The present invention provides to a wearable smart device having electrical wiring comprising a stretchable conductive composition having excellent in durability such as repeated bending properties and repeated twisting properties, a material for realizing the wearable smart device, and a method for producing the wearable start device. An electrical wiring including a fine line having an electrical line interval of 1 mm or less, preferably the line width of less than 1 mm, is formed by printing a paste for forming a stretchable conductor containing metal-based conductive particles and a non-crosslinked elastomer, and further dried and cured at a low temperature condition of 120 C. for 30 minutes. As a result, the wearable smart device having electrical wiring constituted by fine lines without sagging of the edge is obtained.

This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured.

The application relates to a transparent conductive film (1) according to one embodiment, wherein the first transparent layer (31) having a first pattern of first electrodes is provided, e.g. deposited, on the first side (2a) of a transparent base film (2) and the second transparent layer (32) having a second pattern of second electrodes is provided, e.g. deposited, on the second side (2b) of the transparent base film (2). Further, the application relates to a method for producing a transparent conductive film. Further, the application relates to a touch sensing device and to different uses.

The present invention relates to substrates comprising a network comprising core shell liquid metal encapsulates comprising multi-functional ligands and processes of making and using such substrates. The core shell liquid metal particles are linked via ligands to form such network. Such networks volumetric conductivity increases under strain which maintains a substrate's resistance under strain. The constant resistance results in consistent thermal heating via resistive heating. Thus allowing a substrate that comprises such network to serve as an effective heat provider.

Methods and systems of fabrication of high resolution, high-throughput electrochemical sensing circuits on a substrate. High resolution electrochemical sensing circuits are printed by an effective additive technique to the substrate. Optionally, post-print annealing converts electrochemically inactive printed graphene into one that is electrochemically active. The printing can be by aerosol jet printing, but is not necessarily limited thereto. An example is inkjet printing and then the post-print annealing. Ink formulation would be adjusted for effectiveness with inkjet printing. Optionally biorecognition agents can be covalently bonded to the printed graphene for the purpose of electrochemical biosensing. High throughput fabrication of high-resolution graphene circuits (feature sizes in the tens of microns <50 m) for electrochemical biosensing is possible by chemical functionalization of the graphene surface with a biological agent.

The communication module according to one embodiment of the present invention comprises: a printed circuit board; an antenna unit and electronic components arranged on the printed circuit board; and a sheet layer arranged on the antenna unit and the electronic components, wherein the sheet layer comprises 15-35% of a polymer resin and 65-85 wt % of flat boron nitride, the flat boron nitride has an average particle size (D50) of 40 to 50 m, a D10 of 10 to 25 m, and a D90 of 75 to 85 m, and the 50 of the flat boron nitride is arranged to form an angle of 40 or less with horizontal components of the sheet layer.

In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.

Water-based nanoparticle inks may be formulated to be compatible with printed electronic direct-write methods. The water-based nanoparticle inks may include a functional material (nanoparticle) in combination with an appropriate solvent system. A method may include dispersing nanoparticles in a solvent and printing a circuit in an aerosol jet process or plasma jet process.

An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.

An apparatus, method, and system for post-processing a printed graphene ink pattern or other deposition on a substrate. A pulsed UV laser is tunable between various energy densities to selectively modify the printed ink or deposition in electrical or physical properties. In one example, radical improvements in electrical conductivity are achieved. In another example, controlled transformation from essentially 2D printed or deposited graphene to surface topology of 3D nanostructures are achieved. The 3D structures are beneficial in such applications as electrochemical sensors of different types and characteristics. In another example, hydrophobicity of the printed or deposited graphene can be manipulated starting from a hydrophilic to super hydrophobic surface.