A component supply device including a main body provided with an introducing region into which a component supply tape holding components is introduced and configured to supply the components by sending the component supply tape introduced into the main body via the introducing region in a longitudinal direction of the component supply tape. The device comprises a tape supporter insertable into the introducing region while supporting the component supply tape, and a clamping mechanism configured to sandwich and hold at least a part of a supported part of the component supply tape supported by the tape supporter with respect to the tape supporter. The component supply tape is introduced into the main body by inserting the tape supporter into the introducing region with the component supply tape held by the clamping mechanism.

In the component mounting system, when an electronic component having a positioning target is held and mounted onto the upper face of a board, the positioning target is aligned to a predetermined position of the board. The component mounting system detects a positional deviation of the positioning target on the upper face of the electronic component and performs an arrangement operation of arranging a positioning material on the board by correcting the arrangement position in accordance with the detected positional deviation. The component mounting system then performs a mounting operation for mounting the electronic component on the board by aligning the positioning target to the predetermined position of the board on which the positioning material has been arranged.

A component mounting system includes a head to revolve multiple suction nozzles in a circumferential direction, a lifting and lowering device configured to lift and lower a suction nozzle at a predetermined revolving position, a storage device configured to store any one of multiple pieces of directionality information in association with identification information of the suction nozzle, and a control device configured to acquire corresponding directionality information from the storage device based on the acquired identification information of the suction nozzle and to perform pickup of the component supplied from the component supply device at the spinning position in accordance with the directionality information.

A substrate work machine for repeatedly performing substrate work, the substrate work machine including a data storing section configured to store component data used in the substrate work, the component data including shape data related to a shape of an electronic component to be mounted on a substrate, a reference value and a tolerance; a data determining section configured to determine whether a difference between measurement data acquired by measuring the electronic component during the substrate work and the reference value of the component data is within a range of the tolerance; a quality information acquiring section configured to acquire work quality information related to a performance condition of a second substrate work machine; and a data correcting section configured to correct at least one of the reference value and the tolerance in accordance with the work quality information.

A component mounter includes a state recognition section configured to recognize a supply state of a component in a supply area based on a feature amount including at least one of a shape and an angle of each of multiple feature portions in image data on which image processing has been executed. The state recognition section determines whether one or more candidate feature portions included in a search range belong to an identical component together with a reference feature portion based on one of feature amounts of the candidate feature portion and a positional relationship between the reference feature portion and the candidate feature portion.

In an electrical characteristic acquisition apparatus, a condition under which an electrical characteristic of a target object is acquired can be inputted by an operator, and an electrical characteristic of the target object is acquired under the input condition. In a case where a condition is inputted as a condition under which an electrical characteristic of the target object is acquired, an erroneous determination is made due to the different conditions that the target object is not an electrical component which complies with the nominal value, or, in a case where a difference between a value representing an electrical characteristic of the target object and a nominal value of the target object is larger than a permissible tolerance, an erroneous determination is made that the target object is defective. Here, these erroneous determinations are prevented from being made.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The placement head includes a plurality of controllers, each of the plurality of controllers being configured to control a respective one of the plurality of pipettes.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The component placement system also includes a vacuum source for providing vacuum to each of the plurality of pipettes for holding a component. The component placement system also includes a positive fluid source for selectively providing a positive fluid pressure for releasing the component from a respective one of the plurality of pipettes.

An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.

An ejector unit for detaching an electronic element from an adhesive carrier has an ejector housing with a supporting deck, a light source disposed therein and an ejector lens. The ejector lens has a protruding face. The ejector lens is disposed and oriented with an optical axis extending between the light source and an opening in the supporting deck, and the protruding face of the lens directed towards the opening. The ejector lens is movable relative to the supporting deck along the optical axis to project the protruding face through the opening against the electronic element for lifting the electronic element.