A method for mounting a printed circuit board for an automotive vehicle on a carrier structure including at least one rivet. The printed circuit board includes at least one mounting aperture that is capable of accommodating the rivet and which defines an electrical conduction zone and at least one mark having a control end up to which the mark extends over the electrical conduction zone. The method includes a step of positioning the printed circuit board on the carrier structure such that the rivet extends through the mounting aperture, a step of riveting the rivet such that its head is at least partly flattened on the electrical conduction zone and a step of determining the conformity of riveting when the head of the rivet covers the control end of the mark.

Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material.

A circuit board that includes a substrate that has an upper surface on which a circuit pattern is formed, and a lower surface to which a plurality of bus bars that are spaced apart are fixed; a placement through hole that extends through the upper surface and the lower surface and faces a bus bar of the plurality of bus bars and in which an electronic component is placed; and a terminal conductor foil that protrudes inward into the placement through hole from the lower surface and to which a terminal of the electronic component is connected.

A plate-shaped multilayer wiring substrate includes at least two resin layers stacked on top of each other and each including an insulating base and a conductive pattern provided on the insulating base, and a front surface layer joined onto the resin layers stacked. The front surface layer has a higher elastic modulus than an elastic modulus of the insulating bases. A joint interface between the resin layers and the front surface layer includes projections and depressions. Also, a method for manufacturing the plate-shaped multilayer wiring substrate includes a step of stacking, on top of resin layers, a front surface layer having a higher elastic modulus than an elastic modulus of the resin layers, and a step of performing pressing under pressure from above the front surface layer by using a flat surface in a heated state to join the resin layers and the front surface layer.

An image pickup apparatus is an image pickup apparatus including: an image pickup device including a plurality of electrode pads provided in a row on an outer peripheral portion of a light-receiving surface on which a light-receiving section is formed, the plurality of electrode pads being connected to the light-receiving section; and a wiring board including a plurality of inner leads connected to respective electrode pads, wherein each of the inner leads includes a distal end portion, a bent portion and a rear end portion, the distal end portion is connected to the corresponding electrode pad, the bent portion includes a first bent portion having a recess shape relative to the light-receiving surface and a second bent portion having a protruding shape relative to the light-receiving surface, and the rear end portion is disposed in parallel with a side face of the image pickup device.

A method for testing a printed circuit board includes providing a printed circuit board having a first main section, a second main section, a bent connecting section and at least one monitoring conductor track. The connecting section is disposed between the first main section and the second main section. The monitoring conductor track runs from the first main section, in a curved manner through the connecting section, to the second main section. At least one electrical measurement value which is representative of the integrity of the at least one monitoring conductor track is detected. A printed circuit board, a control unit and methods for producing the printed circuit board and for operating the control unit are also provided.

Devices, systems, and methods for making and using circuit assemblies having a pattern of deformable conductive material formed therein are disclosed herein. In various aspects, a circuit assembly can include a substrate layer; a first pattern of deformable conductive material formed on a surface of the substrate layer using a removable stencil; and a first stacked layer configured to cover at least a portion of the first pattern of deformable conductive material.

A laminate contains conductive circuit patterns, a substrate material, and an adhesive pattern or other bond. Each conductive circuit pattern and the substrate material are interconnected by the adhesive pattern or other bond, having its size and shape substantially matching the main outlines of each conductive circuit pattern. Each conductive circuit pattern has thin lines and thin interline spaces, patterned on top of the adhesive pattern or other bond by a removal of conductive material, such that the circuit pattern's thin interline spaces may have residues of the adhesive patterns or other bond. Outside the conductive circuit patterns' main outlines, the substrate material is substantially void of an adhesive or other bond, with the exception of edge areas of the main outlines.

A circuit assembly includes a circuit board having an insulating board in which a conductive path is formed on an insulating plate and a plurality of busbars that are bonded to one side of the insulating board, an insulating layer that is printed to the plurality of busbars so as to couple adjacent ones of the plurality of busbars to each other, a heat dissipation member on which the insulating layer is placed and which is configured to dissipate heat conducted from the insulating layer, a fixing member that is configured to fix the circuit board and the heat dissipation member to each other in a state in which the insulating layer is sandwiched between the heat dissipation member and the plurality of busbars.

Provided is a circuit assembly including a heatsink, an insulating sheet that is placed on the heatsink, and a circuit board that is placed on the heatsink via the insulating sheet. The circuit board is fixed to the heatsink by screwing, and a heat conductive member is arranged between insulating sheet and the circuit board.