Provided is a carrier-attached metal foil which has excellent carrier-releasability and excellent selective metal layer-etchability, and can achieve a reduction in transmission loss and resistance in a semiconductor package (for example, a millimeter-wave antenna substrate) manufactured using the same. The carrier-attached metal foil includes: (a) a carrier; (b) a release functional layer on the carrier and including (b1) an adhesion layer disposed closer to the carrier and having a thickness of more than 10 nm and less than 200 nm and (b2) a release assistance layer disposed farther from the carrier and having a thickness of 50 nm or more and 500 nm or less; and (c) a composite metal layer on the release functional layer and including (c1) a carbon layer disposed closer to the release assistance layer, and (c2) a first metal layer disposed farther from the release assistance layer and mainly composed of Au or Pt.

A multilayer resin substrate includes resin layers that are laminated, a first copper foil on the resin layers and including first and second main surfaces having first and second surface roughnesses, respectively, and a second copper foil on the resin layers and including third and fourth main surfaces having third and fourth surface roughnesses, respectively. A distance between the first main surface and the second copper foil is shorter than a distance between the second main surface and the second copper foil. When the first, second, third, and fourth surface roughnesses are denoted as SR1, SR2, SR3, and SR4 respectively, a relationship SR1<SR3≤SR4<SR2 is satisfied.

Provided is a long laminate for a printed wiring board, which has reduced thickness of a resin layer and increased signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer. The long laminate contains a metal layer of a long metal foil, a fluororesin layer containing a fluororesin and contacting the metal layer, and a heat-resistant resin layer containing a heat-resistant resin and contacting the fluororesin layer. Each fluororesin layer is 1 to 10 μm thick. The ratio of the total thickness of the fluororesin layer to the total thickness of the heat-resistant resin layer is 0.3 to 3.0. The sum of the total thickness of the fluororesin layer and the total thickness of the heat-resistant resin layer is at most 50 μm. Also provided are a method for producing the long laminate, and the printed wiring board.

The invention relates to a process for producing a metal-ceramic substrate (1), comprising: providing a ceramic element (10) and a metal layer, providing a gas-tight container (25) that encloses the ceramic element (10), the container (25) preferably being formed from the metal layer or comprising the metal layer, forming the metal-ceramic substrate (1) by connecting the metal layer to the ceramic element (10) by means of hot isostatic pressing, wherein, for the purpose of forming the metal-ceramic substrate (1), an active metal layer (15) or a contact layer comprising an active metal is arranged at least in some sections between the metal layer and the ceramic element (10) for supporting the connection of the metal layer to the ceramic element (10).

A printed wiring board includes a base layer having insulating properties, a first conductive layer directly or indirectly stacked on the base layer front surface, and including a copper foil, a second conductive layer directly or indirectly stacked on the base layer back surface, and including a copper foil, a stacked body for a via hole, the stacked body being stacked on an inner periphery and a bottom of a connection hole that extends through the first conductive layer and the base layer in a thickness direction, and being configured to electrically connect the first conductive layer and the second conductive layer to each other, and having an electroless copper plating layer. Each copper foil contains a copper crystal grain oriented in a plane orientation, and an average crystal grain size of copper of each copper foil is 10 μm or greater, the electroless copper plating layer includes palladium.

A pure copper sheet has a composition including 99.96 mass% or more of Cu, 9.0 mass ppm or more and less than 100.0 mass ppm of a total content of Ag, Sn, and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 .Math.m or more, the pure copper sheet has crystals in which crystal planes parallel to the rolled surface are a {022} plane, a {002} plane, a {113} plane, a {111} plane, and a {133} plane, and diffraction peak intensities of the individual crystal planes that are obtained by X-ray diffraction measurement by a 2θ/θ method on the rolled surface satisfy I {022}/(I {022} + I {002} + I {113} + I {111} + I {133}) ≤ 0.15, I {002}/I {111} ≥ 10.0, and I {002}/I {113} ≥ 15.0.

A metal foil has a cathode surface on which no linear indentations exist when viewed microscopically, a production method for the same, and a processing method for an electrodeposition drum used for the same. A surface of the electrodeposition drum for producing the metal foil is irradiated with a laser to process this surface into a pattern of repeated curved shapes including a plurality of dot-shaped dents or the like. With this, the pattern of repeated curved shapes is formed on the surface of the electrodeposition drum. The electrodeposition drum thus processed is used as a cathode, supply of electricity is provided between the electrodeposition drum and an anode plate that are soaked in an electrolytic solution to electrodeposit metal on the surface of the drum with an electrolytic reaction, and thereafter, the metal is peeled off from the electrodeposition drum, thereby yielding the metal foil. The metal foil thus obtained has a pattern corresponding to the pattern of repeated curved shapes including a plurality of dot-shaped bumps or the like on the cathode surface thereof.

Provided is a carrier-attached metal foil which can suppress the number of foreign matter particles on the surface of a metal layer to enhance circuit formability, and can keep stable releasability even after heating at a high temperature of 240° C. or higher (for example, 260° C.) for a long period of time. The carrier-attached metal foil includes a carrier, a release functional layer provided on the carrier, the release functional layer including a metal oxynitride, and a metal layer provided on the release functional layer.

The laminate includes a multilayer polyimide film having thermoplastic polyimide layers on both sides of a core layer which is a non-thermoplastic polyimide film and a surface layer contacting the thermoplastic polyimide layer on one surface-side of the multilayer polyimide film. The surface layer may be an inorganic layer having a thickness of 1 to 200 nm or a resin layer having a thickness of 0.1 to 5 μm. A single-sided metal-clad laminate is formed by laminating a metal layer on the thermoplastic resin layer on the surface layer non-formed surface of the laminate.

A FPCB/FCCL replacing a tinned-copper welding strip as a photovoltaic module bus bar is a composite material including an insulating base material and a conductive layer, and the insulating base material is made from PI or PET, and the conductive layer is generally the copper foil. According to the present invention, when the flexible solar module adopts the FPCB/FCCL to replace the tinned-copper welding strip as the photovoltaic module bus bar, the product quality and product stability are greatly improved, and the FPCB/FCCL bus bar is also suitable for the double-glass solar module and the single-glass solar module. The copper foil of FPCB/FCCL may be integrated with circuits, or be the complete copper foil (without circuits), or the copper foil of FPCB/FCCL may simultaneously has the part with circuits and the part without circuits.