A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

A signal transmission device including a signal wiring, a wide wiring that is formed continuously with one and the other of the signal wirings and has a wiring width larger than a wiring width of at least the one or the other of the signal wirings, a power wiring to which a signal/power separation filter is connected via a branch wiring branching from the wide wiring, and an open stub wiring that is connected to the branch wiring and has an open tip.

An electronic substrate connects to a semiconductor component via a plurality of front surface terminals disposed in an array on a front surface and connects to a main substrate via a plurality of back surface terminals disposed in an array on a back surface. The electronic substrate includes: a first wiring that electrically connects the front surface terminals and the back surface terminals in the electronic substrate and is supplied with power supply from the main substrate via the back surface terminals; and a second wiring that electrically connects the front surface terminals and the back surface terminals in the electronic substrate, is supplied with power supply having the same potential as the first wiring from the main substrate via the back surface terminals, and is not electrically connected to the first wiring in the electronic substrate.

A circuit pattern of a power line and a circuit pattern of a signal line are disposed in a first layer of a laminated circuit board device, a circuit pattern of the signal line to be protected is disposed in a second layer, and a circuit pattern of a power line is disposed in a third layer. The shapes of the first circuit pattern of the power line of the first layer and the second circuit pattern of the power line of the third layer are substantially matched with each other with respect to a portion of the second layer lacing the circuit pattern of the signal line. The direction of the current of the first circuit pattern coincides with the direction of the current of the second circuit pattern.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to ta second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

Power dividers (or splitters) and power combiners may be implemented using distributed lossy transmission lines that dissipate radio frequency (RF) and other electromagnetic (EM) signal energy. By taking advantage of natural PCB board loss at high operating frequencies, N-way power dividers with matched outputs and good isolation may be implemented without the use of discrete resistors. In one embodiment, a N-way power divider may be at least partially implemented on buried printed circuit board (PCB) layers (e.g., partially embedded) and, in a further embodiment a N-way may be implemented in a manner that is completely internal to the PCB (e.g., completely embedded), without the use of discrete resistors.

A storage device is provided. The storage device includes nonvolatile memory devices provided on a printed circuit board (PCB), a connector, a storage controller and at least one first passive filter. The connector is provided in the PCB and includes connection terminals. The storage controller is provided on the PCB, communicates with an external host through the connection terminals and controls the nonvolatile memory devices. The at least one first passive filter is provided in the PCB, is connected between the connector and the storage controller, and performs an equalization on either a signal provided to the storage controller or a signal provided from the storage controller.

The disclosure relates to a power supply module. The power supply module may include a flexible substrate and a plurality of battery cells distributed in an array on one side of the flexible substrate. Adjacent battery cells of the plurality of battery cells on each line in a first direction may be connected in series by a flexible connector to form a plurality of lines of battery cells, and the plurality of lines of battery cells may be connected in parallel through a first electrode.

A method may include receiving a first and a second complementary signal to provide differential signaling. The method may further include providing a first conductor trace to transport the first complementary signal; providing a second conductor trace to transport the second complementary signal, the second conductor trace immediately adjacent to the first conductor trace; providing a third conductor trace to transport the first complementary signal, the third conductor trace immediately adjacent to the second conductor trace; and providing a fourth conductor trace to transport the second complementary signal, the fourth conductor trace immediately adjacent to the third conductor trace.

An interconnection system is described including a first printed circuit board, the first printed circuit board including a first portion of a filter, the filter used to communicate a signal between the first printed circuit board and a second printed circuit board, and a mechanical structure for coupling the signal between the first printed circuit board and the second printed circuit board, the second printed circuit board being oriented at an angle with respect to the first printed circuit board.