H05K2201/09263

SYSTEM FOR DETECTING ACCESS TO A PRE-DEFINED AREA ON A PRINTED CIRCUIT BOARD
20220330422 · 2022-10-13 ·

The present invention provides a system for detecting access to a pre-defined area on a Printed Circuit Board, wherein the system comprises: the Printed Circuit Board comprising, on at least one of its external surfaces, at least one pre-defined area comprising electrical components, a potting material arranged over at least the pre-defined area, wherein the potting material comprises a first layer of transparent material configured to allow light to pass through, and a second layer of opaque material arranged so that completely blocks light towards the first layer, wherein the first layer is arranged between the Printed Circuit Board and the second layer and extends at least over the pre-defined area, and at least one photo-sensor arranged within the first layer of transparent material and configured to generate a tamper signal upon detection of light in the first layer.

Printed Circuits with Embedded Resistive Thermal Devices
20220326746 · 2022-10-13 ·

An electronic device may include a printed circuit with a surface-mounted component. The component may produce resistive heating within the printed circuit. Resistive thermal devices (RTDs) may be embedded within the printed circuit. An RTD may at least partially overlap the electrical component. The RTD may include contact pads on a flexible substrate and a meandering conductive trace between the contact pads. The trace may have a resistance varying linearly as a function of temperature. A data acquisition system (DAQ) may measure the resistance of the RTD. Control circuitry may identify the temperature of the printed circuit based on the resistance of the RTD measured by the DAQ and may reduce power consumption by the component when the temperature exceeds a threshold. This may serve to prevent overheating in the printed circuit over time, thereby maximizing the operating life of the printed circuit.

Tamper detection based on removal of fastener from recess
11663368 · 2023-05-30 · ·

A point of sale (POS) device includes a flexible member with two exposed conductive areas that are part of a tamper detection circuit. While a recess receives a screw, the screw passes through apertures in the flexible member and in a conductive gasket, and the conductive gasket connects the two exposed conductive areas to one another, closing the tamper detection circuit. Adhesives affix the flexible member to the screw and the conductive gasket to the recess opening so that removing the screw from the recess separates the conductive gasket from the two exposed conductive areas, opening the tamper detection circuit.

ZIGZAG WIRED MEMORY MODULE
20230061451 · 2023-03-02 ·

A memory module includes a printed circuit board (PCB) including a multi-layer having a wiring structure formed therein. A length of the PCB in a first direction is longer than a length of the PCB in a second direction perpendicular to the first direction. A plurality of memory chips includes a plurality of solder balls. The plurality of memory chips is arranged in a first row and a second row respectively extending in the first direction on the PCB. The plurality of solder balls is continuously arranged in the first direction. The wiring structure alternately zigzag-connects the plurality of memory chips arranged in the first row and the second row.

FLEXIBLE THIN SHEET-SHAPED ELECTRIC WIRE AND BUS-BAR MODULE
20230113159 · 2023-04-13 · ·

A flexible thin sheet-shaped electric wire includes: a body part having electrical insulation; and a conductor part that is arranged in the body part. Further, the conductor part includes a conductor body, and a fuse part that is formed in a part of the conductor body and of which a cross-sectional area is smaller than a cross-sectional area of the conductor body. Still further, the body part includes a conductor region in which the conductor body is arranged and a fuse region in which the fuse part is arranged. The fuse part includes an enclosing part that is arranged to enclose the entire circumference of at least a part of the fuse region.

PHASE HETEROGENEOUS INTERCONNECTS FOR CROSSTALK REDUCTION

Methods and apparatus relating to phase heterogeneous interconnects for crosstalk reduction are described. In one embodiment, an interconnect includes a plurality of links. A first set of links from the plurality of links communicates signals and a second set of links from the plurality of links provides a return path. The interconnect also includes one or more links from the first set of links that include one or more structures with a larger diameter than a minimum diameter of the one or more links. The larger diameter modifies an inductance or capacitance of the one or more links to provide a heterogenous phase delay amongst the plurality of links. Other embodiments are also claimed and disclosed.

Stretchable conductive substrate

A stretchable conductive substrate includes a substrate and a circuit layer. The substrate has a plurality of predetermined areas. The circuit layer is formed on the substrate and defines a conductive contact group and at least one elastic wire structure connected to the conductive contact group in each of the predetermined areas. The at least one elastic wire structure has at least one patterned wire segment and a stretch rate thereof along a length direction of the substrate is from 0% to 60%.

FLEXIBLE HEATER AND ELECTRONICS

A heater for an aerosol-generating device is provided, the heater including: a flexible electrically insulating substrate including a first portion, a second portion, and a fourth portion, in which the flexible electrically insulating substrate is rolled into a tube; control electronics disposed on the first portion of the flexible electrically insulating substrate; a heating element including an induction coil and being disposed on the second portion of the flexible electrically insulating substrate; and a susceptor element arranged on the fourth portion of the flexible electrically insulating substrate. An aerosol-generating device is also provided, including a cavity to receive an aerosol-generating article including an aerosol-forming substrate, and the heater. A system is also provided, including the aerosol-generating device and the aerosol-generating article including the aerosol-forming substrate.

Composite part with integral electronic instrumentation circuit and its manufacturing method
11639916 · 2023-05-02 · ·

A composite part (sandwich or monolithic), including a rigid outer surface, to which is integrated an electronic instrumentation circuit, the electronic instrumentation circuit including a piezoelectric transducer, connected to a coil, an electronic control circuit, connected to a coil positioned facing the coil. The coil is printed on an insulating layer, printed directly on the rigid outer surface, the coil is printed on an insulating layer, covering the coil and the transducer, conducting tracks are printed on an insulating layer printed on at least one portion of the coil to be connected to it, the electronic control circuit being attached to the rigid outer surface and being connected to the tracks.

Fabric-covered electronic device

An electronic device such as a voice-controlled speaker device may have a housing characterized by a vertical longitudinal axis. A flexible substrate such as a flexible mesh substrate with component support regions coupled by flexible segments may be wrapped around the housing and the vertical axis. The housing may have surface regions with compound curvature. The flexible substrate may conform to the regions with compound curvature. A fabric spacer layer may be interposed between the flexible substrate and the housing. Electrical components such as input-output devices may be mounted to the component support regions. A display may be formed from an array of light-emitting devices that are mounted on respective component support regions. Light from the light-emitting devices may pass through the fabric spacer layer toward the housing and back out away from the housing. An outer fabric layer may cover the mesh.