Methods of depositing a film selectively onto a first substrate surface relative to a second substrate surface. Methods include soaking a substrate surface comprising hydroxyl-terminations with a silylamine to form silyl ether-terminations and depositing a film onto a surface other than the silyl ether-terminated surface.

A flexible printed circuit board is proposed. The flexible printed circuit board includes at least one soldering element possessing a soldering face, accessible from a first face of the flexible printed circuit board, and a heating face, accessible from a second face of the flexible printed circuit board. Such a flexible printed circuit board includes a main part including the soldering element, and at least one foldable part, extending from the main part and being configured to pass: from a non-folded state, in which the at least one foldable part does not cover the heating face of the at least one soldering element; to a folded state in which the at least one foldable part covers the heating face of the at least one soldering element.

An electronic device having a circuit board and a battery is disclosed. The circuit board may include a through hole and an electrical pad surrounding the through hole. In order to electrically couple the circuit board to the battery, and in particular, an electrode of the battery, a tab (or plaque) is placed between the electrical pad and the electrode. The tab electrically couples with the electrical pad by a soldering operation. To couple (electrically and mechanically) the tab with the electrode, a welding operation is used. The welding operation may include a laser weld providing thermal energy through a laser beam. In this regard, the laser beam passes through the through hole, thereby (partially) melting the tab and forming a weld between the tab and the electrode. Accordingly, the tab covers the through hole such that the tab is positioned to receive the laser beam.

The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

Provided is a printed circuit board including: a support substrate including a first area in which a light emitting device is mounted, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a through hole passing through the bending part; a connection wiring connected to the light emitting device and disposed on the bending part; and a wiring connected to the connection wiring.

A method of fabricating a substrate core structure comprises: providing first and second patterned conductive layers defining openings therein on each side of a starting insulating layer; providing a first and a second supplemental insulating layers onto respective ones of a first and a second patterned conductive layer; laser drilling a set of via openings extending through at least some of the conductive layer openings of the first and second patterned conductive layers; filling the set of via openings with a conductive material to provide a set of conductive vias; and providing a first and a second supplemental patterned conductive layer onto respective ones of the first and the second supplemental insulating layers, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof, and the second supplemental patterned conductive layer at another side thereof.

A device comprising a single-sided printed circuit board (PCB) having a non-metallized hole, and a connection area (CA) close to the non-metallized hole on a metallized side of the single-sided printed circuit board. The present invention provides a conducting bridge (CP) from the connection area (CA) and at least partially covering the non-metallized hole, for allowing the connection area (CA) to be contacted, e.g. by a probe (P), from a non-metallized side of the single-sided printed circuit board (PCB) through the non-metallized hole.

An example stretchable device is described that includes electrical contacts and an interconnect coupling the electrical contacts. The interconnect has a meander-shaped configuration that includes at least one nested serpentine-shaped feature. The interconnect can be conductive or non-conductive. The meander-shaped configuration can be a serpentine structure, providing a serpentine-in-serpentine configuration.

A printed circuit board is formed from a plurality of thinner PCBs stacked on top of each other with an intermediate metal interconnect material selectively positioned between adjacent PCBs. The metal interconnect material is selectively positioned on surface contact points of correspondingly aligned plated through holes on the adjacent printed circuit boards. The stacked printed circuit boards and intermediate metal interconnect material are laminated, thereby sintering the metal interconnect material and the surface contact points of the plated through holes to form electrical interconnects between plated through holes on adjacent printed circuit boards. The metal interconnect material is preferably the same as the plating material used to plate the through holes, such as copper.

A method of forming an electrical interconnect includes etching a lattice pattern into a contact pad on a circuit substrate as a first connection point, at least partially filling the lattice pattern with a conductive epoxy, contacting the conductive epoxy with a second connection point, and curing the epoxy.