A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer. The plurality of electronic devices are disposed on the plurality of circuit boards, and each is electrically connected to a corresponding one of the plurality of circuit boards.

A printed circuit board according to various embodiments of the present disclosure can include a first substrate layer, a dielectric layer stacked below the first substrate layer, and a second substrate layer stacked below the dielectric layer. The second substrate layer can include: a power line; a ground part disposed to have an isolated area along the power line; and a ground line which extends from the ground part so as to be disposed in the isolated area, and which separates the isolated area into a first area and a second area so as to generate electromagnetic waves for canceling the electromagnetic waves generated by a current flowing through the power line. Other embodiments are also possible.

A wiring board includes an insulating substrate, at least one external electrode disposed on a first surface of the insulating substrate, and wiring that is disposed in the insulating substrate and that is electrically connected to the at least one external electrode. The wiring includes a portion where an extension direction of the wiring is inclined relative to the first surface of the insulating substrate.

A circuit board structure and a layout structure thereof are proposed. The layout structure includes at least one signal transmission line, at least one bonding pad, and at least one impedance adjusting wire. The signal transmission line, the bonding pad, and the impedance adjusting wire are disposed on a first circuit board. The impedance adjusting wire is electrically connected between the signal transmission line and the bonding pad. The impedance adjusting wire is disposed along a periphery of the bonding pad, and at least partially surrounds the bonding pad.

A heat-dissipating substrate structure with built-in conductive circuits is provided. The heat-dissipating substrate structure includes an electrically insulating layer, a first metal layer, a second metal layer, and a heat-dissipating layer. The first metal layer and the second metal layer are disposed on the heat-dissipating layer at an interval. The electrically insulating layer encloses and is in contact with side walls of the first metal layer and side walls of the second metal layer, such that a top wall of the first metal layer and a top wall of the second metal layer are exposed from the electrically insulating layer, and at least one of the conductive circuits extends through at least one of the side wall of the first metal layer and the side wall of the second metal layer and is embedded in the electrically insulating layer.

A printed circuit board for an information handling system includes a trace, a routing component, and one or more intermediate components. The trace has a first impedance, and the routing component has a second impedance. The intermediate components have respective intermediate impedances. Each of the intermediate impedances has a corresponding value in a range between a value of the first impedance and a value of the second impedance. The one or more intermediate impedances reduce an impedance discontinuity between the trace and the routing component.

A power supply circuit board includes a substrate, a first line that is provided on a first main surface of the substrate and that has a land, a second line that is provided on the first main surface of the substrate and that has a land, an inductor that is connected to the land of the first line and the land of the second line and that is made of a ferrite material, and an open stub that is connected to at least one of the first line and the second line.

A flexible substrate includes a plurality of unit wiring structures and an insulation sheet on which the plurality of unit wiring structures are disposed. Each of the plurality of unit wiring structures includes a central section and a plurality of strips disposed at an outer side of the central section. Each of the plurality of strips has a first end and a second end, and is curved along an outer periphery of at least part of the central section, the first end connected to the central section. The plurality of strips in each of the plurality of unit wiring structures curve in a clockwise or a counterclockwise manner with the central section as a center of rotation. The plurality of unit wiring structures include at least four unit wiring structures arranged in a two-dimensional manner.

A device includes a substrate with an excitation coil configured to generate a magnetic field in reaction to an input signal fed in, and with a pickup coil arrangement configured to generate an output signal in reaction to a magnetic field. The excitation coil includes one or more turns arranged around the pickup coil arrangement in a ring-shaped manner in a plan view of the substrate plane. The device further includes a chip package comprising at least one electrical connection connected to the pickup coil arrangement by means of a signal-carrying conductor. In accordance with the concept described herein, the chip package is positioned on the substrate in such a way that the signal-carrying conductor and the one or more turns of the excitation coil do not overlap in a plan view of the substrate plane.

A flexible display panel and a display device are provided. The flexible display panel includes a bent portion. The bent portion includes a substrate layer group and a conductive wire group. The conductive wire group is located on the substrate layer group. The conductive wire group includes a plurality of conductive wires in a curved shape. At least two of the plurality of conductive wires cross and surround at least one closed region. The at least one closed region is provided at least corresponding to a bent region of the bent portion.