A multi-layer circuit board is formed multiple layers of a catalytic layer, each catalytic layer having an exclusion depth below a surface, where the cataltic particles are of sufficient density to provide electroless deposition in channels formed in the surface. A first catalytic layer has channels formed which are plated with electroless copper. Each subsequent catalytic layer is bonded or laminated to an underlying catalytic layer, a channel is formed which extends through the catalytic layer to an underlying electroless copper trace, and electroless copper is deposited into the channel to electrically connect with the underlying electroless copper trace. In this manner, traces may be formed which have a thickness greater than the thickness of a single catalytic layer.

A power relay assembly is provided. A power relay assembly according to an exemplary embodiment of the present invention comprises: an upper case having at least one electric element mounted on one surface thereof; a lower case coupled to the upper case; and at least one bus bar electrically connected to the electric element, disposed between the upper case and the lower case, and including a bottom portion that is in surface contact with at least one of the upper case and the lower case, wherein at least one side of the bottom portion contacts a portion made of a plastic material having heat dissipation and insulation properties in the upper case and the lower case.

An electro-optical device includes: a liquid crystal panel; a particle aligned type anisotropic conductive film having a plurality of electrically conductive particles that are arranged in a state of being aligned along a first direction and a second direction intersecting with the first direction; and a printed circuit board coupled to a connection terminal portion of the liquid crystal panel via the particle aligned type anisotropic conductive film, wherein the connection terminal portion includes a plurality of connection terminals, a plurality of recessed portions that are arranged in a state of being aligned along a third direction and a fourth direction intersecting with the third direction are formed on a surface of the connection terminal, and at least one of the first direction and the second direction along which the electrically conductive particles are arranged is different in arrangement direction from both the third direction and the fourth direction.

An anisotropic conductive film is capable of preventing a short circuit between terminals even though narrowing of the interval between connecting terminals advances. An electrically conductive support plate supports a base film having one surface with an adhesive layer. An array plate is disposed to face the adhesive layer and has through holes arranged in a pattern corresponding to the array pattern of electrically conductive particles. A spray sprays the electrically conductive particles together with a liquid while applying a voltage to the electrically conductive particles, in which the electrically conductive particles which are charged with an electrical charge are sprayed together with a liquid from the spray while applying a voltage between the spray and the support plate and the electrically conductive particles which have passed through the through holes of the array plate are arranged on the adhesive layer in the array pattern of the through holes.

The present invention provides a dispersion liquid containing silver nano-particles that develops excellent conductivity by low-temperature calcining and has silver nano-particles stably and well dispersed in a dispersion solvent, and a method for producing the dispersion liquid containing silver nano-particles. [solution] A method for producing a dispersion liquid containing silver nano-particles, comprising: mixing a silver compound with amines comprising an aliphatic monoamine (A) comprising an aliphatic hydrocarbon group and one amino group, said hydrocarbon group having 6 or more carbon atoms in total; and further comprising at least one of: an aliphatic monoamine (B) comprising an aliphatic hydrocarbon group and one amino group, said hydrocarbon group having 5 or less carbon atoms in total; and an aliphatic diamine (C) comprising an aliphatic hydrocarbon group and two amino groups, said hydrocarbon group having 8 or less carbon atoms in total; to form a complex compound comprising the silver compound and the amines; thermally decomposing the complex compound by heating to form silver nano-particles; and dispersing the silver nano-particles in a dispersion solvent containing an alcohol-based solvent and an aliphatic hydrocarbon-based solvent in a specific ratio.

A multi-layer circuit board is formed multiple layers of a catalytic layer, each catalytic layer having an exclusion depth below a surface, where the cataltic particles are of sufficient density to provide electroless deposition in channels formed in the surface. A first catalytic layer has channels formed which are plated with electroless copper. Each subsequent catalytic layer is bonded or laminated to an underlying catalytic layer, a channel is formed which extends through the catalytic layer to an underlying electroless copper trace, and electroless copper is deposited into the channel to electrically connect with the underlying electroless copper trace. In this manner, traces may be formed which have a thickness greater than the thickness of a single catalytic layer.

A multi-layer circuit board is formed multiple layers of a catalytic layer, each catalytic layer having an exclusion depth below a surface, where the cataltic particles are of sufficient density to provide electroless deposition in channels formed in the surface. A first catalytic layer has channels formed which are plated with electroless copper. Each subsequent catalytic layer is bonded or laminated to an underlying catalytic layer, a channel is formed which extends through the catalytic layer to an underlying electroless copper trace, and electroless copper is deposited into the channel to electrically connect with the underlying electroless copper trace. In this manner, traces may be formed which have a thickness greater than the thickness of a single catalytic layer.

Provided is photo-sintering nano ink. The photo-sintering nano ink includes a photo-sintering precursor including a conductive nano particle and an oxide film surrounding the conductive nano particle, polymer binder resin, and an adhesive.

A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish.

Provided is an ink for use in manufacturing electronic components via inkjet printing, the ink being capable of stably maintaining silver nanoparticle dispersibility for extended periods, even in the presence of oxygen, and can be sintered to obtain a sintered body exhibiting superior electrical conductivity. The ink according to the present invention is an inkjet printing ink comprising surface-modified silver nanoparticles (A) and a dispersion solvent (B), wherein the (A) are surface-modified silver nanoparticles having a configuration in which surfaces of the silver nanoparticles are coated with a protective agent containing an amine; an amount of the (A) (in terms of silver) is not less than 30 wt. % of the ink; and the (B) comprises a secondary alcohol and/or a tertiary alcohol (b-1), and a hydrocarbon (b-2), wherein a total amount of the (b-1) and the (b-2) is not less than 70 wt. % of a total amount of the dispersion solvent (B).