The present invention discloses an electromagnetic wave shielding film, comprising at least one electromagnetic shielding layer. A printed circuit board comprising the shielding film, is formed by tightly connecting the electromagnetic wave shielding film with the printed circuit board in the direction of thickness, wherein a ground layer is disposed on said printed circuit board. A method for producing the circuit board, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the adhesive film layer by a rough surface of the electromagnetic shielding layer, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the shielding film by an electrically conductive substance, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) forming through holes or blind holes in the circuit board; (3) metallizing the holes, to achieve grounding. The adhesive film layer of the shielding film of the present invention contains no conductive particle, so that the cost and the insertion loss are reduced, and the development demand of high-speed and high-frequency of the electronic products is met.

Provided is a circuit assembly including a heatsink, an insulating sheet that is placed on the heatsink, and a circuit boarder that is placed on the heatsink via the insulating sheet. The circuit board is fixed to the heatsink by screwing, and a heat conductive member is arranged between insulating sheet and the circuit board.

An electronic device may include a housing a housing comprising a first surface and an second surface generally parallel to the first surface, the second surface including an opening extending to the first surface, the first and second surface being spaced apart from one another along an axis; a first conductive member being coupled to the first surface; a second conductive member spaced apart substantially from the first conductive member along the axis; and a conductive dome structure disposed between at least a part of the first conductive member and at least a part of the second conductive member and forming an electric path between the first conductive member and the second conductive member.

A high current switch, in particular for a motor vehicle, having a first bus bar, a second bus bar in addition to a first semi-conductor switch that has a control connection and a first transmission connection as well as a second transmission connection. The first transmission connection is placed in direct contact with the first bus bar and the second transmission connection is placed in direct electric contact with the second bus bar.

An interconnect element 130 can include a dielectric layer 116 having a top face 116b and a bottom face 116a remote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces 132, 134. A plurality of conductive protrusions 112 can extend upwardly from the plane defined by the first metal layer 102 through the dielectric layer 116. The conductive protrusions 112 can have top surfaces 126 at a first height 115 above the first metal layer 132 which may be more than 50% of a height of the dielectric layer. A plurality of conductive vias 128 can extend from the top surfaces 126 of the protrusions 112 to connect the protrusions 112 with the second metal layer.

A high-frequency signal transmission line includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided at the dielectric element assembly, and a first ground conductor provided on a first side in a direction of lamination relative to the signal line and including a plurality of openings arranged along the signal line. The dielectric layer positioned at an end of the first side in the direction of lamination includes an undulating portion provided on a first principal surface located on the first side in the direction of lamination, such that the undulating portion overlaps with the openings when viewed in a plan view in the direction of lamination.

A computer-implemented method of autonomously dispositioning data generated by a wearable article in compliance with multiple application-specific requirements is disclosed herein. The method can include predefining one or more rules by which data generated by a wearable article should be managed, wherein the one or more rules include definition of a triggering event. The method can further include receiving data associated with motions of the wearable article, wherein the data includes information associated with electrical parameters generated by the wearable article that vary with the motions of the wearable article. The method can further include detecting an initiation of the triggering event and managing subsequent data generated by the wearable article, including data associated with varying electrical parameters, in accordance with the predefined one or more rules.