A component feeding system including: a stage configured to support components in a scattered state; a holding tool configured to pick up and hold the component scattered on the stage; an imaging device configured to image the components scattered on the stage; and a control device configured to acquire, based on image data of the imaging device, a pickup possible component quantity that is a quantity of components that can be picked up by the holding tool from among the components scattered on the stage.

A maintenance management device comprises: an inspection device configured to inspect an exchangeable element in a component mounting machine configured to mount a component on a circuit board; and an information management section configured to store statistical information in which results of multiple inspections with the inspection device are linked to identification information for each of multiple exchangeable elements targeted for inspection.

A component mounting system is a system in which a mounting machine and an inspection device are connected to a management device so as to enable data communication therewith. The mounting machine includes a mounting analysis unit that acquires suction position shift data for each component mounting operation of a mounting head. The inspection device includes an inspection analysis unit that acquires mounting position shift data corresponding to each of a plurality of target mounting positions. The management device includes a mark generating unit and a display unit. Based on each suction position shift data and each mounting position shift data, the mark generating unit generates a suction shift mark and a mounting shift mark each of which visualizes the direction and the size of a positional shift. The display unit displays each suction shift mark or each mounting shift mark at each marking position on board graphics.

An electronic circuit component mounting head which mounts electronic circuit components to a circuit substrate is provided. The mounting head includes a rotating/raising/lowering axis held on a head main body as to be capable of rotation and of being raised/lowered, a suction nozzle held on the rotating/raising/lowering axis as to be capable of being raised/lowered and not capable of being rotated relatively, and the rotating/raising/lowering axis and suction nozzle can be rotated as necessary by an electric motor. A raising/lowering driving member is held on head main body as to be capable of being raised/lowered, and is raised/lowered by a first linear motor. A first engaging section of the raising/lowering driving member is engaged with the rotating/raising/lowering axis, and a second engaging section of a second linear motor is held on the raising/lowering driving member engaged with suction nozzle.

There is provided technology which is a component mounting machine which mounts electronic components onto a circuit substrate and is capable of displaying a movable region of an inner portion of the component mounting machine within a same image. The component mounting machine is provided with a fixed camera which monitors the inner portion of the component mounting machine and a display section which is capable of displaying a captured image of the fixed camera. The fixed camera is capable of imaging a range from a pickup position at which the suction nozzle picks up the electronic component which is supplied from the component feeder to a mounting position at which the electronic component is mounted onto the circuit substrate within the same image.

A component mounting device includes a head unit including a mounting head configured to mount a component on a substrate, a component feeder configured to feed the component to the mounting head, and an imager provided on the head unit and configured to be able to image a component feeding location of the component feeder from a plurality of directions. The component mounting device further includes a controller configured to acquire a horizontal position and a vertical height position of the component at the component feeding location based on images of the component feeding location captured from the plurality of directions by the imager.

A component mounting machine includes a tool station and a determination section. The tool station detachably accommodates a holding member including a main body section which can hold a component to be mounted on a board and multiple identification sections which can identify multiple accommodation angles. The determination section determines an angle difference in which the accommodation angle of the holding member differs from a predetermined accommodation angle. At least one identification section of the multiple identification sections is defined as a first identification section, the at least one identification section being exposed when the accommodation angle of the holding member is the predetermined accommodation angle in a close state in which the multiple identification sections are partially covered by a shielding member. When the determination section cannot recognize the first identification section in the close state, the determination section attempts to recognize a second identification section.

A nozzle managing system in which suction nozzles can be suitably transferred is provided. A nozzle managing machine includes a tray holding section that holds a tray, a palette accommodation device as a nozzle stocker, and a nozzle transfer device that transfers the suction nozzles between the tray and the palette accommodation device. In addition, the nozzle managing machine acquires tray information that is information indicating the tray T held in the tray holding section, acquires nozzle information corresponding to the tray T on the basis of the tray information and JOB information stored in a memory section of a host PC, and controls the nozzle transfer device on the basis of the nozzle information.

Based on the measured values of the electrical characteristics of multiple components including a component positioned in the middle among many components held on the component tape, it is possible to more accurately estimate the electrical characteristics of the many components as compared with the case based on the measured value of the electrical characteristic of a component positioned at the leading end. Also, based on the statistically processed results of these measurement values, it is possible to appropriately evaluate the electrical characteristics of many components. Further, if the electrical characteristics of all of the components are measured, the evaluation can be performed more appropriately.

An electronic component mounting device is provided for mounting a plurality of electronic components, the plurality of the electronic component being placed in a predetermined portion, on a plurality of attachments each arranged at a predetermined interval from one another. The electronic component mounting device includes a removal mechanism for removing some of the plurality of the electronic components having been placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components so that intervals between the electronic components adjacent to one another are, respectively, the predetermined interval before reaching the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.