A flip chip interconnection including a circuit board is disclosed. The circuit board includes a substrate, inner leads, a T-shaped circuit line and a dummy pattern. The inner leads, the T-shaped circuit line and the dummy pattern are located on an inner bonding area of the substrate. The T-shaped circuit line includes a main segment, a branch segment and a connection segment that is connected to the main segment and the branch segment. The main segment and the branch segment are extended along a lateral direction and a longitudinal direction, respectively. The dummy pattern is located between the connection segment and the inner leads.

A method of running a printed circuit board (PCB) trace on a PCB. The PCB comprising a plurality of PCB layers. The method comprising forming a conductive trace on at least one of the plurality of PCB layers; coupling a first portion of the conductive trace to a capacitor formed on at least one of the plurality of PCB layers; coupling a second portion, different from the first portion, of the conductive trace to a conductive material formed within a first via extending through two or more of the plurality of PCB layers; and configurably setting a length of a conductive path of the conductive trace according to a predetermined impedance. The capacitor is separated laterally in a plan view at a first distance from the first via. The length of the conductive trace in the plan view is greater than the first distance. The conductive path of the conductive trace of the length has the predetermined impedance.

An electronic substrate connects to a semiconductor component via a plurality of front surface terminals disposed in an array on a front surface and connects to a main substrate via a plurality of back surface terminals disposed in an array on a back surface. The electronic substrate includes: a first wiring that electrically connects the front surface terminals and the back surface terminals in the electronic substrate and is supplied with power supply from the main substrate via the back surface terminals; and a second wiring that electrically connects the front surface terminals and the back surface terminals in the electronic substrate, is supplied with power supply having the same potential as the first wiring from the main substrate via the back surface terminals, and is not electrically connected to the first wiring in the electronic substrate.

A printed circuit board (PCB) may include a signal layer having a functional region and a PCB signal layer testing region. The PCB signal layer testing region may include a first differential pair having a first length formed on the signal layer, a second differential pair having a second length, different than the first length, formed on the signal layer and a third differential pair having a third length, different than the first length and different than the second length, formed on the signal layer.

A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.

A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.

Provided are a transparent conductor and a display device including the same, the transparent conductor including: a substrate layer; and a transparent conductive pattern layer formed on the substrate layer, and the transparent conductive pattern layer includes a plurality of conductive areas and non-conductive areas, the non-conductive areas are formed every between neighboring conductive areas, the non-conductive area in the transparent conductive pattern layer has a deviation as calculated by Equation 1 herein, which has a value larger than about 1 and equal to or smaller than about 1.25, and the non-conductive areas have a minimum line width of 40 μm or less.

In embodiments, an electronic device may include a housing having an inner space, a printed circuit board (PCB) disposed in the inner space of the housing, a first antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a first frequency band, at least one second antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a second frequency band different from the first frequency band, and a flexible substrate electrically connecting the PCB and the first antenna structure. The flexible substrate may include a first connecting portion electrically connected to the PCB, an interconnecting portion extended from the first connecting portion to the first antenna structure, at least one branch portion branched from at least a part of the interconnecting portion, and extended to the at least one second antenna structure, at least one first conductive path disposed in the interconnecting portion, and electrically connecting the first connecting portion and the first antenna structure, and at least one second conductive path disposed in the interconnecting portion and the at least one branch portion, and electrically connecting the first connecting portion and the at least one second antenna structure.

A circuit pattern of a power line and a circuit pattern of a signal line are disposed in a first layer of a laminated circuit board device, a circuit pattern of the signal line to be protected is disposed in a second layer, and a circuit pattern of a power line is disposed in a third layer. The shapes of the first circuit pattern of the power line of the first layer and the second circuit pattern of the power line of the third layer are substantially matched with each other with respect to a portion of the second layer facing the circuit pattern of the signal line. The direction of the current of the first circuit pattern coincides with the direction of the current of the second circuit pattern.

The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.