Provided is an electronic apparatus capable of improving time margin. The electronic apparatus includes: a base substrate including a substrate base including a plurality of layers and a plurality of wiring layers between the layers; a controller chip and at least one memory semiconductor chip mounted on the base substrate; a signal line disposed in one of the wiring layers and connecting the controller chip to the at least one memory semiconductor chip; and a pair of open stubs disposed in another wiring layer, connected to both ends of the signal line, and extending to face each other with a gap.

A PCBA for use in a high-energy broadband electric field includes a low-voltage power supply and alternating conductive and dielectric layers. An outermost one of the conductive layers includes a dielectric surface switch having closely-spaced switch contacts. The first switch contact is connected to the positive terminal and the second switch contact is connected to the negative terminal. Vias connect the conductive layers to the terminals through the respective first and second switch contacts to form power and ground planes. A metamaterial layer of nickel is doped with up to 20 percent phosphorus or chromium by weight, has a uniform thickness of less than 5 m, is sandwiched between interfacing surfaces of a pair of the conductive and dielectric layers, and evenly coats one of the interfacing surfaces. A sonobuoy system includes the PCBA, e.g., an Electronic Function Select board, a cylindrical housing, and an acoustic array.

The present invention relates generally to electric circuit testing, building, or implementing using a breadboard-style printed circuit board (PCB). Aspects of the present invention include eliminating the need to use hookup wires when building and testing electric circuits on PCBs. In one or more embodiments, a PCB system having rows and columns of signal tie points connected in a breadboard layout and using an embedded wire and a solder bridge to form partial connections between signal tie points may be built. In one or more embodiments, an embedded wire and solder bridge is capable of connecting a column of signal tie points, and/or an embedded wire and solder bridge is capable of connecting a power rail to a signal tie point. Thus, a circuit may be implemented and tested by applying a small amount of solder to the solder bridge without the need for hookup wire.

A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

An extensible electroconductive wiring material includes a flexible electroconductive material and insulating elastic bodies and, wherein the flexible electroconductive material having an electroconductive layer has vent peripheral edge portions in which vent holes and/or vent slits are penetrated and aligned in series and/or in parallel along an energization direction of the electroconductive layer while the vent peripheral edge portions are energizably linked, and the vent peripheral edge portions is sealed and covered by the insulating elastic bodies, so as not to be exposed; and the insulating elastic bodies, have penetration slits, and/or penetration holes which penetrate therethrough while matching the vent peripheral edge portions and are smaller than the vent holes and the vent slits. The extensible electroconductive wiring module has a plurality of these extensible electroconductive wiring materials.

A printed circuit board includes a printed wiring board, and a first element and a second element mounted on the printed wiring board. The printed wiring board includes a plurality of first signal lines and a plurality of second signal lines. The plurality of first signal lines each include a first main line, a first branch line, and a second branch line. The plurality of second signal lines each include a second main line, a third branch line, and a fourth branch line. The first branch line includes a first conductor pattern disposed in a first conductor layer. The second branch line includes a second conductor pattern disposed in the first conductor layer. The third branch line includes a third conductor pattern disposed in a second conductor layer. The fourth branch line includes a fourth conductor pattern disposed in the second conductor layer.

A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.

A printed circuit board may include a controller socket, first and second sockets provided on a top surface, third and fourth sockets provided on a bottom surface, and first, second, and third branching points. The first branching point may be spaced apart from the controller socket by a first distance in a horizontal direction parallel to the top surface and may be electrically connected to the controller socket. The second branching point may be spaced apart from the first branching point by a second distance longer than the first distance and may be electrically connected to the first branching point, the first and third sockets. The third branching point may be spaced apart from the first branching point by a third distance longer than the first distance and may be electrically connected to the first branching point, the second and fourth sockets.

A printed wiring board of the present disclosure that includes a power supply layer and a ground layer. A power supply layer pattern formed in the power supply layer includes a power supply layer electrode and a branch that is a direct-current power feeding path connecting adjacent electromagnetic band gap (EBG) unit cells. A capacitive coupling element including a capacitive coupling element body is disposed to oppose the power supply layer electrode with an interlayer provided therebetween.

A wiring substrate includes an insulating base that has a plate surface; a first circuit that is provided on the plate surface; a first terminal that is provided on the plate surface, and to which a mounting member is attached; a second terminal that is provided on the plate surface; a first wiring that connects the first circuit and the first terminal to each other; and a second wiring that connects the first terminal and the second terminal to each other, is electrically connected to the first wiring in the first terminal, and has a parallel section in which the second wiring is disposed close to and parallel to the first wiring without being electrically connected to the first wiring outside the first terminal.