A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board. The component mounting device picks up the component, images a lower surface of the picked-up component, temporarily loads the picked-up component on a target temporary loading position to a temporary loading stand which is corrected based on a pickup deviation amount of the component to be recognized based on a lower surface image of the imaged component. Subsequently, the component mounting device images an upper surface of the temporarily loaded component, picks up again the component which is temporarily loaded on the temporary loading stand, and images a lower surface of the re-picked up component. Then, the component mounting device mounts the re-picked up component on a target mounting position of the board corrected based on a positional deviation amount of the feature portion.

According to various embodiments of the disclosure, an aligning device may include a body part including a body and a mask plate, wherein the body is configured to receive a movement by a first moving part and includes a body hole and the mask plate is configured to receive a movement by a second moving part and includes a mask plate hole and a head part disposed on the body part and configured to receive a movement by a third moving part. The mask plate may be disposed between the body and the head part and is configured to receive the movement by the second moving part to move between the body and the head part.

An allowable value setting device sets an allowable value of a deviation amount between a target pickup position and an actual pickup position in a component when the component is picked up by a suction nozzle. The allowable value setting device includes a first setting section and a second setting section. The first setting section sets a first allowable value, which is the allowable value for each component type of the component to be mounted on a board. The second setting section sets a second allowable value, which is the allowable value that is set for each mounting coordinate of the component and smaller than the first allowable value of the component of the same component type set by the first setting section, the second allowable value being preferentially adopted over the first allowable value in a suction process of the component.

A mounting head maintenance device includes an external flow path to communicate with an internal flow path of a mounting head, the mounting head having a nozzle holding section that detachably holds a suction nozzle, the internal flow path that selectively supplies negative pressure air and positive pressure air to the held suction nozzle, and an internal air sensor that is provided in the internal flow path and detects at least one of a flow rate and pressure of the air, a reference air sensor in the external flow path and configured to detect at least one of the flow rate and the pressure of the air, and a detection result acquiring section to acquire an internal detection result of the internal air sensor and a reference detection result of the reference air sensor which can be compared with the internal detection result in association with each other.

A component mounter for mounting electronic components includes a mounting head with at least two suction nozzles in the multiple suction nozzles are lowered simultaneously so as to pick up at least two electronic components simultaneously. A control device, which is configured to control electronic component pickup and mounting operations, causes the mounting head to move so as to position the at least two suction nozzles that are lowered simultaneously in an electronic component pickup operation step to be located individually on at least two trays on the pallet, causes the at least two suction nozzles to be lowered simultaneously, and causes electronic components on the at least two trays to be picked up simultaneously.

A mounting apparatus for mounting a semiconductor chip on a mounting body includes a stage on which the mounting body is placed, a mounting head provided to be movable up and down above the stage and pressing the semiconductor chip against the mounting body, and a film disposition mechanism which interposes a belt-like cover film between the mounting head and the stage, and the film disposition mechanism includes a film feeding part having a feeding reel around which at least the cover film has been wound, a film recovery part having a recovery reel also winding up at least the fed cover film, and one or more relay shafts provided in the course of a path of the cover film from the feeding reel to the recovery reel and by which the cover film is folded back in order to bend a moving direction of the cover film.

A device for removing or repositioning defective and erroneously placed electronic components from circuit boards includes a vacuum suction nozzle, a laser beam and a temperature sensor. The vacuum nozzle has an adaptor tip at which suction is generated. The adaptor tip is larger than the defective or erroneously positioned electronic component. The laser beam is emitted out of the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing or repositioning the defective or erroneously placed electronic component from the circuit board positions the adaptor tip over the electronic component and directs the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then removed or repositioned and remounted on the circuit board.

An electronic component evaluation method is provided for evaluating an electronic component. The electronic component has a lower surface facing a mounting substrate, an upper surface having a flat main surface, and a plurality of mounting terminals configured to be mounted on the mounting substrate. The method includes the steps of: obtaining terminal position information of the plurality of mounting terminals; generating a reference plane including at least three of the plurality of mounting terminals in response to the terminal position information; and detecting a height of at least one of the upper surface or the lower surface relative to the reference plane.

A component mounter provided with head, a device for moving head, transfer unit, and a mounting controller. Round plate is an example of a container for paste. The mounting controller, in the first operation mode, images components held by multiple nozzles using an imaging device before transfer is performed, and recognizes the position and/or orientation of each component based on the image of each component. Further, the head and the head moving device are controlled based on the position and/or orientation of each component such that a coating layer is transferred to connection terminals of each component at a transfer area of each of the components set in advance that does not include a margin based on the holding deviation of each component.

A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a retry performing section to determine whether to perform a retry operation of attempting to pick up the component again using the component mounting tool based on a detection result of the component detecting section and a detection result of the holding detecting section, and to perform the retry operation in accordance with a result of the determining of whether to perform the retry operation.