According to one aspect of the present disclosure, a base material for a printed circuit board includes: an insulating base film; a sintered body layer that is layered on at least one surface of the base film and that is formed of a plurality of sintered metal particles; and an electroless plating layer that is layered on a surface of the sintered body layer that is opposite to the base film, wherein an area rate of sintered bodies of the metal particles in a cross section of the sintered body layer is greater than or equal to 50% and less than or equal to 90%.

A membrane circuit board includes a first flexible circuit board, a second flexible circuit board and a nanomaterial layer. The nanomaterial layer includes plural polymeric structures. The nanomaterial layer is formed on the first flexible circuit board, the second flexible circuit board and/or a junction region between the edge of the first flexible circuit board and the second flexible circuit board to prevent at least one of the upper metallic conductor line and the lower metallic conductor line from contacting with a specified chemical element. Consequently, the conductive impedance of the upper metallic conductor line and the lower metallic conductor line is not affected by the specified chemical element. Moreover, the present invention also provides a keyboard device with the membrane circuit board.

There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.

A substrate for a power module (100) of the present invention includes a metal substrate (101), an insulating resin layer (102) provided on the metal substrate (101), and a metal layer (103) provided on the insulating resin layer (102). The insulating resin layer (102) includes a thermosetting resin (A) and inorganic fillers (B) dispersed in the thermosetting resin (A), a maximum value of a dielectric loss ratio of the insulating resin layer (102) at a frequency of 1 kHz and 100 C. to 175 C. is equal to or less than 0.030, and a change in a relative permittivity is equal to or less than 0.10.

The present invention is to solve the problem of residues in nanoimprint lithography without losing the merits thereof, i.e., low cost and high productivity, and provides a metal film formation technique advantageous in pattern accuracy and product reliability over time. A metal film formation method according to the present invention comprises a first step where a nanoimprint lithography material is deposited on an insulating substrate to form an underlayer, a second step where the underlayer is pressed with a mold having protrusions to pattern by nanoimprint lithography, a third step where residues of the underlayer at regions pressed with the protrusions of the mold are evaporated by heating to be removed, and forming a metal film at least on the patterned underlayer. A nanoimprint lithography material according to the present invention contains a catalyst for a metal plating.

A conductive ink for a rollerball pen comprises an aqueous solvent and conductive particles comprising one or more metals dispersed therein at a concentration of at least about 30 wt. %. The conductive particles include conductive flakes and conductive nanoparticles. A dispersant coats the conductive particles at a loading level of at least about 0.1 mg/m2 to about 0.8 mg/m2. A conductive trace deposited on a substrate from a rollerball pen comprises a percolative network of conductive particles comprising one or more metals. The conductive particles include conductive flakes and conductive nanoparticles. The conductive trace has a conductivity of at least about 1% of a bulk metal conductivity and a reflectance of greater than 40%.

Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer.

An evacuated core circuit board (10) for dissipating heat from a heat generating electronic component, the evacuated core circuit board comprising: at least one circuit layer (12) to which the heat generating electronic component (14) is electronically coupled; a base layer (16) a comprising a body structure (19) having a substantially hollow interior (20); and a dielectric layer (18) provided between at least a portion of the circuit layer (12) and the base layer (16), wherein the hollow interior (20) is at least partially evacuated.

Provided is a structure that has highly reliable electroconductive pattern regions, that offers an extremely simple manufacturing process, and that has excellent electrical insulation between the electroconductive pattern regions. This structure (10) having electroconductive pattern regions is provided with a support (11), and, on a surface configured by the support, a layer (14) in which insulation regions (12) containing a copper oxide- and phosphorus-containing organic substance and electroconductive pattern regions (13) containing copper are disposed next to one another. This stack is provided with: a support, a coating layer containing copper oxide and phosphorus and disposed on a surface configured by the support; and a resin layer disposed so as to cover the coating layer.

A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350 C. to 250 C. via a lowering temperature rate of 1 to 4 C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.