This heat dissipation circuit board includes a metal substrate, an insulating layer provided on at least one of the surfaces of the metal substrate, and a circuit layer provided on the opposite surface to the metal substrate of the insulating layer. The insulating layer contains a resin that is selected from polyimide, polyamide-imide, and the mixture thereof, and ceramic particles having a specific surface area of 10 m.sup.2/g or more. The ceramic particles form agglomerates, and the amount of the ceramic particles is in the range of 5 vol % or more and 60 vol % or less.

[Summary]

The present invention relates to a multilayered printed circuit board having excellent durability while having a thin thickness, a method for manufacturing the same, and a semiconductor device using the same.

This heat dissipation circuit board includes a metal substrate, an insulating layer provided on at least one of the surfaces of the metal substrate, and a circuit layer provided on the opposite surface to the metal substrate of the insulating layer. The insulating layer contains a resin that is selected from polyimide, polyamide-imide, and the mixture thereof, and ceramic particles having a specific surface area of 10 m.sup.2/g or more. The ceramic particles form agglomerates, and the amount of the ceramic particles is in the range of 5 vol % or more and 60 vol % or less.

A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D.sub.50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 m with an average particle diameter (D.sub.50) of 500 nm to 20 m, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

A flame retardant is included in a resin phase, and the flame retardant has a maximum number frequency in a range of 1 m or less when a particle size distribution is evaluated by dividing a particle size into 1 m increments. The resin phase includes inorganic particles, and the inorganic particles have a maximum number frequency in a range of 0.5 m or less when the particle size distribution is evaluated by dividing the particle size into 0.5 m increments. The flame retardant has an average particle size larger than the average particle size of inorganic particles. The number frequency of the flame retardant and the inorganic particles, respectively, decreases with increasing the particle size.

A display apparatus includes a display panel, a driving integrated circuit (IC), and an anisotropic conductive film. The display panel includes a non-display area adjacent to a display area and an upper substrate and a lower substrate. The driving IC overlaps the non-display area. The anisotropic conductive film attaches the driving IC to the lower substrate and includes conductive balls with diameters that gradually increase toward the display area.

A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 ?m and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 ?m. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.

A display apparatus includes a display panel, a driving integrated circuit (IC), and an anisotropic conductive film. The display panel includes a non-display area adjacent to a display area and an upper substrate and a lower substrate. The driving IC overlaps the non-display area. The anisotropic conductive film attaches the driving IC to the lower substrate and includes conductive balls with diameters that gradually increase toward the display area.

Provided are a metal-base circuit board having excellent solder crack resistance, thermal conductivity, adhesive property, and insulation property and a resin composition for a circuit board used for the metal-base circuit board. A resin composition for a circuit board comprises a vinylsilyl group-containing polysiloxane (having a vinylsilyl group equivalent of 0.005 to 0.045 mol/kg) comprising (A) a dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 30,000 to 80,000 and (B) a side-chain dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 100,000 or more, a hydrosilyl group-containing polysiloxane (having a hydrosilyl group equivalent of 6 mol/kg or more), and an inorganic filler at 60 to 80% by volume. The mass ratio of (A) to (B), (A)/(B), is 80/20 to 30/70, and the molar ratio of (C) a hydrosilyl group to (D) a vinylsilyl group, (C)/(D), is 2.5 to 5.0.

An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.