Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.

A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.

Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.

The present invention relates to an electrically conductive paper structure and a method for its production, as well as the use of the electrically conductive paper structure, for example as a heating element.

Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

An anisotropic conductive film of the present invention has a structure in which conductive particles are dispersed or arranged in a regular pattern in an insulating binder layer. A low-adhesive region having a lower adhesive strength than that of the insulating binder layer is formed at a part of a surface of the anisotropic conductive film. The low-adhesive region is a region where a recess portion formed in the insulating binder layer is filled with a low-adhesive resin.

Structures and manufacturing processes of an ACF array and more particularly a non-random particles are transferred to the array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a block copolymer composition onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film.

A display device includes a display panel including a plurality of pad electrodes, a driving member attached to the display panel and including a plurality of bumps facing the plurality of pad electrodes, respectively, a plurality of conductive particles interposed between the display panel and the driving member, and a plurality of alignment electrodes separated from the plurality of pad electrodes and the plurality of bumps, where an opening is defined in at least one of a pad electrode of the plurality of pad electrodes and a bump of the plurality of bumps includes an opening, and an alignment electrode of the plurality of alignment electrodes is disposed in the opening.

A display device includes a display panel including a plurality of pad electrodes, a driving member attached to the display panel and including a plurality of bumps facing the plurality of pad electrodes, respectively, a plurality of conductive particles interposed between the display panel and the driving member, and a plurality of alignment electrodes separated from the plurality of pad electrodes and the plurality of bumps, where an opening is defined in at least one of a pad electrode of the plurality of pad electrodes and a bump of the plurality of bumps includes an opening, and an alignment electrode of the plurality of alignment electrodes is disposed in the opening.