Electronic devices may include a non-conductive housing component, a conductive seed material formed over an external surface of the non-conductive housing component, a bulk conductive contact material formed over the conductive seed material, and an electronic component connected to the bulk conductive contact material and the conductive seed material. Additional related systems, devices, methods are also disclosed.

A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A Ni content in the electroless copper plating layer is 0.01 to 1.2 wt %, and the electroless copper plating layer has a volume resistivity of 6.0 .Math.cm or lower. The copper clad laminate is capable of achieving a good volume resistivity at an electroless copper plating layer of a low dielectric resin film while suppressing a transmission loss when being applied to a flexible circuit board.

A component carrier and a method of manufacturing the component carrier are disclosed. The component carrier includes i) a first exposed conductor area with a first protective layer structure on a first electrically conductive layer structure; and ii) a second exposed conductor area with a second protective layer structure on a second electrically conductive layer structure. The first protective layer structure and the second protective layer structure include a common non-exposed layer structure; and different exposed layer structures.

A substrate for a printed circuit board includes a base film having a main surface and an electrically conductive layer disposed on the main surface. The base film is made of a fluororesin. The electrically conductive layer is a layer including a plurality of electrically conductive particles bonded together. An amount of nitrogen present in the main surface is 0.2 atomic percent or more.

The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.

A copper clad laminate is provided that is capable of achieving a good volume resistivity at an electroless copper plating layer of a low dielectric resin film while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate. The copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHZ, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. An Ni content in the electroless copper plating layer is 0.01 to 1.2 wt %, and the electroless copper plating layer has a volume resistivity of 6.0 .Math.cm or lower.

A substrate structure includes a first substrate, a second substrate, a third substrate, and an electroless metal material. The first substrate includes at least one first consecutive via, at least one first pad, at least one second pad, multiple first nano-metal wires, and multiple second nano-metal wires. The second substrate includes at least one third pad, multiple third nano-metal wires, and at least one second conductive via. The third substrate includes at least one fourth pad, multiple fourth nano-metal wires, and at least one third conductive via. The at least one first pad is electrically connected to the at least one third pad through the electroless metal material. The at least one second pad is electrically connected to the at least one fourth pad through the electroless metal material.

Disclosed are an ultra-thin copper foil with a carrier foil and a method for manufacturing an embedded substrate by using the same, the ultra-thin copper foil with a carrier foil including: a carrier foil; a non-etching release layer on the carrier foil; a first ultra-thin copper foil layer on the non-etching release layer; an etch stop layer on the first ultra-thin copper foil layer; and a second ultra-thin copper foil layer on the etch stop layer.

A wiring board according to the present disclosure includes: a first insulation layer having a first surface; a land conductor located on the first surface; a second insulation layer covering the first surface and the land conductor and having a second surface on a side opposite to the first insulation layer; a via hole penetrating from the second surface of the second insulation layer to the land conductor; and a via hole conductor located in the via hole and in contact with the land conductor. The via hole conductor includes an underlying metal layer and an electrolytic plating layer located on the underlying metal layer, the underlying metal layer being located on a surface of the land conductor, a wall surface of the via hole, and the second surface. A plurality of voids are located in at least a portion of the underlying metal layer.