A multi-layer circuit board is formed multiple layers of a catalytic layer, each catalytic layer having an exclusion depth below a surface, where the cataltic particles are of sufficient density to provide electroless deposition in channels formed in the surface. A first catalytic layer has channels formed which are plated with electroless copper. Each subsequent catalytic layer is bonded or laminated to an underlying catalytic layer, a channel is formed which extends through the catalytic layer to an underlying electroless copper trace, and electroless copper is deposited into the channel to electrically connect with the underlying electroless copper trace. In this manner, traces may be formed which have a thickness greater than the thickness of a single catalytic layer.

A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish.

Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and an opening disposed in the substrate. The opening extends between the first major surface and the second major surface. Tantalum material is disposed within the opening. Further, the tantalum material includes tantalum particles. The electrical component also includes an anode electrode disposed on the first major surface of the substrate and over the opening and a cathode electrode disposed on the second major surface of the substrate and over the opening.

The present invention relates to substrates comprising a network comprising core shell liquid metal encapsulates comprising multi-functional ligands and processes of making and using such substrates. The core shell liquid metal particles are linked via ligands to form such network. Such networks volumetric conductivity increases under strain which maintains a substrate's resistance under strain. The constant resistance results in consistent thermal heating via resistive heating. Thus allowing a substrate that comprises such network to serve as an effective heat provider.

The present invention relates to architected liquid metal networks and processes of making and using same. The predetermined template design technology of such architected liquid metal networks provides the desired spatial control of electrical, electromagnetic, and thermal properties as a function of strain. Thus, resulting in improved overall performance including process ability.

The invention provides a lighting device (1000) comprising (i) a light source (100) configured to generate light source light (101), wherein the light source (100) comprises a solid state light source, and (ii) a support (200) configured to support the light source (100), wherein the support (200) comprises a metal based thermally conductive material (201), wherein the lighting device (1000) further comprises (iii) a layered element (300), configured in physical contact with the support (200), wherein the layered element (300) comprises one or more layers (310), wherein the layered element (300) at least comprises an electrically insulating first layer (311), wherein at least part of the layered element (300) is configured between the light source (100) and the support (200) such that during operation part of the light source light (101) irradiates the layered element (300), wherein the layered element (300) comprises light reflective particles (410), wherein at least 50 wt. % of the particles have a flake-like shape.

A stacked structure includes a circuit board, an electronic component, metallic cores, and insulating cladding layers. The circuit board includes first bonding pads. The electronic component includes second bonding pads that are opposite to the first bonding pads. Each metallic core is connected to a corresponding first bonding pad and a corresponding second bonding pad. The metallic cores have a curved surface interposed between the corresponding first bonding pad and the corresponding second bonding pad. The insulating cladding layers are separated from each other and cover the curved surfaces of the metallic cores.

A power relay assembly is provided. A power relay assembly according to an exemplary embodiment of the present invention comprises: a support plate having at least one electric element mounted on one surface thereof and including a plastic material having heat dissipation and insulation properties; and at least one bus bar electrically connected to the electric element and partially embedded in the support plate. Due to these features, since heat generated from the bus bar and the electric element is dissipated to the outside through the support plate, it is possible to prevent performance deterioration due to heat and breakage of electronic components.

A power relay assembly is provided. A power relay assembly according to an exemplary embodiment of the present invention comprises: an upper case having at least one electric element mounted on one surface thereof; a lower case coupled to the upper case; and at least one bus bar electrically connected to the electric element, disposed between the upper case and the lower case, and including a bottom portion that is in surface contact with at least one of the upper case and the lower case, wherein at least one side of the bottom portion contacts a portion made of a plastic material having heat dissipation and insulation properties in the upper case and the lower case.

A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.