Examples are disclosed related to forming solder joints between printed circuits by using radiant heat. One example provides a method of manufacturing an electronic device, the method comprising aligning a contact of a first printed circuit with a via of a second printed circuit. The method further comprises applying radiant heat via an infrared light source to a second surface of the second printed circuit, the radiant heat incident on the via to cause the via to conduct heat to solder located at an interface of the contact and the via, and after heating the solder to reflow, cooling the solder, thereby forming a solder joint between the contact of the first printed circuit and the via of the second printed circuit.

The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

A cable connection structure includes: a substrate that includes: an opening; and a core wire connection electrode that is arranged on one of a principle surface and an inner layer across the opening; a cable that is arranged on a principle surface side of the substrate and includes a core wire that is electrically connected to the core wire connection electrode, the core wire connection electrode being extended so as to be separated from the substrate, the core wire connection electrode being connected to the core wire.

The invention provides an electronic device that includes a first functional body, a second functional body, and at least one connection member connecting the first functional body to the second functional body. The at least one connection member has a spiral pattern, and is suspended in air to allow tor stretching, flexing or compressing.

An electronic device embedded substrate and a method of manufacturing the same includes a substrate comprising a cavity formed therein, and an electronic device embedded in the cavity. The substrate and method thereof also include a first support pattern part formed on one surface of the substrate and pressing the electronic device to restrict a movement of the electronic device within the cavity, and a second support pattern part formed on another surface of the core substrate facing opposite to the one surface and extended toward an inside of the cavity to support the electronic device.

An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.

The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.

The invention provides a printed circuit board (10) including a first electrically conductive track (210), wherein the printed circuit board (10) comprises a set (15) of two printed circuit board areas (100) both comprising a part of the first electrically conductive track (210), wherein printed circuit board (10) further comprises a perforation line (300) between the two printed circuit board areas (100) for customizing the printed circuit board (10) into two physically separated printed circuit board area comprising parts (1100), wherein the perforation line (300) is configured as a non-straight line, wherein the perforation line (300) comprises relative to one of the printed circuit board areas (100), and in a plane of the printed circuit board (10), a first projecting part (311) and a first recessed part (312), wherein the first recessed part (312) is recessed relative to the first projecting part (311), wherein the first electrically conductive track (210) is intercepted by the perforation line (300) at the first recessed part (312).

An object is to obtain a power conversion device that can suppress the generation of noise due to coupling and achieve the size reduction of a substrate. In a power conversion device, a main circuit wire for connecting main circuit components to form a main circuit includes a first main circuit wire and a second main circuit wire wired so as to be separated from each other on a substrate. A control wire is wired between the first main circuit wire and the second main circuit wire so as to be insulated therefrom, and the first main circuit wire and the second main circuit wire are connected to each other via the main circuit component placed so as to be separated from the control wire in the thickness direction of the substrate.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.