a malfunction and a malfunction location in the head and the moving device based on a combination of results of the multiple inspections.

A drying device includes a recessed portion into which a suction nozzle is inserted, an air jetting port that is formed on a bottom surface of the recessed portion, and a control device that jets air from the jetting port toward a suction nozzle inserted into the recessed portion.