A liquid crystal apparatus includes a first wiring substrate on which a first driving IC is mounted, a second wiring substrate disposed to overlap the first wiring substrate, a first terminal group electrically connected to the first wiring substrate and including a terminal electrically connected to the first driving IC, a second terminal group electrically connected to the second wiring substrate and including another terminal electrically connected to the terminal, and a monitoring pad provided on the second wiring substrate and electrically connected to the other terminal.

A printed circuit board according to various embodiments of the present disclosure can include a first substrate layer, a dielectric layer stacked below the first substrate layer, and a second substrate layer stacked below the dielectric layer. The second substrate layer can include: a power line; a ground part disposed to have an isolated area along the power line; and a ground line which extends from the ground part so as to be disposed in the isolated area, and which separates the isolated area into a first area and a second area so as to generate electromagnetic waves for canceling the electromagnetic waves generated by a current flowing through the power line. Other embodiments are also possible.

Disclosed is an electrode-wiring-equipped cloth material including: a cloth material main body; an electrode section which is provided on a surface of or inside the cloth material main body and contains a conductive linear body; a wiring section which is provided adjacent to the electrode section on the surface of or inside the cloth material main body and contains a conductive linear body, in which cloth material at least one conductive linear body contained in the electrode section and at least on conductive linear body contained in the wiring section are the same single conductive linear body.

A metal trace is provided to include a plurality of metal traces disposed side by side on a bending region, and each of the metal traces includes a trace body, and the trace body is provided with a plurality of through holes, and the plurality of through holes are used to reduce bending stress received by the metal traces, and the plurality of through holes are spaced apart along an extending direction of the trace body. The plurality of through holes are disposed on the trace body to reduce bending stress on the metal traces.

An inductor includes: a substrate; a first wiring line located on the substrate; a second wiring line located above the first wiring line and spaced from the first wiring line through an air gap, at least a part of the second wiring line overlapping with at least a part of the first wiring line in plan view; a first supporting post connecting ends of the first and second wiring lines such that a direct current conducts between the first and second wiring lines through the first supporting post; and a second supporting post provided such that the second supporting post overlaps with the second wiring line in plan view, and overlaps with the first wiring line in plan view or is surrounded by the first wiring line in plan view, the second supporting post being insulated from the first wiring line, the second supporting post supporting the second wiring line.

A metal trace is provided to include a plurality of metal traces disposed side by side on a bending region, and each of the metal traces includes a trace body, and the trace body is provided with a plurality of through holes, and the plurality of through holes are used to reduce bending stress received by the metal traces, and the plurality of through holes are spaced apart along an extending direction of the trace body. The plurality of through holes are disposed on the trace body to reduce bending stress on the metal traces.

A wiring board comprising an insulation substrate comprising a main surface and a penetrating portion that has an insulation property; and an external connection conductor, a portion of which is positioned in the insulation substrate and a different portion of which is exposed at the main surface, wherein the penetrating portion penetrates into the external connection conductor.

A high power radiofrequency (RF) capacitor, integrated circuit board/capacitor and methods for manufacture therefor can include a dielectric substrate, and a first metallic layer and a second metallic layer that can be deposited on opposite sides of the dielectric substrate, and a ground plane that can be co-planar with one of the metallic layers. This can establish a broadside coupling capacitance effect between the first metallic layer and the second metallic layer. The first metallic layer and the second metallic layer can have a circular profile when viewed in plan view; alternatively, the first metallic layer and second metallic layer can have a T-shaped profile when viewed in plan view. The desired profile and the desired profile geometry can depend on the design power and operating frequency for the capacitor can depend on whether the capacitor must operate as a series capacitor or a shunt capacitor.

A flexible substrate includes a plurality of unit wiring structures and an insulation sheet on which the plurality of unit wiring structures are disposed. Each of the plurality of unit wiring structures includes a central section and a plurality of strips disposed at an outer side of the central section. Each of the plurality of strips has a first end and a second end, and is curved along an outer periphery of at least part of the central section, the first end connected to the central section. The plurality of strips in each of the plurality of unit wiring structures curve in a clockwise or a counterclockwise manner with the central section as a center of rotation. The plurality of unit wiring structures include at least four unit wiring structures arranged in a two-dimensional manner.

A flexible display panel, a display device and a manufacturing thereof are disclosed. Hollow patterns are arranged in the lead wires in the bent region of the flexible display panel between the display region and the binding region. The hollow patterns can dissipate the stress accumulated on the lead wires during the bending and help the lead wires to release the stress when they are bent, thereby preventing breakage of the lead wires and improving the quality and reliability of the flexible display panel.