An electronic circuit component mounting head which mounts electronic circuit components to a circuit substrate is provided. The mounting head includes a rotating/raising/lowering axis held on a head main body as to be capable of rotation and of being raised/lowered, a suction nozzle held on the rotating/raising/lowering axis as to be capable of being raised/lowered and not capable of being rotated relatively, and the rotating/raising/lowering axis and suction nozzle can be rotated as necessary by an electric motor. A raising/lowering driving member is held on head main body as to be capable of being raised/lowered, and is raised/lowered by a first linear motor. A first engaging section of the raising/lowering driving member is engaged with the rotating/raising/lowering axis, and a second engaging section of a second linear motor is held on the raising/lowering driving member engaged with suction nozzle.

An electronic component mounting device is provided for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion. The electronic component mounting device comprises a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

A placement head for automatically placing electronic components on a component carrier. The placement head has a chassis; a first rotor assembly that is mounted so that it is rotatable relative to the chassis about a first axis of rotation and that has a first quantity of first handling devices; and a second rotor assembly that is mounted so that it is rotatable relative to the chassis about a second axis of rotation and that has a second quantity of second handling devices. Each handling device includes a sleeve to which a component holding device for temporarily picking up a component can be attached, and a drive device with a linear drive for moving the sleeve along its longitudinal axis, and a rotary drive for rotating the sleeve about its longitudinal axis. Furthermore, a placement machine with such a placement head and a method for automatic assembly of a component carrier using such a placement head.

A pick-and-place dispensing head comprises: a body structure having a z-axis motor attachment location and a linear track; a z-axis motor attached to the body structure at the axis motor attachment location, the z-axis motor configured to exact movement in a z-axis; a body attached to the linear track and operably connected to the z-axis motor such that the body moves along the linear track when the z-axis motor is actuated; a theta motor operably connected to the first body; a receiving location operably connected to the body; and an optical detector extending from the first body configured to detect upward z-axis movement of a received pick-and-place spindle relative to the body.

A mounting order determination device for determining a mounting order of multiple electronic components prior to mounting work using a component mounting machine or a component mounting line, the mounting order determination device including a level setting section for setting level information, in which mounting order priorities are ranked, for each component type, the target of which being of at least one of a multilayer mounting component type group, including a component type of multiple electronic components having a possibility of being mounted in the up-down direction in layers, and a close-proximity mounting component type group.

A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.

A component mounting machine including a head provided with multiple nozzles to pick up the components; a raising and lowering device to individually raise and lower the multiple nozzles; a moving device to move the head relative to the board in a plane perpendicular to a raising and lowering direction of the nozzles; and a control device to perform, as a pickup operation for causing the nozzle to pick up a component, a first pickup operation of controlling the moving device and the raising and lowering device so as to lower a single one of the nozzles above the component supply section to pick up one of the components using that nozzle, and a second pickup operation of controlling the moving device and the raising and lowering device so as to simultaneously lower multiple of the nozzles above the component supply section to pick up multiple of the components simultaneously using the multiple nozzles.

A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes a main body and a plurality of picking portions. The picking portions connect with and protrude from the main body. Each of the picking portions has a first surface. The first surfaces are away from the main body and configured to pick up the micro elements. The main body has a second surface at least partially located between the picking portions. Each of the first surfaces has a first viscosity. The second surface has a second viscosity. The second viscosity is less than the first viscosity.

Each of multiple component mounting machines constituting a component mounting line is configured to switch between a production mode in which a component is mounted on a circuit board that has been conveyed in and then conveyed out, a mounting accuracy measurement mode in which a mounting accuracy measurement component is mounted at a predetermined position on a mounting accuracy measurement board and the mounting accuracy is measured, and a pass mode in which a component is conveyed out without being mounted on the board conveyed in. When the control mode of two or more component mounters among the multiple component mounting machines is the mounting accuracy measurement mode, the mounting accuracy is measured by conveying the mounting accuracy measurement board along the board conveyance path, and the two or more component mounting machines sequentially use the mounting accuracy measurement board to measure the mounting accuracy.

The present disclosure includes a first holding mechanism which has a pair of first members relatively movable in a first direction, and can hold an electronic component by pinching the electronic component in the first direction by the pair of first members, and a second holding mechanism which has a pair of second members relatively movable in a second direction, and can hold the electronic component by pinching the electronic component in the second direction by the pair of second members. A controlling device controls operations of the first and second holding mechanisms so that the electronic component is released from the first holding mechanism after or in the middle of holding the electronic component by the second holding mechanism in a state where the electronic component is held by the first holding mechanism.