The invention relates to a process of fabricating a beaded path on the surface of a substrate, the process comprising: preparing a dispersion of particles in a liquid; supplying the prepared dispersion to at least one electrically conductive microcapillary in a continuous manner; forming and maintaining a convex meniscus of the dispersion at the outlet end of the microcapillary positioned above and/or below the surface of a substrate; applying alternating voltage to the microcapillary so that a beaded structure is formed between the dispersion meniscus and the surface of the substrate; and moving the microcapillary relative to the substrate and/or the substrate relative to the microcapillary so as to deposit the particles of the formed beaded structure on the surface of the substrate and simultaneously rebuild the beaded structure formed between the dispersion meniscus and the surface of a substrate. The invention also relates to a system for realizing this process and the use of the beaded path fabricated in accordance with the process of the invention for the production of electrodes in photovoltaic cells, new generation clothing, electronic components, including flexible electronics, artificial flagella, photonic and optomechanical materials, as well as for the regeneration of damaged paths on the surface of a substrate. The present invention also relates to a kit comprising a substrate and a beaded path fabricated on the surface of that substrate according to this process. The invented process is simple, efficient, hence economical, and enables fabricating beaded paths that retain their properties after turning off the voltage initially used to form a beaded structure. Moreover, the process occurs outside a liquid environment and enables fabricating of paths in a continuous manner, that is, through the formation of the beaded structure and its simultaneous depositing on the surface of a substrate allowing the fabrication of beaded paths of arbitrary length.

A printed circuit board includes a substrate and wiring provided on a surface of the substrate and including a cured conductive paste. The conductive paste contains metal nanoparticles having an average particle diameter of 30 nm or more and 600 nm or less, metal particles having an average particle diameter larger than that of the metal nanoparticles, a thermosetting resin having an oxirane ring in a molecule, a curing agent, and a cellulose resin. The wiring has a width of 0.3 mm or more and 6 mm or less, a thickness of 10 μm or more and 40 μm or less, and a resistance value of 500 mΩ/m or more and 5000 mΩ/m or less, and a welding strength of the electronic component to the substrate is 30 N or more.

A method for repairing a fine line is provided. Nano metal particles are filled in a defect of a circuit board. The nano metal particles in the defect are irradiated by a laser, or heated, such that the nano metal particles in the defect are metallurgically bonded to an original line of the circuit board. A surface of the circuit board is cleaned to remove residual nano metal particles on parts of the circuit board where metallurgical bonding is not performed, thereby completing line repairing of the circuit board.

This invention is a flexible conductive ink composition comprising (A) a resin binder, (B) silver-plated core conductive particles, and (C) conductive particles having a surface area at least 1.0 m.sup.2/g.

The device intended to be thermoformed comprises a substrate capable of being thermoformed and an electrically conductive member integral with the said substrate. The electrically conductive member comprises: electrically conductive particles, an electrically conductive material, electrically conductive elements of elongated shape. The electrically conductive material has a melting point which is strictly less than the melting point of the electrically conductive particles and than the melting point of the elements of elongated shape.

A multilayer wiring board includes first and second insulating layers, a first conductive wiring layer on the first insulating layer, a second conductive wiring layer on a surface of the second insulating layer facing the first insulating layer, an interlayer connection conductor including an intermetallic compound and penetrating through the first insulating layer to interconnect the first and second conductive wiring layers, a first intermetallic compound layer between the first conductive wiring layer and the interlayer connection conductor, and a second intermetallic compound layer between the second conductive wiring layer and the interlayer connection conductor, wherein the intermetallic compounds in the first and second intermetallic compound layers have a composition different from that of the intermetallic compound in the interlayer connection conductor, and the first intermetallic compound layer is located at a level different from a level of an interface between the first conductive wiring layer and the first insulating layer.

A sheet-shaped stretchable structure including stretchable resin sheets laminated together is provided. A conductive layer may be disposed at least at one of several positions. For example, the conductive layer may be disposed between any two adjacent ones of the laminated stretchable resin sheets. The conductive layer may be disposed on a top surface of an uppermost one of the laminated stretchable resin sheets. Further, the conductive layer may be disposed on a bottom surface of a lowermost one of the laminated stretchable resin sheets, and a via hole.

This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured.

Provided is a circuit board for reducing a likelihood of so-called through-hole disconnection, and enhancing connection reliability on both sides of a substrate via a through-hole. The circuit board has a substrate with the through-hole, a first conductive part covering an opening of the through-hole on one surface of the substrate in a manner blocking the opening, having a portion inserted into the through-hole from the one surface, and a second conductive part covering a second opening of the through-hole on the other surface of the substrate in a manner blocking the second opening, having a portion inserted into the through-hole from the other surface. The portion of the first conductive part inserted in the through-hole has a columnar shape forming a columnar portion having a diameter smaller than the through-hole. The portion of the second conductive part inserted in the through-hole has a shape that fills a gap between the columnar portion of the first conductive part and an inner surface of the through-hole. Both of the first and the second conductive parts comprise conductive particles being sintered.

Provided is an electronic device capable of supplying large current to a circuit pattern, without employing a thick film structure for the circuit pattern. The electronic device includes a substrate, a wiring layer placed on the upper surface of the substrate, an electronic component mounted above the wiring layer, and a bonding layer placed between the electronic component and the wiring layer. The wiring layer and the bonding layer are porous layers containing pores. The bonding layer has higher volume density than the wiring layer except underneath the electronic component.