Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

A flexible printed circuit board (FPCB) is disclosed. The FPCB can be employed to connect an interface card having connectors with a two-stage configuration to a connection destination of a portable information equipment. The FPCB includes a bend line located between an upper-stage terminal group and a lower-stage terminal group. The FPCB can be bent along the bend line to allow the upper-stage terminal group and the lower-stage terminal group to be mutually superimposed over each other. In addition, the upper-stage terminal group of the FPCB is connected to the upper-stage-side connector terminal group of the interface card, and the lower-stage terminal group of the FPCB is connected to the lower-stage-side connector terminal group of the interface card.

The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.

In one embodiment, a system includes a ground layer, a first layer, a second layer, and a plurality of vias. The first layer includes a first insulating material and a plurality of first metallic strips. The second layer includes a second insulating material and a plurality of second metallic strips. The plurality of vias electrically connect one or more of the plurality of first metallic strips of the first layer to one or more of the plurality of second metallic strips of the second layer. The plurality of first metallic strips of the first layer and the plurality of second metallic strips of the second layer form a plurality of capacitors and a plurality of conductors. Each capacitor is located in the first layer. Each conductor is partially located in the first layer and partially located in the second layer.

A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

A high-speed serial computer expansion bus circuit topology, comprises: a first signal path connecting between a first interface and a second interface, a second signal path connecting between the first interface and a third interface, a third signal path connecting between the third interface and a fourth interface, a first selector circuit having a first passive element and a second passive element which are respectively disposed in the first signal path and the second signal path, a second selector circuit having a third passive element and a fourth passive element which are respectively disposed in the second signal path and the third signal path. The second signal path is conducted when the first passive element and the second passive element are conducted, the third signal path is conducted when the third passive element and the fourth passive element are conducted.

A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.

A system for power delivery network (“PDN”) isolation may include a multi-layer printed circuit board (“PCB”) in which a power distribution layer has a root conductive region and two or more branch conductive regions fanning out from the root conductive region. Each branch conductive region may be insulated from other branch conductive regions by a non-conductive region. Each branch conductive region may have at least one power delivery connection. Each of various electronic circuits mounted on the PCB and sharing the same PDN may be shorted to one of the branch conductive regions.

A branch coupler includes a first branch, comprising an input end, an isolation end, a first transmission line, a first branch line and a second branch line, the input end is electrically connected to the isolation end through the first transmission line, the first branch line is electrically connected to input end, and second branch line is electrically connected to the isolation end; a second branch, comprising a first output end, a second output end, a second transmission line, a third branch line and a fourth branch line, the first output end and the second output end are connected through second transmission line, the third branch line is connected to the first output end, and the fourth branch line is connected to the second output end; the first branch line is connected to the third branch line, and the second branch line is connected to the fourth branch line.

A wiring substrate includes an insulating base that has a plate surface; a first circuit that is provided on the plate surface; a first terminal that is provided on the plate surface, and to which a mounting member is attached; a second terminal that is provided on the plate surface; a first wiring that connects the first circuit and the first terminal to each other; and a second wiring that connects the first terminal and the second terminal to each other, is electrically connected to the first wiring in the first terminal, and has a parallel section in which the second wiring is disposed close to and parallel to the first wiring without being electrically connected to the first wiring outside the first terminal.