A method of using a hand-made circuit board for learning includes: providing a hand-made circuit board which comprises a substrate; and a medium layer disposed on a surface of the substrate to form a pattern, wherein the medium layer has a notably paintable non-conductive zone configured with a plurality of electrical blocks, and the electrical blocks are discontinuously distributed in the notably paintable non-conductive zone, so that the electrical blocks on at least one cross-section of the notably paintable non-conductive zone are not electrically connected; and drawing a drawn conductive layer on the notably paintable non-conductive zone of the pattern by an end user, wherein the drawn conductive layer has conductive particles linking the electrical particle blocks in the notably paintable non-conductive zone, thereby electrically connecting the electrical particle blocks to complete a circuit line.

A differential trace pair system includes a board including a board structure having a first, a second, a third, and a fourth board structure member, wherein a distance between the first and the third board structure members is longer than a distance between the second and the fourth board structure members. The differential trace pair system further includes a differential trace pair that includes a first differential trace extending between the first and the third board structure members and a second differential trace extending between the second and the fourth board structure members. The second differential trace having a serpentine structure that includes a first portion that continuously transitions away from the first differential trace and a second portion that is contiguous with the first portion, the second portion continuously transitions towards the first differential trace.

A high-frequency device includes: a circuit substrate including dielectric layers that are stacked, wiring patterns located on at least one of the dielectric layers, and a passive element formed of at least one of the wiring patterns, the circuit substrate having a first surface that is a surface of an outermost dielectric layer in a stacking direction of the dielectric layers; a terminal for connecting the high-frequency device to an external circuit, the terminal being located on the first surface and electrically connected to the passive element through a first path in the circuit substrate; and an acoustic wave element located on the first surface and electrically connected to the passive element through a second path in the circuit substrate.

A flexible display panel, a display device and a manufacturing thereof are disclosed. Hollow patterns are arranged in the lead wires in the bent region of the flexible display panel between the display region and the binding region. The hollow patterns can dissipate the stress accumulated on the lead wires during the bending and help the lead wires to release the stress when they are bent, thereby preventing breakage of the lead wires and improving the quality and reliability of the flexible display panel.

A contaminant detector is capable of sending a signal or alert when a contaminant is detected within a housing of a utility meter, a meter transmission unit (MTU), or other associated equipment. Circuitry enclosed within the housing is capable of detecting utility usage, transmitting information between one or more utility meters and a utility provider, and/or otherwise monitoring or tracking utility usage. The contaminant detector includes a resistive voltage divider network having a resistance that varies when in contact with a contaminant such as a form of water or metal. The variable resistor has a serpentine structure comprising a plurality of detective fingers that are formed from conductive material and separated by a non-conductive substance.

In one or more embodiments, a circuit board may include a trace pair and a serpentine region of the trace pair, which may include: a first subregion in which the first trace includes a first portion that has a third width and a first length and in which the second trace includes a second portion, at least substantially parallel to the first portion, that has a fourth width, greater than the second width, and a second length; and a second subregion, adjacent to the first subregion, in which the first trace includes a third portion that has the third width and a third length and in which the second trace includes a third portion that has the fourth width and a third length, different from the second length.

An electronic device, and methods of manufacturing the same are disclosed. The method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an integrated circuit or a discrete electrical component on a second substrate, forming electrical connectors on input and/or output terminals of the integrated circuit or discrete electrical component, forming a second metal layer on the first metal layer, the second metal layer improving adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the integrated circuit or discrete electrical component, and electrically connecting the electrical connectors to the second metal layer.

An inductor includes: a substrate; a first wiring line located on the substrate; a second wiring line located above the first wiring line and spaced from the first wiring line through an air gap, at least a part of the second wiring line overlapping with at least a part of the first wiring line in plan view; a first supporting post connecting ends of the first and second wiring lines such that a direct current conducts between the first and second wiring lines through the first supporting post; and a second supporting post provided such that the second supporting post overlaps with the second wiring line in plan view, and overlaps with the first wiring line in plan view or is surrounded by the first wiring line in plan view, the second supporting post being insulated from the first wiring line, the second supporting post supporting the second wiring line.

A noise suppression circuit device includes a baseboard, a decoupling capacitor set, a power bus structure, a band-stop filter unit and an electromagnetic band-gap structure. The decoupling capacitor set is disposed on the baseboard for isolating noise of a first frequency band. The power bus structure is disposed on the baseboard for isolating noise of a second frequency band. The band-stop filter unit is disposed on the baseboard for isolating at least a portion of noise of a third frequency band. The electromagnetic band-gap structure is disposed on the baseboard for isolating noise of a fourth frequency band.

A high pass filter includes: an input-impedance-matching taper transition metal layer having an IMT input end and an IMT output end, the IMT input end having an IMT input end width, the IMT output end having an IMT output end width that is wider than the IMT input end width; a substrate integrated waveguide having a SIW input end and a SIW output end; and an output-impedance-matching taper transition metal layer having an OMT input end and an OMT output end, the OMT input end having an OMT input end width, the OMT output end having an OMT output end width that is wider than the OMT input end width. The substrate integrated waveguide is arranged such that the IMT output end is electrically connected to the SIW input end and such that the OMT input end is electrically connected to the SIW output end.