A heat radiating substrate (10) includes an insulating layer (11) and a circuit pattern (20) of a metal formed on the insulating layer (11) in direct contact with the insulating layer (11), in which a side surface (that is, metal layer side surface (23)) of the circuit pattern (20) has a region in which an angle θ formed by a surface (insulating layer upper surface (11a)) of the insulating layer (11) (insulating substrate) and a tangential line L at a middle portion (X1) in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less.

The present invention is directed to provide novel composite copper components. For example, provided is a composite copper component including a copper oxide-containing layer formed on at least a portion of the surface of a copper component, in which when the surface of the composite copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off from the resin substrate after the thermocompression bonding, metal contained in the copper oxide-containing layer is transferred to the resin substrate.

A resin composition and uses of the same are provided. The resin composition includes the following components: (A) a cross-linking agent of the following formula (I):

##STR00001## (B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and (C) a catalyst, wherein, X in formula (I) is a C.sub.1 to C.sub.10 straight or branched alkylene, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.

A glass carrier-attached copper foil is provided that is suitable for production of a desired circuit mounting board ensuring electric conduction over the entire copper layer, reducing separation of the copper layer at the cut edge even if the copper foil is downsized, and having an intended circuit pattern with a fine pitch. The glass carrier-attached copper foil includes a glass carrier, a release layer provided on the glass carrier, and a copper layer provided on the release layer. The release layer has a function to enable release of the copper layer from the glass carrier. The glass carrier-attached copper foil has a plurality of releasable regions including the release layer and an unreleasable region not including the release layer. The unreleasable region has a pattern defining the releasable regions.

An advanced reverse treated electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced reverse treated electrodeposited copper foil has an uneven micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups, which are in a non-uniform distribution to form a non-uniformly distributed horizontal or vertical stripe pattern.

A method for making a via (3) in a carrier layer (1) made of a ceramic comprising:

providing the carrier layer (1),

realizing a passage recess (2) in the carrier layer (1),

at least partially filling the passage recess (2) with a paste (3), and

performing a bonding process, in particular an active soldering process or a DCB process, for bonding a metallization (5) to the carrier layer (1), the via (3′) being realized from the paste (3) in the passage recess (2) when the bonding process is performed.

A double layered electrolytic copper foil is disclosed. It is possible to freely control various physical properties of the double layered electrolytic copper foil. The double layered electrolytic copper foil contains a first copper layer, a second copper layer, and an interface formed between one surface of the first copper layer and one surface of the second copper layer. A method of manufacturing the double layered electrolytic copper foil is also disclosed.

A copper foil with a release layer is provided that capable of forming a circuit, of such as an embedded trace substrate, by a subtractive method in a simple process. A copper foil with a release layer, containing, in this order, a release layer; a barrier layer having dissolution resistance to a copper etchant; and a copper foil.

Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes a fluorine-containing substrate, a tie layer disposed on the fluorine-containing substrate, and a copper layer disposed on the tie layer, wherein the tie layer may be a metal layer or metal alloy layer including a metal of a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more, and the tie layer may have a thickness of about 10 nm to about 100 nm.

A 3D printed circuit apparatus includes a 3D printed circuit having a surface layer and one or more wires embedded under the surface layer, and a conductive metal pin that is cut to a desired length and inserted into the 3D printed circuit in order to attain contact with the wire or wires embedded under the surface layer.